Semiconductor device and method of manufacturing the same
US-9224850-B2 · Dec 29, 2015 · US
US2016268401A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016268401-A1 |
| Application number | US-201315036058-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 26, 2013 |
| Priority date | Dec 26, 2013 |
| Publication date | Sep 15, 2016 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Described is an apparatus forming complementary tunneling field effect transistors (TFETs) using oxide and/or organic semiconductor material. One type of TFET comprises: a substrate; a doped first region, formed above the substrate, having p-type material selected from a group consisting of Group III-V, IV-IV, and IV of a periodic table; a doped second region, formed above the substrate, having transparent oxide n-type semiconductor material; and a gate stack coupled to the doped first and second regions. Another type of TFET comprises: a substrate; a doped first region, formed above the substrate, having p-type organic semiconductor material; a doped second region, formed above the substrate, having n-type oxide semiconductor material; and a gate stack coupled to the doped source and drain regions. In another example, TFET is made using organic only semiconductor materials for active regions.
Opening claim text (preview).
1 . A tunneling field effect transistor (TFET), comprising: a substrate; a doped first region, disposed above the substrate, having p-type material selected from a group consisting of Group III-V, IV-IV, and IV of a periodic table; a doped second region, disposed above the substrate, having transparent or semi-transparent oxide n-type semiconductor material; and a gate stack coupled to the doped first and second regions. 2 . The TFET of claim 1 , wherein the transparent or semi-transparent oxide n-type semiconductor material is selected from a group consisting of α-Ga 2 —O 3 , β-Ga 2 —O 3 , In 2 O 3 , and SnO 2 . 3 . The TFET of claim 1 , wherein the TFET is a FinFET, Tri-Gate, or square nano-wire based device. 4 . The TFET of claim 1 further comprises a lightly doped n-type material coupled to the gate stack, the lightly doped n-type material separating the first and second doped regions from one another. 5 . The TFET of claim 1 further comprises a lightly doped p-type material coupled to the gate stack, the lightly doped p-type material separating the first and second doped regions from one another. 6 . The TFET of claim 1 , wherein the doped first region is a source region, and wherein the doped second region is a drain region. 7 . A tunneling field effect transistor (TFET), comprising: a substrate; a doped first region, disposed above the substrate, having p-type organic semiconductor material; a doped second region, disposed above the substrate, having n-type transparent or semi-transparent oxide semiconductor material; and a gate stack coupled to the doped source and drain regions. 8 . The TFET of claim 7 , wherein the p-type organic semiconductor material is selected from a group consisting of P3HT, MDMO-PPV, PEFOT:PSS, CoPc, and CuPc. 9 . The TFET of claim 7 , wherein the n-type transparent or semi-transparent oxide semiconductor material is selected from a group consisting of α-Ga 2 —O3, β-Ga 2 —O 3 , In 2 O 3 , and SnO 2 . 10 . The TFET of claim 7 , wherein the TFET is a FinFET, Tri-Gate, or square nano-wire based device. 11 . The TFET of claim 7 further comprises a lightly doped n-type material coupled to the gate stack, the lightly doped n-type material separating the doped first and second regions from one another. 12 . The TFET of claim 7 further comprises a lightly doped p-type material coupled to the gate stack, the lightly doped p-type material separating the doped first and second regions from one another. 13 . The TFET of claim 12 , wherein the lightly doped p-type material is undoped P3HT, or CuPc or CoPc material. 14 . The TFET of claim 7 , wherein the doped first region is a source region, and wherein the doped second region is a drain region. 15 . A tunneling field effect transistor (TFET), comprising: a substrate; a doped first region, disposed above the substrate, having p-type organic semiconductor material; a doped second region, disposed above the substrate, having n-type organic semiconductor material; and a gate stack coupled to the doped source and drain regions. 16 . The TFET of claim 15 , wherein the p-type organic semiconductor material is selected from a group consisting of P3HT, MDMO-PPV, and PEDOT:PSS, CuPc, and CoPc. 17 . The TFET of claim 15 , wherein the n-type organic semiconductor material is one of F16CuPc or SnCl 2 Pc. 18 . The TFET of claim 15 , wherein the TFET is a FinFet, Tri-Gate, or square nano-wire based device. 19 . The TFET of claim 15 further comprises a lightly doped n-type organic semiconductor material coupled to the gate stack, the lightly doped n-type material separating the doped first and second regions from one another, wherein the lightly p-type material is undoped PFHT material. 20 . The TFET of claim 15 further comprises a lightly doped p-type organic semiconductor material coupled to the gate stack, the lightly doped p-type material separating the doped first and second regions from one another, wherein the lightly doped p-type material is undoped PFHT material. 21 - 25 . (canceled)
Gated diodes · CPC title
characterised by their lengths or sectional shapes · CPC title
characterised by the insulating layers · CPC title
oriented parallel to substrates · CPC title
using combinations of technologies, e.g. using both Si and SiC technologies or using both Si and Group III-V technologies · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.