Co-finishing surfaces

US2016256979A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016256979-A1
Application numberUS-201514714876-A
CountryUS
Kind codeA1
Filing dateMay 18, 2015
Priority dateMar 6, 2015
Publication dateSep 8, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.

First claim

Opening claim text (preview).

We claim: 1 . A method for co-finishing surfaces, comprising: bonding a first structure formed of a first material and having a first non-planar surface in an aperture defined in a second structure formed of a second material and having a second planar surface such that there is an offset between the first surface and the second surface; co-lapping the first surface and the second surface to reduce the offset; and co-polishing the first surface and the second surface such that the first surface and the second surface are flush. 2 . The method of claim 1 , further comprising chamfering an edge of the first surface prior to the operation of co-lapping. 3 . The method of claim 1 , wherein at least one of the operation of co-lapping or the operation of co-polishing changes a shape of the first surface 4 . The method of claim 1 , further comprising filling a gap between the bonded first structure and a side of the aperture. 5 . The method of claim 1 , wherein the second material comprises zirconia and the first material comprises one of glass, chemically strengthened glass, zirconia, alumina, and sapphire. 6 . The method of claim 1 , wherein the operation of co-polishing polishes the first surface at a first polishing speed and the second surface at a second polishing speed. 7 . The method of claim 1 , further comprising lapping the first surface prior to the operation of bonding. 8 . A method for co-finishing surfaces, comprising: rough grinding a first surface of a first material, the first surface having an aperture defined therein; attaching a second material having a second surface to the aperture such that either the second surface is proud of the first surface by an offset or the first surface is proud of the second surface by the offset; and co-finishing the first surface and the second surface to reduce the offset; wherein at least one of the first and second surfaces is non-planar 9 . The method of claim 8 , wherein: the second material is attached to the aperture such that the second surface is proud of the first surface by the offset; and the second surface is still proud of the first surface after the operation of co-finishing. 10 . The method of claim 8 , wherein: the second material is attached to the aperture such that the second surface is proud of the first surface by the offset; and the first surface is proud of the second surface after the operation of co-finishing. 11 . The method of claim 8 , wherein the first material and the second material are brittle. 12 . The method of claim 8 , wherein the operating of attaching the second material bonds the second material to the first material using heat activated film, a two part adhesive, or an adhesive. 13 . The method of claim 8 , wherein the first material is reflective and the second material is translucent after the operation of co-finishing. 14 . The method of claim 8 , further comprising placing an epoxy fill between the second surface and the first surface perpendicular to a direction of the co-finishing. 15 . A method for co-finishing surfaces, comprising: adhesively bonding a sapphire window to a zirconia structure such that a combined surface formed by a first surface of the sapphire window and a second surface of the zirconia structure is uneven; placing a fill material in a gap between the sapphire window and the zirconia structure; and co-finishing the first surface and the second surface to make the combined surface even and to make a first geometry of the first surface conform to a second geometry of the second surface. 16 . The method of claim 15 , wherein the first geometry of the first surface is flat and the second geometry of the second surface is curved. 17 . The method of claim 15 , wherein the fill material absorbs side force during the operation of co-finishing. 18 . The method of claim 15 , wherein the first surface has a chamfered edge that is removed by the operation of co-finishing. 19 . The method of claim 15 , wherein the sapphire window is transparent after the operation of co-finishing. 20 . The method of claim 15 , wherein the operation of co-finishing includes grinding the first surface and the second surface.

Assignees

Inventors

Classifications

  • Filling cavities in the preformed part (for joining B29C70/84) · CPC title

  • using adhesive tape {, e.g. thermoplastic tape; using threads or the like (B29C65/3444 takes precedence)} · CPC title

  • B24B37/042Primary

    operating processes therefor · CPC title

  • Use of {EP, i.e.} epoxy resins {or derivatives thereof} as reinforcement · CPC title

  • characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced · CPC title

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What does patent US2016256979A1 cover?
A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and secon…
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification B24B37/042. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Sep 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).