Method of manufacturing printed circuit board and method of inspecting printed circuit board

Patent metadata

Field	Value
Publication number	US-2016266050-A1
Application number	US-201615057621-A
Country	US
Kind code	A1
Filing date	Mar 1, 2016
Priority date	Mar 12, 2015
Publication date	Sep 15, 2016
Grant date	—

Abstract

A base insulating layer and a cover insulating layer of a first printed circuit board are formed of a first insulating material, and a base insulating layer and a cover insulating layer of a second printed circuit board are formed of a second insulating material. During inspection of the first printed circuit board, the first printed circuit board is irradiated with first light having a peak wavelength in a first wavelength range, and an image is produced based on reflected light from the first printed circuit board. During inspection of the second printed circuit board, the second printed circuit board is irradiated with second light having a peak wavelength in a second wavelength region different from the first wavelength region, and an image is produced based on reflected light from the second printed circuit board.

First claim

I/We claim:

1 . A method of manufacturing a printed circuit board including the steps of:
fabricating the printed circuit board that includes a metal support substrate, a first insulating layer, a wiring trace and a second insulating layer in order; and performing inspection of the printed circuit board, wherein the step of fabricating the printed circuit board includes fabricating a first printed circuit board in which the first and second insulating layers are formed of a first insulating material, or fabricating a second printed circuit board in which the first and second insulating layers are formed of a second insulating material, the step of performing the inspection includes
irradiating the first printed circuit board with first light having a peak wavelength in a first wavelength region during inspection of the first printed circuit board, and irradiating the second printed circuit board with second light having a peak wavelength in a second wavelength region different from the first wavelength region during inspection of the second printed circuit board,
producing an image of the first printed circuit board based on reflected light from the first printed circuit board during the inspection of the first printed circuit board, and producing an image of the second printed circuit board based on reflected light from the second printed circuit board during the inspection of the second printed circuit board, and
determining whether the wiring trace is defective based on the image of the first printed circuit board during the inspection of the first printed circuit board, and determining whether the wiring trace is defective based on the image of the second printed circuit board during the inspection of the second printed circuit board,
a ratio of light reflected by the wiring trace and emitted from the printed circuit board to light incident on the printed circuit board is defined as wiring reflectance, and a ratio of light reflected by the metal support substrate and emitted from the printed circuit board to light incident on the printed circuit board is defined as substrate reflectance, the first printed circuit board has characteristics in which a difference between the wiring reflectance and the substrate reflectance regarding the first light is larger than a difference between the wiring reflectance and the substrate reflectance regarding the second light, and the second printed circuit board has characteristics in which a difference between the wiring reflectance and the substrate reflectance regarding the second light is larger than a difference between the wiring reflectance and the substrate reflectance regarding the first light.

2 . The method of manufacturing the printed circuit board according to claim 1 , wherein
the first wavelength region is not less than 425 nm and not more than 525 nm, and the second wavelength region is not less than 630 nm and not more than 850 nm.

3 . The method of manufacturing the printed circuit board according to claim 2 , wherein
the first printed circuit board is irradiated with the first light by a first light-emitting device that generates violet light or blue light, and the second printed circuit board is irradiated with the second light by a second light-emitting device that generates red light or infrared light.

4 . The method of manufacturing the printed circuit board according to claim 2 , wherein
the first insulating material has a light transmittance higher than that of the second insulating layer at each wavelength in a range of not less than 425 nm and not more than 850 nm.

5 . The method of manufacturing the printed circuit board according to claim 4 , wherein
the light transmittances of the first and second insulating materials increase as wavelengths of light increase in the range of not less than 425 nm and not more than 850 nm.

6 . A method of inspecting a printed circuit board that includes a metal support substrate, a first insulating layer, a wiring trace and a second insulating layer in order, wherein
the printed circuit board is a first printed circuit board in which the first and second insulating layers are formed of a first insulating material or a second printed circuit board in which the first and second insulating layers are formed of a second insulating material, the method of inspecting the printed circuit board includes the steps of
irradiating the first printed circuit board with first light having a peak wavelength in a first wavelength region during inspection of the first printed circuit board, and irradiating the second printed circuit board with second light having a peak wavelength in a second wavelength region different from the first wavelength region during inspection of the second printed circuit board,
producing an image of the first printed circuit board based on reflected light from the first printed circuit board during the inspection of the first printed circuit board, and producing an image of the second printed circuit board based on reflected light from the second printed circuit board during the inspection of the second printed circuit board, and
determining whether the wiring trace is defective based on the image of the first printed circuit board during the inspection of the first printed circuit board, and determining whether the wiring trace is defective based on the image of the second printed circuit board during the inspection of the second printed circuit board,
a ratio of light reflected by the wiring trace and emitted from the printed circuit board to light incident on the printed circuit board is defined as wiring reflectance, and a ratio of light reflected by the metal support substrate and emitted from the printed circuit board to light incident on the printed circuit board is defined as substrate reflectance, the first printed circuit board has characteristics in which a difference between the wiring reflectance and the substrate reflectance regarding the first light is larger than a difference between the wiring reflectance and the substrate reflectance regarding the second light, and the second printed circuit board has characteristics in which a difference between the wiring reflectance and the substrate reflectance regarding the second light is larger than a difference between the wiring reflectance and the substrate reflectance regarding the first light.

Assignees

• Nitto Denko Corp

Inventors

• Toyoda Yoshihiro

Classifications

• Y10T29/53022

  with means to test work or product · CPC title

• H05K1/056

  the metal substrate being covered by an organic insulating layer · CPC title

• H05K2203/163

  Monitoring a manufacturing process · CPC title

• G01N21/8806 Primary

  Specially adapted optical and illumination features · CPC title

• G01N2021/8887

  based on image processing techniques · CPC title