Photonic integrated circuit

Patent metadata

Field	Value
Publication number	US-2016266341-A1
Application number	US-201614988739-A
Country	US
Kind code	A1
Filing date	Jan 5, 2016
Priority date	Mar 11, 2015
Publication date	Sep 15, 2016
Grant date	—

Abstract

A photonic integrated circuit is provided. The photonic integrated circuit includes a substrate having a through hole interconnecting a first surface and a second surface; a transmission wire passing through the through hole and including an optical transmission structure and an electrical transmission structure; and an optical-to-electrical converter connected to the optical transmission structure of the transmission wire on the first surface.

First claim

1 . A photonic integrated circuit comprising:
a substrate having a through hole interconnecting a first surface and a second surface; a transmission wire passing through the through hole and including an optical transmission structure and an electrical transmission structure; and an optical-to-electrical converter connected to the optical transmission structure of the transmission wire on the first surface.

2 . The photonic integrated circuit of claim 1 , wherein:
the electrical transmission structure comprises an electrical terminal at the second surface configured to receive a first electrical signal; and the optical transmission structure is configured to receive an optical signal at the second surface.

3 . The photonic integrated circuit of claim 1 , wherein the optical transmission structure extends from the first surface to the second surface within the electrical transmission structure.

4 . The photonic integrated circuit of claim 3 , wherein:
the optical transmission structure includes an optical fiber; and the transmission wire further includes a reflective layer interposed between the electrical transmission structure and the optical fiber and configured to reflect an optical signal within the optical fiber.

5 . The photonic integrated circuit of claim 4 , wherein within the through hole, the electrical transmission structure does not completely surround the optical fiber.

6 . The photonic integrated circuit of claim 3 , wherein the electrical transmission structure includes a plurality of electrical transmission films electrically insulated from each other, and an insulation film formed between the electrical transmission films.

7 . The photonic integrated circuit of claim 1 , further comprising:
a surface plasmon resonance (SPR) generator disposed on a surface of the transmission wire and configured to transmit an optical signal to the optical-to-electrical converter over the electrical transmission structure by a surface plasmon resonance.

8 . The photonic integrated circuit of claim 7 , wherein the SPR generator surrounds the transmission wire on the second surface.

9 . The photonic integrated circuit of claim 7 , wherein the SPR generator includes a microlens configured to refract, at a predetermined angle, the optical signal to the surface of the transmission wire.

10 . The photonic integrated circuit of claim 7 , further comprising a switch configured to alternately pass an electrical signal to the electrical transmission structure or pass an input optical signal to the SPR generator in response to a control signal.

11 . The photonic integrated circuit of claim 7 , wherein the transmission wire comprises:
an internal wire; a metal layer; and an intermediate insulation layer surrounding the internal wire and disposed between the internal wire and the metal layer; wherein the SPR generator is coupled to the metal layer.

12 . The photonic integrated circuit of claim 7 , wherein the electrical transmission structure extends through the optical-to-electrical converter.

13 . The photonic integrated circuit of claim 1 , wherein:
the transmission wire is referred to as a first transmission wire; the through hole is referred to as a first through hole; the substrate further comprises a second through hole; the photonic integrated circuit further comprises a second transmission wire passing through the second through hole; and the photonic integrated circuit is configured to receive power and ground through first transmission wire and the second transmission wire.

14 . A photonic integrated circuit, comprising:
a substrate having a first through hole and a second through hole interconnecting a first surface and a second surface; a first transmission wire and a second transmission wire passing through the first through hole and the second through hole, respectively, the first transmission wire including an optical transmission structure and an electrical transmission structure; and an optical-to-electrical converter connected to the optical transmission structure of the first transmission wire on the first surface; wherein the first transmission wire and the second transmission wire are electrically connected or optically connected.

15 . The photonic integrated circuit of claim 14 , wherein:
the second transmission wire comprises an optical transmission line disposed in the second through hole; and the optical transmission line and the optical transmission structure of the first transmission wire are optically connected.

16 . The photonic integrated circuit of claim 14 , wherein:
the second transmission wire comprises an electrical transmission wire disposed in the second through hole; and the electrical transmission wire and the electrical transmission structure of the first transmission wire are electrically connected.

17 . The photonic integrated circuit of claim 14 , wherein the first transmission wire and the second transmission wire are electrically connected and optically connected.

18 . A photonic integrated circuit comprising:
a first substrate having a first through hole interconnecting a first surface and a second surface of the first substrate; a second substrate stacked on the first substrate and having a second through hole interconnecting a first surface and a second surface of the second substrate; a first transmission wire passing through the first through hole and including an optical transmission structure and an electrical transmission structure; an optical-to-electrical converter connected to the optical transmission structure of the first transmission wire on the first surface; and a second transmission wire passing through the second through hole; wherein the second transmission wire is electrically connected to the electrical transmission structure.

19 . The photonic integrated circuit of claim 18 , wherein the second transmission wire comprises an optical transmission structure and an electrical transmission structure.

20 . The photonic integrated circuit of claim 18 , wherein the second transmission wire comprises:
a first electrical wire; a second electrical wire; and an insulator disposed between the first electrical wire and the second electrical wire.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Sang-Cheon
• Jo Cha-Jea
• Cho Tae-Je

Classifications

• G02B6/4416

  Heterogeneous cables · CPC title

• H10F77/484

  Refractive light-concentrating means, e.g. lenses · CPC title

• H10F10/00 Primary

  Individual photovoltaic cells, e.g. solar cells (electrolytic light-sensitive devices, e.g. dye-sensitised solar cells, H01G9/20) · CPC title

• G02B6/4295

  coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors · CPC title

• G02B6/4283

  with electrical insulation means · CPC title