Joining silver sheet, method for manufacturing same, and method for joining electronic part

Patent metadata

Field	Value
Publication number	US-2016254243-A1
Application number	US-201415028453-A
Country	US
Kind code	A1
Filing date	Oct 6, 2014
Priority date	Oct 17, 2013
Publication date	Sep 1, 2016
Grant date	—

Abstract

A joining silver sheet with high joining strength contains silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and has a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of from T A to T B (° C.) satisfying 270 £ T A <T B £ 350. A method of making the silver sheet includes subjecting a coated film of a silver paste containing silver powder containing silver particles having a particle diameter of from 1 to 250 nm, and a dispersion medium that undergoes volatilization in a temperature range of 200° C. or lower, which are mixed with each other, to a heat treatment at a temperature range, at which no sintering occurs, and then baking at a temperature of from 170 to 250° C. under application of a pressure of from 5 to 35 MPa.

First claim

1 . A joining silver sheet comprising silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and having a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of “T A (° C.) or higher and T B (° C.) or lower” satisfying the following expression (1):
270≦T A <T B ≦350   (1)

2 . The joining silver sheet according to claim 1 , wherein both surfaces of the sheet each have an arithmetic average surface roughness Ra of 0.10 μm or less.

3 . The joining silver sheet according to claim 1 , wherein the silver sheet has a thickness of from 10 to 120 μm in terms of a thickness measured with a flat head micrometer.

4 . The joining silver sheet according to claim 1 , wherein the silver sheet has a projected shape viewed in a thickness direction that shows a pattern formed by printing.

5 . A method for manufacturing a joining silver sheet, comprising:
a step of coating, on a substrate, a silver paste containing silver powder containing silver particles having a particle diameter of from 1 to 250 nm, and a dispersion medium having a 25% volatilization temperature T 25 (° C.) defined by the following item (A) in a temperature range of 200° C. or lower, which are mixed with each other; a step of subjecting a coated film thus coated, to a heat treatment at a temperature range that is T 25 (° C.) or higher and causes no sintering of the silver particles, thereby performing volatilization of the dispersion medium; and a step of baking the coated film thus subjected to the heat treatment, at a temperature of from 170 to 250° C. under application of a pressure of from 5 to 35 MPa, thereby providing a silver sheet containing the silver particles integrated by sintering, (A) on subjecting the silver paste to thermogravimetric analysis (TG) by heating from ambient temperature at 10° C. per minute in the air, a temperature, at which the dispersion medium shows a weight reduction ratio according to the following expression (2) of 25% is designated as the 25% volatilization temperature T 25 (° C.):
(weight reduction ratio of dispersion medium (%))=((cumulative mass of dispersion medium having been volatilized by heating in thermogravimetric analysis (g))/(total mass of dispersion medium present in silver paste specimen before subjecting to thermogravimetric analysis (g)))×100   (2)

6 . The method for manufacturing a joining silver sheet according to claim 5 , wherein on coating the silver paste on the substrate, the silver paste is coated into a pattern by printing.

7 . A method for joining an electronic part, comprising: inserting the silver sheet according to claim 1 between an electronic part and a substrate, to which the electronic part is to be joined; and heating them to the temperature range of T A (° C.) or higher and T B (° C.) or lower, under application of a pressure to the electronic part and the substrate to make a contact surface pressure of the electronic part and the silver sheet of from 0.5 to 3 MPa.

Assignees

• Dowa Electronics Materials Co Ltd

Inventors

• Kurita Satoru
• Endoh Keiichi
• Miyoshi Hiromasa

Classifications

• B22F2999/00

  Aspects linked to processes or compositions used in powder metallurgy · CPC title

• B22F5/006 Primary

  of flat products, e.g. sheets (B22F3/1103 takes precedence; by using pressure rollers only see B22F3/18) · CPC title

• B23K2103/56

  being semiconducting · CPC title

• B23K35/3006

  Ag as the principal constituent · CPC title

• B23K2103/12

  Copper or alloys thereof · CPC title