System And Method For High Power Diode Based Additive Manufacturing

Patent metadata

Field	Value
Publication number	US-2016243652-A1
Application number	US-201615145402-A
Country	US
Kind code	A1
Filing date	May 3, 2016
Priority date	Mar 5, 2013
Publication date	Aug 25, 2016
Grant date	—

Abstract

A system is disclosed for performing an Additive Manufacturing (AM) fabrication process on a powdered material forming a substrate. The system may make use of a diode array for generating an optical signal sufficient to melt a powdered material of the substrate. A mask may be used for preventing a first predetermined portion of the optical signal from reaching the substrate, while allowing a second predetermined portion to reach the substrate. At least one processor may be used for controlling an output of the diode array.

First claim

What is claimed is:

1 . A system for performing an Additive Manufacturing (AM) fabrication process on a powdered material forming a substrate, the system comprising:
an optical subsystem for generating an optical signal comprised of electromagnetic radiation sufficient to melt or sinter a powdered material of the substrate; a dynamically controllable, two dimensional mask for receiving the optical signal and controllably selecting portions of the optical signal passing therethrough such that a first selected portion of the optical signal passes through the mask, and a second selected portion of the optical signal also passes through the mask, the mask permitting one of the first and selected second portions to reach the powdered material, and the mask causing the other one of the first and second selected portions to be prevented from reaching the powdered material; and at least one processor which dynamically controls the mask.

2 . The system of claim 1 , wherein the optical subsystem comprises a diode array.

3 . The system of claim 2 , wherein the diode array is configured to provide a power density of at least about 10 kW/cm 2 at a two percent duty cycle.

4 . The system of claim 1 , wherein the mask comprises:
a liquid crystal module; and a polarizing element, the polarizing element operating to alter a polarization of the second portion of the optical signal after the second portion has passed through the liquid crystal module.

5 . The system of claim 1 , wherein the liquid crystal module comprises a computer controllable liquid crystal module configured to be digitally controlled by the processor.

6 . The system of claim 1 , wherein the polarizer comprises a polarizing mirror.

7 . A system for performing an Additive Manufacturing (AM) fabrication process on a powdered material forming a substrate, the system comprising:
a diode array for generating a pulsed optical signal forming electromagnetic radiation sufficient in optical intensity to melt a powdered material of the substrate; a mask configured to pass first and second portions of the optical signal through the mask, but to selectively control polarizations of the first or second portions to permit one of the first or second portions to reach the powdered material, and thus to melt the powdered material, while preventing the other one of the first or second portions from reaching the powdered material; and a processor for determining which one or more pixels of the mask need to be controlled in a manner such that only the one of the first or second portions of the optical signal reach the powdered material.

8 . The system of claim 7 , wherein the mask forms a liquid crystal polarization rotator having a liquid crystal module and a polarizer interposed between the diode array and the substrate, the liquid crystal polarization rotator operating to rotate a polarization of one or the other of the first or second portions of the pulsed optical signal passing therethrough while allowing the other to pass therethrough without being rotated, and the polarizer operating to reject the one of the first or second portions that has been rotated.

9 . The system of claim 8 , wherein the liquid crystal module of the mask includes a plurality of pixels arranged in a two dimensional pattern that are individually controlled.

10 . The system of claim 7 , wherein:
the diode array is configured to be electronically controlled; and wherein the processor is configured to electronically control the diode array to control on and off operation of the diode array.

11 . The system of claim 7 , wherein the mask is configured to be digitally controlled by the processor.

12 . The system of claim 7 , wherein the mask is electronically addressable by the processor to prevent selected areas of the substrate from being exposed to the pulsed optical signal from the diode array.

13 . The system of claim 7 , wherein the mask comprises a polarizing element.

14 . The system of claim 11 , wherein the polarizing element comprises a polarizing mirror disposed at a 45 degree angle from a plane that the pulsed optical signal from the diode array travels in.

15 . The system of claim 7 , wherein the diode array is configured to generate a power output of at least about 10 kW/cm 2 at a duty cycle of about two percent.

16 . A system for performing an Additive Manufacturing (AM) fabrication process on a powdered material forming a substrate, the system comprising:
a diode array for generating a pulsed optical signal sufficient in optical intensity to melt a powdered material of the substrate; a mask including a liquid crystal module and a polarizer disposed downstream of the liquid crystal module, the mask being controllable to pass a first portion of the optical signal through the mask without causing any polarization rotation of the first portion, and to pass a second portion of the optical signal through the mask but to cause a predetermined degree of polarization rotation of the second portion; one of the first and second portions being used to melt the powdered material, and the other of the first and second portions not being used to melt the powdered material; and a processor for dynamically controlling the mask so that only select portions of the powdered material are melted by the optical signal.

17 . The system of claim 14 , wherein the liquid crystal module comprises a computer controllable liquid crystal module configured to be digitally controlled by the processor.

18 . The system of claim 14 , wherein the diode array is comprised of a plurality of diode emitters.

19 . The system of claim 14 , wherein the liquid crystal module comprises a computer controllable liquid crystal module configured to be digitally controlled by the processor.

20 . The system of claim 14 , wherein:
the diode array is configured to be electronically controlled; and wherein the processor is configured to electronically control the diode array to control on and off operation of the diode array.

Assignees

• L Livermore Nat Security Llc

Inventors

• El-Dasher Bassem S
• Bayramian Andrew
• Demuth James A
• Farmer Joseph C
• Torres Sharon G

Classifications

• B22F10/20

  Direct sintering or melting · CPC title

• B22F10/30

  Process control · CPC title

• B22F12/55

  Two or more means for feeding material · CPC title

• B22F12/44

  characterised by the configuration of the radiation means · CPC title

• B22F12/43

  pulsed; frequency modulated · CPC title