Method for Controlling the Energy Damping of a Shape Memory Alloy With Surface Roughness

US2016265089A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016265089-A1
Application numberUS-201315036495-A
CountryUS
Kind codeA1
Filing dateNov 15, 2013
Priority dateNov 15, 2013
Publication dateSep 15, 2016
Grant date

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Abstract

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In a method for controlling energy damping in a shape memory alloy, provided is a shape memory alloy having a composition including at least one of: Cu in at least about 10 wt. %, Fe in at least about 5 wt. %, Au in at least about 5 wt. %, Ag in at least about 5 wt. %, Al in at least about 5 wt. %, In in at least about 5 wt. %, Mn in at least about 5 wt. %, Zn in at least about 5 wt. % and Co in at least about 5 wt. %. The shape memory alloy is configured into a structure including a structural feature having a surface roughness and having a feature extent that is greater than about 1 micron and less than about 1 millimeter. Energy damping of the structural feature is modified by exposing the structural feature to process conditions that alter the surface roughness of the structural feature.

First claim

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We claim: 1 . A method for controlling energy damping in a shape memory alloy comprising: providing a shape memory alloy having a composition that includes at least one member selected from the group consisting of Cu in at least about 10 wt. %, Fe in at least about 5 wt. %, Au in at least about 5 wt. %, Ag in at least about 5 wt. %, Al in at least about 5 wt. %, In in at least about 5 wt. %, Mn in at least about 5 wt. %, Zn in at least about 5 wt. % and Co in at least about 5 wt. %; configuring the shape memory alloy into a structure that includes a structural feature having a feature extent that is greater than about 1 micron and less than about 1 millimeter, the shape memory alloy structural feature having a surface roughness; and modifying the energy damping of the shape memory alloy structural feature by exposing the shape memory alloy structural feature to process conditions that alter the surface roughness of the shape memory alloy structural feature. 2 . The method of claim 1 wherein the shape memory alloy structural feature is oligocrystalline. 3 . The method of claim 1 wherein the shape memory alloy structural feature is monocrystalline. 4 . The method of claim 1 wherein the shape memory alloy structural feature has an extent that causes energy dissipation by the shape memory alloy structure during a martensitic phase transformation to be dominated by surface roughness of the shape memory alloy structural feature. 5 . The method of claim 1 wherein the shape memory alloy structural feature has an extent that is less than about 500 microns. 6 . The method of claim 1 wherein the shape memory alloy structural feature has an extent that is less than about 250 microns. 7 . The method of claim 1 wherein the shape memory alloy structural feature has an extent that is less than about 100 microns. 8 . The method of claim 1 wherein the shape memory alloy structural feature has an extent that is greater than about 10 microns. 9 . The method of claim 1 wherein the shape memory alloy structural feature has an extent that is greater than about 100 microns. 10 . The method of claim 1 wherein the process conditions to which the shape memory alloy structural feature is exposed produces a surface roughness, R q , of the shape memory alloy structural feature that is between about 1 nm and about 100 nm. 11 . The method of claim 1 wherein the process conditions to which the shape memory alloy structural feature is exposed produces a surface roughness, R q , of the shape memory alloy structural feature that is between about 100 nm and about 150 nm. 12 . The method of claim 1 wherein the process conditions to which the shape memory alloy structural feature is exposed produces a surface roughness, R q , of the shape memory alloy structural feature that is between about 150 nm and about 200 nm. 13 . The method of claim 1 wherein the process conditions to which the shape memory alloy structural feature is exposed produces a surface roughness, R q , of the shape memory alloy structural feature that is between about 200 nm and about 300 nm. 14 . The method of claim 1 wherein the process conditions to which the shape memory alloy structural feature is exposed produces a surface roughness, R q , of the shape memory alloy structural feature that is between about 300 nm and about 400 nm. 15 . The method of claim 1 wherein the process conditions to which the shape memory alloy structural feature is exposed produces a surface roughness, R q , of the shape memory alloy structural feature that is between about 400 nm and about 500 nm. 16 . The method of claim 1 wherein the process conditions to which the shape memory alloy structural feature is exposed produces a surface roughness, R q , of the shape memory alloy structural feature that is between about 500 nm and about 1000 nm. 17 . The method of claim 1 wherein the shape memory structural feature comprises a wire and the structural feature extent comprises a diameter of the wire. 18 . The method of claim 1 wherein the process conditions to which the shape memory alloy structural feature is exposed comprise electropolishing. 19 . The method of claim 1 wherein the shape memory alloy comprises Cu—Zn—Al. 20 . The method of claim 1 wherein the shape memory alloy comprises Cu-14Al-4Ni (wt. %).

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Classifications

  • of heavy metals · CPC title

  • C22C9/04Primary

    with zinc as the next major constituent · CPC title

  • of copper or alloys based thereon · CPC title

  • with aluminium as the next major constituent · CPC title

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What does patent US2016265089A1 cover?
In a method for controlling energy damping in a shape memory alloy, provided is a shape memory alloy having a composition including at least one of: Cu in at least about 10 wt. %, Fe in at least about 5 wt. %, Au in at least about 5 wt. %, Ag in at least about 5 wt. %, Al in at least about 5 wt. %, In in at least about 5 wt. %, Mn in at least about 5 wt. %, Zn in at least about 5 wt. % and Co i…
Who is the assignee on this patent?
Massachusetts Inst Technology
What technology area does this patent fall under?
Primary CPC classification C22C9/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Sep 15 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).