Remote terminal unit (rtu) supporting elevated operating temperature and reduced power consumption

Patent metadata

Field	Value
Publication number	US-2016249483-A1
Application number	US-201514979068-A
Country	US
Kind code	A1
Filing date	Dec 22, 2015
Priority date	Feb 23, 2015
Publication date	Aug 25, 2016
Grant date	—

Abstract

An apparatus includes a remote terminal unit (RTU) having a housing, where at least a portion of the housing includes a shell of thermally-conductive material. The RTU also includes at least one circuit board assembly having at least one processing device configured to communicate with one or more industrial control and automation field devices via one or more input/output (I/O) channels. The at least one circuit board assembly is positioned within the shell. The RTU further includes a heat sink configured to remove thermal energy from the at least one processing device. In addition, the RTU includes a thermal pad configured to receive the thermal energy from the heat sink and to provide the thermal energy to the shell.

First claim

What is claimed is:

1 . An apparatus comprising:
a remote terminal unit (RTU) comprising:
a housing, at least a portion of the housing comprising a shell of thermally-conductive material;
at least one circuit board assembly comprising at least one processing device configured to communicate with one or more industrial control and automation field devices via one or more input/output (I/O) channels, the at least one circuit board assembly positioned within the shell;
a heat sink configured to remove thermal energy from the at least one processing device; and
a thermal pad configured to receive the thermal energy from the heat sink and to provide the thermal energy to the shell.

2 . The apparatus of claim 1 , wherein the at least one circuit board assembly comprises:
a first circuit board assembly comprising the one or more I/O channels; a second circuit board assembly comprising the at least one processing device; and a third circuit board assembly configured to be coupled to the first and second circuit board assemblies.

3 . The apparatus of claim 2 , wherein:
the first and second circuit board assemblies are located within and mounted to the shell; and a cover of the shell has openings through which the first and second circuit board assemblies are physically connected to the third circuit board assembly.

4 . The apparatus of claim 3 , wherein:
the at least one processing device contacts the thermal pad when the second circuit board assembly is mounted within the shell; and the thermal pad is deformable.

5 . The apparatus of claim 1 , wherein the RTU is configured to execute one or more control algorithms that are configured to reduce a power consumption of the RTU.

6 . The apparatus of claim 5 , wherein the one or more control algorithms are configured to monitor one or more characteristics of the RTU and reduce the power consumption of the RTU in response to at least one of the one or more characteristics exceeding an associated threshold value.

7 . The apparatus of claim 5 , wherein the one or more control algorithms are configured to disable one or more circuits within the RTU.

8 . The apparatus of claim 7 , wherein the one or more control algorithms are configured to disable one or more components within analog input I/O channels during idle periods in between sampling periods during which data on the analog input I/O channels is sampled.

9 . A system comprising:
one or more industrial control and automation field devices; and a remote terminal unit (RTU) comprising:
a housing, at least a portion of the housing comprising a shell of thermally-conductive material;
at least one circuit board assembly comprising at least one processing device configured to communicate with the one or more field devices via one or more input/output (I/O) channels, the at least one circuit board assembly positioned within the shell;
a heat sink configured to remove thermal energy from the at least one processing device; and
a thermal pad configured to receive the thermal energy from the heat sink and to provide the thermal energy to the shell.

10 . The system of claim 9 , wherein the at least one circuit board assembly comprises:
a first circuit board assembly comprising the one or more I/O channels; a second circuit board assembly comprising the at least one processing device; and a third circuit board assembly configured to be coupled to the first and second circuit board assemblies.

11 . The system of claim 10 , wherein:
the first and second circuit board assemblies are located within and mounted to the shell; and a cover of the shell has openings through which the first and second circuit board assemblies are physically connected to the third circuit board assembly.

12 . The system of claim 11 , wherein:
the at least one processing device contacts the thermal pad when the second circuit board assembly is mounted within the shell; and the thermal pad is deformable.

13 . The system of claim 9 , wherein the RTU is configured to execute one or more control algorithms that are configured to reduce a power consumption of the RTU.

14 . The system of claim 13 , wherein the one or more control algorithms are configured to monitor one or more characteristics of the RTU and reduce the power consumption of the RTU in response to at least one of the one or more characteristics exceeding an associated threshold value.

15 . The system of claim 13 , wherein the one or more control algorithms are configured to disable one or more circuits within the RTU.

16 . The system of claim 15 , wherein the one or more control algorithms are configured to disable one or more components within analog input I/O channels during idle periods in between sampling periods during which data on the analog input I/O channels is sampled.

17 . The system of claim 9 , wherein the one or more industrial control and automation field devices comprise:
at least one sensor; and at least one actuator.

18 . A method comprising:
operating at least one processing device on at least one circuit board assembly of a remote terminal unit (RTU), the at least one circuit board assembly positioned within a housing of the RTU, at least a portion of the housing comprising a shell of thermally-conductive material; using the at least one processing device, communicating with one or more industrial control and automation field devices via one or more input/output (I/O) channels; removing thermal energy from the at least one processing device using a heat sink; and receiving the thermal energy from the heat sink at a thermal pad and providing the thermal energy from the thermal pad to the shell.

19 . The method of claim 18 , wherein:
the at least one circuit board assembly comprises (i) a first circuit board assembly comprising the one or more I/O channels, (ii) a second circuit board assembly comprising the at least one processing device, and (iii) a third circuit board assembly configured to be coupled to the first and second circuit board assemblies; the first and second circuit board assemblies are located within and mounted to the shell; a cover of the shell has openings through which the first and second circuit board assemblies are physically connected to the third circuit board assembly; the at least one processing device contacts the thermal pad when the second circuit board assembly is mounted within the shell; and the thermal pad is deformable.

20 . The method of claim 18 , further comprising:
executing one or more control algorithms to reduce a power consumption of the RTU, wherein at least one of:
the one or more control algorithms monitor one or more characteristics of the RTU and reduce the power consumption of the RTU in response to at least one of the one or more characteristics exceeding an associated threshold value; and
the one or more control algorithms disable one or more circuits within the RTU.

Assignees

• Honeywell Int Inc

Inventors

• Lv Jie
• Zou Lei
• Yang Zhi

Classifications

• H05K7/20454

  with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste · CPC title

• H05K7/1479

  including decentralized modules, e.g. connected to other modules using fieldbus · CPC title

• H05K7/1468 Primary

  Mechanical features of input/output (I/O) modules · CPC title

• H05K7/20418 Primary

  the radiating structures being additional and fastened onto the housing · CPC title

• H05K5/0004

  Electricity · mapped topic