Test board unit and apparatus for testing a semiconductor chip including the same

Patent metadata

Field	Value
Publication number	US-2016262255-A1
Application number	US-201514846053-A
Country	US
Kind code	A1
Filing date	Sep 4, 2015
Priority date	Mar 4, 2015
Publication date	Sep 8, 2016
Grant date	—

Abstract

A test board unit may include a test board, a thermal tank and a heat-dissipating plate. The test board may be configured to provide a semiconductor chip with a test current. The thermal tank may be configured to dissipate heat generated in the semiconductor chip. The heat-dissipating plate may be coupled between the test board and the thermal tank and may be configured to transfer the heat from the semiconductor chip to the thermal tank.

First claim

What is claimed is:

1 . A test board unit comprising:
a test board configured to provide a semiconductor chip with a test current; a thermal tank configured to dissipate heat generated from the semiconductor chip; and a heat-dissipating plate interposed between the test board and the thermal tank and configured to transfer the heat to the thermal tank.

2 . The test board unit of claim 1 , wherein the thermal tank is in direct contact with the heat-dissipating plate.

3 . The test board unit of claim 1 , further comprising an insulating layer formed on an outer surface of the thermal tank.

4 . The test board unit of claim 1 , wherein the thermal tank has at least one heat-dissipating hole.

5 . The test board unit of claim 1 , further comprising a heat-dissipating via arranged in the test board to electrically connect the semiconductor chip with the heat-dissipating plate.

6 . The test board unit of claim 5 , wherein the heat-dissipating via include a thermal via having a copper layer formed on an inner surface of the thermal via.

7 . The test board unit of claim 1 , wherein the test board comprises a test pattern configured to provide the semiconductor chip with the test current, and the heat-dissipating plate is electrically connected to the test pattern.

8 . A test board unit comprising:
a test board configured to provide a semiconductor chip with a test current; a thermal tank configured to dissipate heat generated from the semiconductor chip; and a heat-dissipating via arranged in the test board to electrically couple the semiconductor chip with the thermal tank.

9 . The test board unit of claim 8 , wherein the thermal tank is in contact with the test board.

10 . The test board unit of claim 9 , wherein substantially no gap exists between the thermal tank and the test board.

11 . The test board unit of claim 8 , further comprising an insulating layer formed on an outer surface of the thermal tank.

12 . The test board unit of claim 8 , wherein the thermal tank has at least one heat-dissipating hole.

13 . The test board unit of claim 8 , wherein the test board comprises a test pattern configured to provide the semiconductor chip with the test current, and the heat-dissipating plate is electrically connected to the test pattern.

14 . An apparatus for testing a semiconductor chip, the apparatus comprising:
a test board configured to provide the semiconductor chip with a test current; a socket arranged on the test board and configured to accept the semiconductor chip; a thermal tank configured to dissipate heat generated from the semiconductor chip; and a heat-dissipating plate coupled between the test board and the thermal tank and configured to transfer the heat to the thermal tank.

15 . The apparatus of claim 14 , wherein the socket is arranged on a first surface of the test board, and the heat-dissipating plate is arranged on a second surface of the test board opposite to the first surface.

16 . The apparatus of claim 14 , wherein the socket comprises electrode terminals electrically connected to the semiconductor chip, and the heat-dissipating plate is configured to surround the electrode terminals of the socket.

17 . The apparatus of claim 14 , further comprising a heat-dissipating via arranged in the test board to electrically connect the semiconductor chip with the heat-dissipating plate.

18 . An apparatus for testing a semiconductor chip, the apparatus comprising:
a test board configured to provide the semiconductor chip with a test current; a socket arranged on the test board and configured to accept the semiconductor chip; a thermal tank configured to dissipate heat generated from the semiconductor chip; and a heat-dissipating via arranged in the test board and configured to electrically couple the semiconductor chip with the thermal tank.

19 . The apparatus of claim 18 , wherein the socket is arranged on a first surface of the test board, and the heat-dissipating plate is arranged on a second surface of the test board opposite to the first surface.

20 . The apparatus of claim 18 , wherein the thermal tank includes at least one heat-dissipating fin located on a lower surface of the thermal tank.

Assignees

• Sk Hynix Inc
• Unitest Inc

Inventors

• Jung Woo Sik
• Koh Byoung Seon
• Oh Hyo Jin
• Choi Young Bae
• Jung Jin Young

Classifications

• H10P74/207 Primary

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H05K1/0206 Primary

  by printed thermal vias · CPC title

• G01R31/2863 Primary

  Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title

• G01R1/0408

  Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets (G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808) · CPC title