Thermosetting resin composition and uses thereof

Patent metadata

Field	Value
Publication number	US-2016264745-A1
Application number	US-201315033299-A
Country	US
Kind code	A1
Filing date	Nov 6, 2013
Priority date	Oct 29, 2013
Publication date	Sep 15, 2016
Grant date	—

Abstract

The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.

First claim

1 . A thermosetting resin composition, wherein the thermosetting resin composition comprises a thermosetting resin, an inorganic filler and a tungsten compound.

2 . The thermosetting resin composition of claim 1 , wherein the tungsten compound is selected from the group consisting-of organic tungsten compounds,inorganic tungsten compounds, or a combination of two or more thereof.

3 . The thermosetting resin composition of claim 1 , wherein the tungsten compound is selected from the group consisting of tungsten disulfide, ammonium tetrathiotungstate, tungsten oxytetrabromide, tungsten tetrachloride, tungsten tetrabromide, zinc tungstate, calcium tungstate, magnesium tungstate, ammonium tungstate, tungsten selenide, tungsten oxide, tungsten dioctyl dithiocarbamate, tungsten dithiolate, 3,4-dimercapto-toluene-co-tungsten, amine tungsten diisopropyl phosphorodithioate, organic tungsten and molybdenum complexes, tungsten dithiocarbamate compound, aromatic tungsten compound or amine tungsten alkyl(aryl)phosphorothioate, or combination of at least two selected therefrom.

4 . The thermosetting resin composition of claim 1 , wherein the tungsten compound comprises S and P elements.

5 . The thermosetting resin composition of claim 1 , wherein the tungsten compound is selected from the group consisting of tungsten disulfide, ammonium tetrathiotungstate, tungsten oxytetrabromide, tungsten tetrachloride, tungsten tetrabromide and amine tungsten alkyl(aryl)phosphorothioate, or combination of at least two selected therefrom.

6 . The thermosetting resin composition of claim 1 , wherein the tungsten compound is in an amount of from about 0.001 to about 30 wt. % of the total mass of the thermosetting resin composition.

7 . The thermosetting resin composition of claim 6 , wherein the tungsten compound is in an amount of from about 0.1 to about 15 wt. % of the total mass of the thermosetting resin composition.

8 . The thermosetting resin composition of claim 1 , wherein the inorganic filler is selected from the group consisting of silica, boehmite, alumina, talc, mica, kaolin, aluminum hydroxide, magnesium hydroxide, zinc borate, zinc stannate, zinc oxide, titania, boron nitride, calcium carbonate, barium sulfate, barium titanate, aluminum borate, potassium titanate, E-glass powder, S-glass powder, D-glass powder, NE-glass powder, hollow micropowder or boehmite, or a combination of at least two selected therefrom.

9 . The thermosetting resin composition of claim 1 , wherein the inorganic filler is in an amount of from about 10 to about 80 wt. % of the total mass of the thermosetting resin composition.

10 . The thermosetting resin composition of claim 9 , wherein the inorganic filler is in an amount of from about 20 to about 60 wt. % of the total mass of the thermosetting resin composition.

11 . The thermosetting resin composition of claim 1 , wherein the inorganic filler has an average particle size of from about 0.1 to about 100 μm.

12 . The thermosetting resin composition of claim 1 , wherein the inorganic filler has an average particle size of from about 0.5 to about 20 μm.

13 . The thermosetting resin composition of claim 1 , wherein the thermosetting resin is in an amount of from about 20 to about 70 wt. % of the total mass of the thermosetting resin composition.

14 . The thermosetting resin composition of claim 13 , wherein the thermosetting resin is in an amount of from about 25 to about 65 wt. % of the total mass of the thermosetting resin composition.

15 . (canceled)

16 . The thermosetting resin composition of claim 1 , wherein the thermosetting resin composition further comprises a curing agent in an amount of from about 1 to about 30 wt. % of the total mass of the thermosetting resin composition.

17 . The thermosetting resin composition of claim 16 , wherein the curing agent is in an amount of from about 4 to about 25 wt. % of the total mass of the thermosetting resin composition.

18 . (canceled)

19 . The thermosetting resin composition of claim 1 , wherein the thermosetting resin composition further comprises an accelerant in an amount of from about 0 to about 10 wt. % of the total mass of the thermosetting resin composition, excluding 0 wt. %.

20 . The thermosetting resin composition of claim 19 , wherein the accelerant is in an amount of from about 1 to about 10 wt. % of the total mass of the thermosetting resin composition.

21 . (canceled)

22 . A resin varnish, wherein the resin varnish is obtained by dissolving or dispersing the thermosetting resin composition of claim 1 in a solvent.

23 . A prepreg comprising a reinforcing material and a thermosetting resin composition of claim 1 attached on the reinforcing material after impregnation and drying.

24 . A laminate comprising at least one prepreg of claim 23 .

Assignees

• Shengyi Technology Co Ltd

Inventors

• Du Cuiming
• Chai Songgang

Classifications

• C08K3/36

  Silica · CPC title

• C08K3/22

  of metals · CPC title

• C08J2363/02

  Polyglycidyl ethers of bis-phenols · CPC title

• C08K2003/3009

  Sulfides · CPC title

• C08K3/30

  Sulfur-, selenium- or tellurium-containing compounds · CPC title