Mram device with octagon profile
US-2024135978-A1 · Apr 25, 2024 · US
US2016268501A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016268501-A1 |
| Application number | US-201514848275-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 8, 2015 |
| Priority date | Mar 12, 2015 |
| Publication date | Sep 15, 2016 |
| Grant date | — |
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According to one embodiment, a magnetic memory device includes a magnetoresistive effect element including a first magnetic layer in which a first layer containing Co, Fe and B and a second layer containing Co, Fe and a predetermined element selected from Tb, Dy and Gd are stacked, a second magnetic layer, and a nonmagnetic layer between the first magnetic layer and the second magnetic layer. The magnetoresistive effect element is set to low-resistance and high-resistance states by applying first and second voltages respectively to allow current to flow from the first magnetic layer to the second magnetic layer, and one of the low-resistance and high-resistance states is read by applying a third voltage to allow current to flow from the second magnetic layer to the first magnetic layer.
Opening claim text (preview).
What is claimed is: 1 . A magnetic memory device comprising a magnetoresistive effect element comprising a first magnetic layer in which a first layer containing Co, Fe and B and a second layer containing Co, Fe and a predetermined element selected from Tb, Dy and Gd are stacked; a second magnetic layer; and a nonmagnetic layer between the first magnetic layer and the second magnetic layer, the first layer being located between the second layer and the nonmagnetic layer, wherein the magnetoresistive effect element is set to a low-resistance state by applying a first voltage to the magnetoresistive effect element to allow current to flow from the first magnetic layer to the second magnetic layer, the magnetoresistive effect element is set to a high-resistance state having a resistance higher than that of the low-resistance state by applying a second voltage lower than the first voltage to the magnetoresistive effect element to allow current to flow from the first magnetic layer to the second magnetic layer, and one of the low-resistance state and the high-resistance state is read from the magnetoresistive effect element by applying a third voltage to the magnetoresistive effect element to allow current to flow from the second magnetic layer to the first magnetic layer. 2 . The device of claim 1 , wherein the third voltage is greater than or equal to the second voltage. 3 . The device of claim 1 , wherein the predetermined element is Tb, and a ratio of Tb contained in the second layer is 27 atomic % or more. 4 . The device of claim 1 , wherein the second magnetic layer contains Co, Fe, and B. 5 . The device of claim 1 , wherein the nonmagnetic layer contains Mg and O. 6 . The device of claim 1 , wherein the first magnetic layer further comprises a third layer provided on the second layer and formed of Ru, and a fourth layer provided on the third layer and formed of CoPt, and a magnetization direction of the second layer and a magnetization direction of the fourth layer are parallel to each other. 7 . The device of claim 1 , wherein the second magnetic layer includes a lower layer part containing Fe and B, an upper layer part between the nonmagnetic layer and the lower layer part and containing Fe and B, and a middle layer part between the lower layer part and the upper layer part and containing Mg, Fe and O. 8 . The device of claim 7 , wherein a thermal stability factor Δ 1 of the lower layer part is smaller than a thermal stability factor Δ 2 of the upper layer part. 9 . The device of claim 7 , wherein a B concentration of the lower layer part is higher than a B concentration of the upper layer part. 10 . The device of claim 7 , wherein an Fe concentration of the lower layer part is lower than an Fe concentration of the upper layer part. 11 . The device of claim 7 , wherein a thickness of the lower layer part is greater than a thickness of the upper layer part. 12 . The device of claim 7 , wherein the middle layer part is a stacked layer of an AIN layer and an MgFeO layer. 13 . The device of claim 1 , wherein the second magnetic layer contains at least one element selected from Au, Pd, Pt, Rh and Ru. 14 . The device of claim 1 , further comprising shift magnetic field adjustment layer in which a magnetic member is attached to one surface of a memory device, and a ratio of Tb contained in the second layer is 35 atomic % or more. 15 . A magnetic memory device comprising a magnetoresistive effect element comprising a first magnetic layer; a second magnetic layer; and a nonmagnetic layer between the first magnetic layer and the second magnetic layer, wherein the second magnetic layer includes a lower layer part containing Fe and B, an upper layer part between the nonmagnetic layer and the lower layer part and containing Fe and B, and a middle layer part between the lower layer part and the upper layer part and containing Mg, Fe and O, the magnetoresistive effect element is set to a low-resistance state by applying a first voltage to the magnetoresistive effect element to allow current to flow from the first magnetic layer to the second magnetic layer, the magnetoresistive effect element is set to a high-resistance state having a resistance higher than that of the low-resistance state by applying a second voltage lower than the first voltage to the magnetoresistive effect element to allow current to flow from the first magnetic layer to the second magnetic layer, and one of the low-resistance state and the high-resistance state is read from the magnetoresistive effect element by applying a third voltage to the magnetoresistive effect element to allow current to flow from the second magnetic layer to the first magnetic layer. 16 . A magnetic memory device comprising a magnetoresistive effect element comprising a first magnetic layer in which a first layer containing Co, Fe and B and a second layer containing Co, Fe and a predetermined element selected from Tb, Dy and Gd are stacked; a second magnetic layer; and a nonmagnetic layer between the first magnetic layer and the second magnetic layer, the first layer being located between the second layer and the nonmagnetic layer, wherein the second magnetic layer includes a lower layer part containing Fe and B, an upper layer part between the nonmagnetic layer and the lower layer part and containing Fe and B, and a middle layer part between the lower layer part and the upper layer part and containing Mg, Fe and O. 17 . The device of claim 16 , wherein the predetermined element is Tb, and a ratio of Tb contained in the second layer is 27 atomic % or more. 18 . The device of claim 16 , wherein a thermal stability factor Δ 1 of the lower layer part is smaller than a thermal stability factor Δ 2 of the upper layer part. 19 . The device of claim 16 , wherein the second magnetic layer contains at least one element selected from Au, Pd, Pt, Rh and Ru. 20 . A magnetic memory device comprising a magnetoresistive effect element comprising a first magnetic layer in which a first layer containing Co, Fe and B and a second layer containing Co, Fe and a predetermined element selected from Tb, Dy and Gd are stacked; a second magnetic layer; and a nonmagnetic layer between the first magnetic layer and the second magnetic layer, the first layer being located between the second layer and the nonmagnetic layer, wherein the magnetoresistive effect element is set to a low-resistance state by applying a first current to the magnetoresistive effect element to allow current to flow from the first magnetic layer to the second magnetic layer, the magnetoresistive effect element is set to a high-resistance state having a resistance higher than that of the low-resistance state by applying a second current lower than the first current to the magnetoresistive effect element to allow current to flow from the first magnetic layer to the second magnetic layer, and one of the low-resistance state and the high-resistance state is read from the magnetoresistive effect element by applying a third current to the magnetoresistive effect element to allow current to flow from the second magnetic layer to the first magnetic layer. 21 . A magnetic memory device comprising a magnetoresistive effect element comprising a first magnetic layer; a second magnetic layer; and a nonmagnetic layer between the first magnetic layer and the second magnetic layer, wherein the second magnetic layer includes a lower layer part c
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