Multi-sensor assembly

Patent metadata

Field	Value
Publication number	US-2016245706-A1
Application number	US-201514630050-A
Country	US
Kind code	A1
Filing date	Feb 24, 2015
Priority date	Feb 24, 2015
Publication date	Aug 25, 2016
Grant date	—

Abstract

One example discloses a multi-sensor assembly, comprising: a first temperature sensor, having a first thermal profile; a second temperature sensor, having a second thermal profile different from the first thermal profile; wherein the first and second temperature sensors are mounted on a set of lead-frames; wherein the first and second temperature sensors include a first heat path input coupled to an ambient environment, and a second heat path input coupled to at least one of the lead-frames; and wherein the first and second sensors and set of lead-frames are included in a single multi-sensor assembly. Another example discloses a method of manufacture for the multi-sensor assembly.

First claim

What is claimed is:

1 . A multi-sensor assembly, comprising:
a first temperature sensor, having a first thermal profile; a second temperature sensor, having a second thermal profile different from the first thermal profile; wherein the first and second temperature sensors are mounted on a set of lead-frames; wherein the first and second temperature sensors include a first heat path input coupled to an ambient environment, and a second heat path input coupled to at least one of the lead-frames; and wherein the first and second sensors and set of lead-frames are included in a single multi-sensor assembly.

2 . The assembly of claim 1 :
wherein the first thermal profile includes a first thermal resistance; wherein the second thermal profile includes a second thermal resistance; and wherein the first thermal resistance is different from the second thermal resistance.

3 . The assembly of claim 1 :
wherein the first thermal profile includes a first heat capacity; wherein the second thermal profile includes a second heat capacity; and wherein the first heat capacity is different from the second heat capacity.

4 . The assembly of claim 1 :
further comprising, an isolation layer, having a thermal resistance; wherein the second temperature sensor is coupled to the second heat path input through the isolation layer; wherein the first temperature sensor is not coupled to the second heat path input through the isolation layer; and wherein the first and second temperature sensors are not coupled to the first heat path input through the isolation layer.

5 . The assembly of claim 4 :
wherein a first side of the isolation layer is coupled to a top of the first temperature sensor and the second temperature sensor is coupled to a second side of the isolation layer, thereby forming a stacked first and second temperature sensor configuration.

6 . The assembly of claim 4 :
wherein one side of the isolation layer is coupled to a second lead-frame and the second temperature sensor is coupled to another side of the isolation layer; and wherein one side of an adhesive layer is coupled to a first lead-frame and the first temperature sensor is coupled to another side of the adhesive layer, thereby forming a side-by-side first and second temperature sensor configuration.

7 . The assembly of claim 6 :
wherein a thickness of the isolation layer is greater than that of a thickness of the adhesive layer.

8 . The assembly of claim 1 :
wherein a thickness of the isolation layer is at least 50 μm.

9 . The assembly of claim 6 :
wherein a thermal resistance of the isolation layer is greater than that of a thermal resistance of the adhesive layer.

10 . The assembly of claim 1 :
wherein the first temperature sensor includes a band-gap temperature sensor and the second temperature sensor includes a resistive-wire temperature sensor.

11 . The assembly of claim 1 :
wherein the multi-sensor assembly is substantially surrounded by an encapsulant.

12 . The assembly of claim 11 :
wherein the encapsulant includes an opening exposing the second temperature sensor.

13 . The assembly of claim 1 :
further comprising a processor coupled to the first and second temperature sensors and configured to filter the second heat path input from the first heat path input.

14 . The assembly of claim 1 :
further comprising a second isolation layer and a third temperature sensor; and wherein a first side of the second isolation layer is coupled to a top of the second temperature sensor and the third temperature sensor is coupled to a second side of the second isolation layer, thereby forming a triple-stacked first, second and third temperature sensor configuration.

15 . A method of manufacture, for a multi-sensor assembly, comprising:
fabricating a first temperature sensor, having a first thermal profile; fabricating a second temperature sensor, having a second thermal profile different from the first thermal profile; forming a first heat path between an ambient environment and the first and second temperature sensors; forming a second heat path between a set of lead-frames and the first and second temperature sensors; and including the first and second sensors and set of lead-frames in a single multi-sensor assembly.

16 . The method of claim 17 , further comprising:
adding an isolation layer in the second heat path between at least one of the lead-frames and the second temperature sensor.

17 . The method of claim 19 , further comprising:
coupling a first side of the isolation layer to a top of the first temperature sensor; and coupling the second temperature sensor to a second side of the isolation layer, thereby forming a stacked first and second temperature sensor configuration.

18 . The method of claim 17 , further comprising:
coupling one side of the isolation layer to a second lead-frame; coupling the second temperature sensor to another side of the isolation layer; coupling one side of an adhesive layer to a first lead-frame; and coupling the first temperature sensor to another side of the adhesive layer, thereby forming a side-by-side first and second temperature sensor configuration.

Assignees

• Nxp Bv

Inventors

• Zivkovic Zoran
• Phan Le Kim
• Suy Hilco

Classifications

• G01K7/16 Primary

  using resistive elements · CPC title

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K2201/10151

  Sensor · CPC title

• G01K1/20 Primary

  Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature · CPC title

• G01K7/427 Primary

  Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation · CPC title