Electronic device and manufacturing method of electronic device
US-2016257093-A1 · Sep 8, 2016 · US
Electronic device manufacturing method and electronic device
US2016257101A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016257101-A1 |
| Application number | US-201615003612-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 21, 2016 |
| Priority date | Mar 6, 2015 |
| Publication date | Sep 8, 2016 |
| Grant date | — |
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- Title
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Abstract
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An electronic device is manufactured by a method including applying a photosensitive adhesive agent either to a pressure chamber forming substrate and a vibrating plate or to a sealing plate having a structure of a lower height from a bonding surface, precuring the photosensitive adhesive agent by heating, patterning the precured photosensitive adhesive agent, and bonding the substrates together with the structure (bump electrode) and the photosensitive adhesive agent interposed therebetween.
First claim
Opening claim text (preview).
What is claimed is: 1 . A manufacturing method of an electronic device that includes a first substrate including a flexurally deformable driving region and a drive element disposed in the driving region so as to deform the driving region, and a second substrate opposed to the first substrate with a spacing from the first substrate and with the drive element and other structure of the first substrate interposed between the first and second substrates, the first and second substrates being bonded together via a thermosetting adhesive agent, the manufacturing method comprising: applying the adhesive agent to a bonding surface of one of the first substrate and the second substrate that, on an assumption that the adhesive agent is applied to the both substrates so as to cover a structure formed on the respective bonding surfaces, makes a distance of a slope from a top portion of the adhesive agent covering the structure to an edge of a flat region of the adhesive agent shorter; and bonding the first substrate and the second substrate together, with the structure and the adhesive agent interposed between the first and second substrates. 2 . The manufacturing method according to claim 1 , further comprising a patterning process including providing the adhesive agent on respective sides of a region where a structure having a highest height between the first substrate and the second substrate is located. 3 . An electronic device manufactured through the manufacturing method according to claim 1 . 4 . An electronic device manufactured through the manufacturing method according to claim 2 .
Assignees
Inventors
Classifications
Displays, e.g. liquid crystal displays, plasma displays · CPC title
curable adhesive · CPC title
Electrical equipment · CPC title
of synthetic resin · CPC title
Crystalline · CPC title
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Frequently asked questions
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- What does patent US2016257101A1 cover?
- An electronic device is manufactured by a method including applying a photosensitive adhesive agent either to a pressure chamber forming substrate and a vibrating plate or to a sealing plate having a structure of a lower height from a bonding surface, precuring the photosensitive adhesive agent by heating, patterning the precured photosensitive adhesive agent, and bonding the substrates togethe…
- Who is the assignee on this patent?
- Seiko Epson Corp
- What technology area does this patent fall under?
- Primary CPC classification B32B7/12. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Sep 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).