Producing a lighting module

Patent metadata

Field	Value
Publication number	US-2016260874-A1
Application number	US-201615058180-A
Country	US
Kind code	A1
Filing date	Mar 2, 2016
Priority date	Mar 6, 2015
Publication date	Sep 8, 2016
Grant date	—

Abstract

A method for producing a lighting module is provided. The method includes providing a light source substrate populated with at least one semiconductor light source, laterally surrounding the at least one semiconductor light source by a wall, applying at least one prefabricated diffuser element to at least one semiconductor light source, introducing potting compound into the space surrounded by the wall up to a height at which both the at least one semiconductor light source, and potting at least part of the at least one diffuser element.

First claim

What is claimed is:

1 . A method for producing a lighting module, the method comprising:
providing a light source substrate populated with at least one semiconductor light source; laterally surrounding the at least one semiconductor light source by a wall; applying at least one prefabricated diffuser element to at least one semiconductor light source; introducing potting compound into the space surrounded by the wall up to a height at which both the at least one semiconductor light source; and potting at least part of the at least one diffuser element.

2 . The method of claim 1 ,
wherein the space surrounded by the wall is potted with the potting compound up to an upper side of the at least one diffuser element.

3 . The method of claim 1 ,
wherein the potting compound is low-viscosity.

4 . The method of claim 3 ,
wherein the viscosity of the potting compound lies with a viscosity in a range of about 10 to 1000 mPa·s.

5 . The method of claim 1 ,
wherein the at least one prefabricated diffuser element is adhesively attached to at least one semiconductor light source.

6 . The method of claim 5 ,
wherein high-viscosity adhesive is used as the bonding agent.

7 . The method of claim 1 ,
wherein the diffuser element is an extruded diffuser element.

8 . The method of claim 1 ,
wherein the diffuser element is a multi-region body with at least one transparent region and at least one light-scattering region.

9 . The method of claim 8 ,
wherein the transparent region is applied to the at least one semiconductor light source.

10 . The method of claim 1 ,
wherein the potted body is fabricated.

11 . The method of claim 10 ,
wherein the populated light source substrate is a panel.

12 . A lighting module, comprising:
a light source substrate, which is populated with at least one semiconductor light source; and at least one diffuser volume, which is arranged at a light-exiting area of the at least one semiconductor light source; wherein the at least one semiconductor light source and at least part of the diffuser volume are laterally potted with potting compound; wherein the lighting module has been produced by a method, the method comprising:
providing a light source substrate populated with at least one semiconductor light source;
laterally surrounding the at least one semiconductor light source by a wall;
applying at least one prefabricated diffuser element to at least one semiconductor light source;
introducing potting compound into the space surrounded by the wall up to a height at which both the at least one semiconductor light source; and
potting at least part of the at least one diffuser element; and
wherein the at least one diffuser volume represents at least part of a prefabricated diffuser element.

13 . The lighting module of claim 12 ,
wherein the lighting module is a light strip.

Assignees

• Osram Gmbh

Inventors

• Reiss Martin

Classifications

• H10H20/882

  Scattering means (H10H20/82 takes precedence) · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H10H20/0363

  of optical field-shaping means · CPC title

• H10H20/0362

  of encapsulations · CPC title

• H10H20/01 Primary

  Manufacture or treatment · CPC title