US2016259138A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016259138-A1 |
| Application number | US-201615054816-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 26, 2016 |
| Priority date | Mar 6, 2015 |
| Publication date | Sep 8, 2016 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A flexible wiring board includes a conductive film provided on one surface of a substrate. The conductive film includes a plurality of pad portions to which a plurality of connection electrodes are respectively bonded with solder, and a wiring portion extending in a direction crossing a row in which the plurality of pad portions are arranged. The plurality of pad portions include a terminal portion electrically connected with the wiring portion, and at least two land portions located on both sides of the terminal portion while avoiding electrical connection to the wiring portion. The solder includes land solder portions respectively overlaid on the at least two land portions and a terminal solder portion overlaid on the terminal portion. The land solder portion has a shape extending longer than the terminal solder portion along a direction in which the wiring portion extends from the connection electrode corresponding thereto.
Opening claim text (preview).
What is claimed is: 1 . An optical module comprising: an optical sub-assembly for converting an electric signal and an optical signal at least from one to the other; a flexible wiring board; and solder electrically connecting the optical sub-assembly with the flexible wiring board, wherein the optical sub-assembly includes a plurality of connection electrodes arrayed so as to be arranged in at least a row, the flexible wiring board includes a substrate having flexibility and a conductive film provided on one surface of the substrate, the conductive film includes a plurality of pad portions to which the plurality of connection electrodes are respectively bonded with the solder and a wiring portion extending in a direction crossing a row in which the plurality of pad portions are arranged, the plurality of pad port ions include a terminal portion electrically connected with the wiring portion and at least two land portions located on both sides of the terminal portion while avoiding electrical connection to the wiring portion, the solder includes land solder portions respectively overlaid on the at least two land portions and a terminal solder portion overlaid on the terminal portion, and the land solder portion has a shape extending longer than the terminal solder portion along a direction in which the wiring portion extends from the connection electrode corresponding thereto. 2 . The optical module according to claim 1 , wherein each of the at least two land portions has a shape extending longer than the terminal portion along the direction in which the wiring portion extends from the connection electrode corresponding thereto. 3 . The optical module according to claim 1 , wherein the flexible wiring board further includes a protective film covering the wiring portion, next to an edge of the land solder portion in the direction in which the land solder portion extends longer than the terminal solder portion. 4 . The optical module according to claim 1 , wherein the plurality of pad portions are arranged in each of a first row and a second row parallel to each other, and the wiring portion electrically connected to the terminal portion located in the first row and the wiring portion electrically connected to the terminal portion located in the second row extend in opposite directions. 5 . The optical module according to claim 1 , wherein the flexible wiring board further includes a second conductive film provided on a surface of the substrate on the side opposite to the surface on which the conductive film is provided, the second conductive film includes a land pattern portion and a planar pattern portion extending in a shape avoiding the land pattern portion, the land pattern port ion is electrically connected with the terminal portion, and the planar pattern portion is electrically connected with the at least two land portions. 6 . The optical module according to claim 5 , wherein the flexible wiring board includes a plurality of through holes penetrating the substrate to achieve electrical connection between front and back surfaces of the substrate, and the plurality of through holes include a through hole penetrating the terminal portion and the land pattern portion to achieve electrical connection and through holes penetrating the respective at least two land portions and the planar pattern portion to achieve electrical connection. 7 . The optical module according to claim 6 , wherein the solder is also provided inside the plurality of through holes, on the land pattern portion, and on the planar pattern portion. 8 . The optical module according to claim 6 , wherein each of the plurality of connection electrodes is a lead pin, and the lead pin is inserted through each of the plurality of through holes.
Systems or boxes with surplus lengths · CPC title
the printed circuit boards being flexible (in general H05K1/147) · CPC title
of optical modules with disconnectable electrical connectors (latching arms for electrical connectors H01R13/627) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.