Optoelectronic modules with optics integrated into a cap

Patent metadata

Field	Value
Publication number	US-2016254397-A1
Application number	US-201615041216-A
Country	US
Kind code	A1
Filing date	Feb 11, 2016
Priority date	Feb 27, 2015
Publication date	Sep 1, 2016
Grant date	—

Abstract

Optoelectronic modules for light emitting and/or light sensing include optical assemblies and active optoelectronic components. An optical assembly and a corresponding optoelectronic component can be aligned. The optoelectronic modules can include multiple optical assemblies and active optoelectronic components. Multiple optical assemblies and corresponding active optoelectronic components can be aligned independently of each other in various implementations of optoelectronic modules that include alignment features and optical assembly barrels.

First claim

What is claimed is:

1 . An optoelectronic module comprising:
a substrate on which are mounted a first active optoelectronic component and a second active optoelectronic component, each of which is configured to emit or detect light at a particular one or more wavelengths; a first optical assembly barrel including a first optical assembly over the first active optoelectronic component, wherein the first optical assembly barrel is laterally surrounded by a second optical barrel assembly; the second optical barrel assembly including a second optical assembly over the second active optoelectronic component, wherein the second optical assembly is surrounded laterally by sections of the second optical barrel assembly that are substantially non-transparent to the one or more wavelengths of light; a first alignment feature separating the first optical assembly barrel from the substrate, wherein the first alignment feature establishes a first assembly dimension with respect to the first optical assembly independent of a second assembly dimension; a second alignment feature separating the second optical barrel assembly from the substrate, wherein the second alignment feature establishes the second assembly dimension with respect to the second optical assembly.

2 . The optoelectronic module of claim 1 further comprising a lateral alignment feature separating the first optical assembly barrel from the second optical barrel assembly.

3 . The optoelectronic module of claim 1 wherein a surface of the first alignment feature is in direct contact with a surface of the substrate.

4 . The optoelectronic module of claim 1 wherein a surface of the first alignment feature is in direct contact with a surface of the first active optoelectronic component.

5 . The optoelectronic module of claim 1 wherein a surface of the first alignment feature is separated from a surface of the first active optoelectronic component by an intervening layer.

6 . The optoelectronic module of claim 1 wherein the first assembly dimension is a focal length of the first optical assembly over the first active optoelectronic assembly component, and the second assembly dimension is a focal length of the second optical assembly over the second active optoelectronic component.

7 . The optoelectronic module of claim 1 wherein the first alignment feature is a protrusion extending from the first optical assembly barrel.

8 . The optoelectronic module of claim 1 wherein the second alignment feature is a protrusion extending from the second optical barrel assembly.

9 . The optoelectronic module of claim 1 wherein the second optical assembly is supported by an edge surface of the second optical barrel assembly.

10 . The optoelectronic module of claim 1 wherein the second optical assembly comprises at least one of a diffraction grating, a microlens array, a lens, a prism, a micro-prism array, or a diffractive optical element.

11 . An optoelectronic module comprising:
a substrate on which are mounted a first active optoelectronic component, a second active optoelectronic component, and a third active optoelectronic component, each of which is configured to emit or detect light at a particular one or more wavelengths; a first optical assembly barrel including a first optical assembly over the first active optoelectronic component, wherein the first optical assembly barrel is laterally surrounded by a second optical barrel assembly; the second optical barrel assembly including a second optical assembly over the second active optoelectronic component and a third optical assembly over the third active optoelectronic component, wherein the second optical assembly and the third optical assembly are surrounded laterally by sections of the second optical barrel assembly that are substantially non-transparent to the one or more wavelengths of light; a second alignment feature separating the second optical barrel assembly from the substrate, wherein the second alignment feature establishes a second assembly dimension with respect to the second optical assembly and a third assembly dimension with respect to the third optical assembly; a first alignment feature separating the first optical assembly barrel from the substrate, wherein the first alignment feature establishes a first assembly dimension with respect to the first optical assembly independent of the second and third assembly dimensions.

12 . A method of manufacturing an optoelectronic module, the method comprising:
applying a first optical beam to a second optical assembly laterally surrounded by sections of a second optical barrel assembly having a first alignment feature; adjusting a height of the first alignment feature to attain a specified value for a first assembly dimension with respect to the second optical assembly; applying a second optical beam to a first optical assembly integrated in a first optical assembly barrel; adjusting a height of at least one feature of the first optical assembly or of the first optical assembly barrel to attain a specified value for a second assembly dimension with respect to the first optical assembly; mounting the first optical assembly barrel including the first optical assembly over a first active optoelectronic component such that a surface of a second alignment feature of the first optical assembly barrel is in direct or indirect contact with a surface of the first active optoelectronic component; and mounting the second optical barrel assembly, including the second optical assembly, over a substrate on which the first active optoelectronic component is mounted such that a surface of the first alignment feature is in direct or indirect contact with a surface of the substrate.

13 . The method of claim 12 wherein a second active optoelectronic component is mounted on the substrate, wherein, when the second optical barrel assembly is mounted over the substrate, the second optical assembly is substantially aligned with the second active optoelectronic component.

14 . The method of claim 12 wherein adjusting a height of at least one feature of the first optical assembly or of the first optical assembly barrel to attain a specified value for a second assembly dimension with respect to the first optical assembly includes:
adjusting a thickness of a transmissive layer that intersects an optical axis of the first optical assembly.

15 . The method of claim 12 wherein adjusting a height of at least one feature of the first optical assembly or of the first optical assembly barrel to attain a specified value for a second assembly dimension with respect to the first optical assembly includes:
adjusting a height of the second alignment feature.

16 . A method of positioning a first optical assembly within an optical barrel assembly having a through-hole therein and an edge surface to support the optical assembly, the method comprising:
applying a probe beam while moving a test optical assembly within the through-hole and determining a position for the first optical assembly; adjusting a height of the edge surface; and inserting the first optical assembly into the optical barrel assembly such that the first optical assembly is supported by the edge surface.

17 . The method of claim 16 wherein adjusting a height of the edge surface includes removing material of the optical barrel assembly.

18 . The method of claim 17 wherein removing material to adjust the height of the edge surface includes one or more of machining, mechanical cutting, abrading, grinding, etching, laser cutting

Assignees

• Heptagon Micro Optics Pte Ltd

Inventors

• Senn Tobias
• Rudmann Hartmut

Classifications

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/01

  Manufacture or treatment · CPC title

• H10F71/00

  Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00) · CPC title

• H10F77/407 Primary

  indirectly associated with the devices · CPC title

• H01L33/005

  Electricity · mapped topic