Method to Integrate Multiple Electric Circuits into Organic Matrix Composite

Patent metadata

Field	Value
Publication number	US-2016245113-A1
Application number	US-201415027752-A
Country	US
Kind code	A1
Filing date	Oct 21, 2014
Priority date	Nov 21, 2013
Publication date	Aug 25, 2016
Grant date	—

Abstract

A method of forming a circuit in a composite component includes providing a plurality of preform modules comprised of an organic matrix composite material, applying at least one electrical circuit on at least first and second preform modules of the plurality of preform modules, and arranging the first and second preform modules such that the electrical circuit of the first preform module is in contact with the electrical circuit of the second preform module. An additional step includes molding the first and second preform modules together to form a one-piece molded component such that the electrical circuits of the first and second preform modules form a complete circuit.

First claim

1 . A method of forming a circuit in a composite component comprising the steps of:
(a) providing a plurality of preform modules comprised of an organic matrix composite material; (b) applying at least one electrical circuit on at least first and second preform modules of the plurality of preform modules; (c) arranging the first and second preform modules such that the electrical circuit of the first preform module is in contact with the electrical circuit of the second preform module; and (d) molding the first and second preform modules together to form a one-piece molded component such that the electrical circuits of the first and second preform modules form a complete circuit.

2 . The method according to claim 1 wherein the electrical circuit comprises electrical conductive circuits and/or resistance heat circuits.

3 . The method according to claim 1 wherein the electrical circuits include electrical traces or heater traces and wherein step (c) includes placing traces on the first preform module in direct contact with traces on the second preform module.

4 . The method according to claim 1 wherein step (b) includes applying a plurality of electrical circuits on the first and second preform modules, and step (c) includes arranging each electrical circuit on the first and second preform modules to contact an electrical circuit on at least one adjacent preform module of the plurality of preform modules.

5 . The method according to claim 1 wherein the preform modules of step (a) are uncured modules.

6 . The method according to claim 1 wherein step (c) includes arranging the plurality of preform modules within a mold, and including injecting resin into the mold subsequent to step (c).

7 . The method according to claim 1 including connecting at least one electrical connector to one of the first and second electrical circuits to provide a connection interface to a power supply.

8 . The method according to claim 1 where each preform module of the plurality of modules includes at least one electrical circuit, and wherein step (c) includes arranging the at least one electrical circuit of each preform module to be in direct contact with at least one electrical circuit on an adjacent preform module.

9 . The method according to claim 8 including placing all of the plurality of preform modules arranged in step (c) into a common mold prior to step (d).

10 . The method according to claim 1 wherein the complete circuit comprises a heating circuit that is selectively activated to heat the one-piece molded component.

11 . The method according to claim 1 wherein the complete circuit comprises an electrical power circuit used to transfer electric power from one portion of the one-piece molded component to another portion of the one-piece molded component without having to use wiring.

12 . The method according to claim 1 wherein the one-piece molded component comprises an aircraft component.

13 . A method of forming a circuit in composite component comprising the steps of:
(a) providing a plurality of preform modules, wherein a multitude of modules includes at least one electrical circuit portion applied to an external surface of the preform modules; (b) positioning the plurality of preform modules within a common mold such that the at least one electrical circuit portion of one of the preform modules is in direct contact with at least one electrical circuit portion on an adjacent preform module; and (c) molding the plurality of preform modules together to form a one-piece molded component such that the electrical circuit portions of the plurality of preform modules are permanently connected to form a complete circuit.

14 . The method according to claim 14 wherein the plurality of preform modules of step (a) are formed from an uncured organic matrix composite material.

15 . The method according to claim 14 wherein the electrical circuit portions comprise electrical conductive circuits and/or resistance heat circuits.

16 . The method according to claim 14 including connecting at least one electrical connector to one of the electrical circuit portions to provide a connection interface to a power supply.

17 . The method according to claim 16 wherein the at least one electrical connector comprises a single electrical connector that is used to power the complete circuit.

18 . The method according to claim 16 including dividing the complete circuit into a plurality of zones, and wherein the at least one electrical connector comprises a plurality of electrical connectors with at least one electrical connector being dedicated to each zone.

19 . A composite component comprising:
a plurality of preform modules that are attached to each other via a molded interface to form a one-piece molded component, and wherein a multitude of the plurality of preform modules include at least one electrical circuit portion applied to an external surface of an associated preform module, and wherein the electrical circuit portion of one of the preform modules is in direct contact with the electrical circuit portion of an adjacent preform module such that electrical circuit portions on the preform modules are permanently connected together to form a complete circuit within the one-piece molded component.

20 . The composite component according to claim 19 wherein the one-piece molded component comprises an aircraft component.

Assignees

• United Technologies Corp

Inventors

• Lyders David R
• Holyfiield Marc E
• Bell Kevin M

Classifications

• H05B3/42

  non-flexible · CPC title

• H05K1/0212

  Printed circuits or mounted components having integral heating means · CPC title

• F05D2260/20

  Heat transfer, e.g. cooling · CPC title

• F02K3/02

  in which part of the working fluid by-passes the turbine and combustion chamber · CPC title

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title