Functionalized Matrices for Dispersion of Nanostructures
US-2015166342-A1 · Jun 18, 2015 · US
US2016254425A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016254425-A1 |
| Application number | US-201415030079-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 24, 2014 |
| Priority date | Oct 24, 2013 |
| Publication date | Sep 1, 2016 |
| Grant date | — |
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An LED encapsulant comprises a scattering particle mixture, which includes: (i) a linear polymer including a dimethylsiloxane group which has a vinyl end substituent and/or a linear polymer including a methylphenylsiloxane group which has a vinyl end substituent; and (ii) at least one vinyl-based resin selected from the group consisting of a vinyl-based ViMQ resin. An LED package comprising the encapsulant is also disclosed.
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1 .- 14 . (canceled) 15 . An LED encapsulant comprising a scattering particle mixture, which comprises components (i) and (ii): (i) a linear polymer including a dimethylsiloxane group and/or a linear polymer including a methylphenylsiloxane group and/or a diphenylsiloxane group, the linear polymers having at least one vinyl end substituent; and (ii) at least one silicone resin of one of structures M Vi D H D Ph T Ph , M Vi M H D Ph T Ph , M Vi D H T Ph , M Vi M H T Ph , or M Vi (D)T Ph wherein if (i) acts as silicone matrix then (ii) acts as scattering particles and if (ii) acts as silicone matrix then (i) acts as scattering particles. 16 . The LED encapsulant comprising a scattering particle mixture of claim 15 , wherein at least one of the components is included as scattering particles while another one or more components is included as a silicone matrix. 17 . The LED encapsulant of claim 15 , further comprising a surfactant having a (CH 3 ) 2 Si—O structure and a (CH 3 )PhSi—O structure. 18 . The LED encapsulant of claim 17 , wherein, when a portion of the surfactant having a (CH 3 ) 2 Si—O structure is defined as A and a portion of the surfactant having a (CH 3 )PhSi—O structure is defined as B, the surfactant has an ABA, BAB, or AB structure. 19 . The LED encapsulant of claim 15 , further comprising a crosslinking agent. 20 . The LED encapsulant of claim 15 , further comprising a curing inhibitor, a catalyst and a fluorescent substance. 21 . The LED encapsulant of claim 15 , which further comprises nanoparticles. 22 . The LED encapsulant of claim 20 , which further comprises at least one particulate selected from the group consisting of TiO 2 , ZnO, and silica. 23 . The LED encapsulant of claim 22 , wherein the sum of the contents of TiO 2 , ZnO, and silica particulates is from 0.05 to 5 wt % based on the total weight of scattering particles. 24 . The LED encapsulant of claim 23 , wherein the average particle size of the TiO 2 , ZnO, and silica particulates is between 1 and 50 nm. 25 . The LED encapsulant of claim 17 , wherein the surfactant comprises at least one compound selected from the group consisting of vinyltrimethoxysilane, methacryloxymethylmethyldimethoxysilane, methacryloxymethyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, methyltriethoxysilane, allyltriethoxysilane, octyltriethoxysilane and tetraethoxysilane. 26 . An LED package comprising: an LED chip; and the LED encapsulant of claim 15 . 27 . The LED package of claim 26 , wherein the LED chip emits blue light when current is applied. 28 . The LED package of claim 26 , which further comprises a yellow fluorescent substance. 29 . The LED package of claim 27 , which further comprises a yellow fluorescent substance.
Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond · CPC title
Fillers, pigments or reinforcing additives · CPC title
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers · CPC title
Polysiloxanes · CPC title
Wavelength conversion materials · CPC title
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