Pressure sensing device with cavity and related methods

Patent metadata

Field	Value
Publication number	US-2016245709-A1
Application number	US-201514626153-A
Country	US
Kind code	A1
Filing date	Feb 19, 2015
Priority date	Feb 19, 2015
Publication date	Aug 25, 2016
Grant date	—

Abstract

A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.

First claim

That which is claimed is:

1 . A pressure sensing device comprising:
a body configured to distribute a load applied between first and second parts positioned one against the other; and at least one pressure sensor carried by said body and comprising
a support body, and
an integrated circuit (IC) die mounted with said support body and defining a cavity therebetween, said IC die comprising
pressure sensing circuitry responsive to bending associated with the cavity, and
an IC interface coupled to said pressure sensing circuitry.

2 . The pressure sensing device of claim 1 wherein said IC interface includes a transceiver circuit, and electrically conductive antenna traces coupled thereto.

3 . The pressure sensing device of claim 2 wherein said at least one pressure sensor comprises at least one substrate adjacent said IC die and comprising additional electrically conductive antenna traces coupled to said transceiver circuit.

4 . The pressure sensing device of claim 2 further comprising an arm extension extending outwardly from said body; and wherein said electrically conductive antenna traces are carried by said arm extension.

5 . The pressure sensing device of claim 3 wherein said additional electrically conductive antenna traces surround said IC die.

6 . The pressure sensing device of claim 3 wherein said at least one substrate is canted with respect to said IC die.

7 . The pressure sensing device of claim 1 wherein said at least one pressure sensor comprises a bonding layer between said IC die and said support body.

8 . The pressure sensing device of claim 1 wherein said support body comprises at least one of a ceramic material, a glass material, and a silicon material.

9 . The pressure sensing device of claim 1 wherein said body has at least one slot therein; wherein said at least one pressure sensor is in said at least one slot; and further comprising encapsulation material in said at least one slot and surrounding said at least one pressure sensor.

10 . The pressure sensing device of claim 1 wherein said body comprises encapsulation material.

11 . A pressure sensing device comprising:
a body configured to distribute a load applied between first and second parts positioned one against the other; and at least one pressure sensor carried by said body and comprising
an integrated circuit (IC) die mounted with said body and defining a cavity with adjacent portions of said body, said IC die comprising
pressure sensing circuitry responsive to bending associated with the cavity, and
an IC interface coupled to said pressure sensing circuitry.

12 . The pressure sensing device of claim 11 wherein said at least one pressure sensor comprises at least one spacer layer adjacent said IC die.

13 . The pressure sensing device of claim 12 wherein said at least one spacer layer comprises a metallic material.

14 . The pressure sensing device of claim 11 wherein said IC interface includes a transceiver circuit, and electrically conductive antenna traces coupled thereto.

15 . The pressure sensing device of claim 14 wherein said at least one pressure sensor comprises at least one substrate adjacent said IC die and comprising additional electrically conductive antenna traces coupled to said transceiver circuit.

16 . The pressure sensing device of claim 14 further comprising an arm extension extending outwardly from said body; and wherein said electrically conductive antenna traces are carried by said arm extension.

17 . The pressure sensing device of claim 15 wherein said additional electrically conductive antenna traces surround said IC die.

18 . The pressure sensing device of claim 15 wherein said at least one substrate is canted with respect to said IC die.

19 . The pressure sensing device of claim 11 wherein said body has at least one slot therein; wherein said at least one pressure sensor is in said at least one slot; and further comprising encapsulation material in said at least one slot and surrounding said at least one pressure sensor.

20 . The pressure sensing device of claim 11 wherein said body comprises encapsulation material.

21 . A method of making a pressure sensing device, the method comprising:
forming a body to distribute a load applied between first and second parts positioned one against the other; and coupling at least one pressure sensor carried by the body and comprising
a support body, and
an integrated circuit (IC) die mounted with the support body and defining a cavity therebetween, the IC die comprising
pressure sensing circuitry responsive to bending associated with the cavity, and
an IC interface coupled to the pressure sensing circuitry.

22 . The method of claim 21 wherein the IC interface includes a transceiver circuit, and electrically conductive antenna traces coupled thereto.

23 . The method of claim 22 wherein the at least one pressure sensor comprises at least one substrate adjacent the IC die and comprising additional electrically conductive antenna traces coupled to the transceiver circuit.

24 . The method of claim 22 further comprising forming an arm extension extending outwardly from the body; and wherein the electrically conductive antenna traces are carried by the arm extension.

25 . The method of claim 23 wherein the additional electrically conductive antenna traces surround the IC die.

26 . The method of claim 23 wherein the at least one substrate is canted with respect to the IC die.

27 . The method of claim 21 wherein the at least one pressure sensor comprises a bonding layer between the IC die and the support body.

28 . The method of claim 21 wherein the support body comprises at least one of a ceramic material, a glass material, and a silicon material.

29 . The method of claim 21 wherein the body has at least one slot therein; wherein the at least one pressure sensor is in the at least one slot; and further comprising forming encapsulation material in the at least one slot and surrounding the at least one pressure sensor.

30 . The method of claim 21 wherein the body comprises encapsulation material.

31 . A method of making a pressure sensing device comprising:
forming a body configured to distribute a load applied between first and second parts positioned one against the other; and coupling at least one pressure sensor carried by the body and comprising
an integrated circuit (IC) die mounted with the body and defining a cavity with adjacent portions of the body, the IC die comprising
pressure sensing circuitry responsive to bending associated with the cavity, and
an IC interface coupled to the pressure sensing circuitry.

32 . The method of claim 31 wherein the at least one pressure sensor comprises at least one spacer layer adjacent the IC die.

33 . The method of claim 32 wherein the at least one spacer layer comprises a metallic material.

34 . The method of claim 31 wherein the IC interface includes a transceiver circuit, and electrically conductive antenna traces coupled thereto.

35 . The method of claim 34 wherein the at least one pressure sensor comprises at least one substrate adjacent the IC die and comprising additional electrically conductive antenna tr

Assignees

• St Microelectronics Srl

Inventors

• Pagani Alberto
• Ziglioli Federico Giovanni
• Murari Bruno

Classifications

• G01L5/243

  using washers · CPC title

• G01L1/205 Primary

  using distributed sensing elements · CPC title

• G01L1/20

  by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids (of piezo-resistive materials G01L1/18); by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress · CPC title

• G01L1/18

  using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title

• F16B31/028

  with a load-indicating washer or washer assembly · CPC title