Wiring board, and mounting structure and laminated sheet using the same

Patent metadata

Field	Value
Publication number	US-2016242283-A1
Application number	US-201415029335-A
Country	US
Kind code	A1
Filing date	Oct 29, 2014
Priority date	Oct 29, 2013
Publication date	Aug 18, 2016
Grant date	—

Abstract

A wiring board excellent in electrical reliability is provided. A wiring board includes a first resin layer; an inorganic insulating layer disposed on the first resin layer; a second resin layer disposed on the inorganic insulating layer; and a conductive layer disposed on the second resin layer. The inorganic insulating layer has a first region located in a vicinity of the second resin layer and a second region located on a side opposite to a second resin layer side of the first region. A content ratio of second inorganic insulating particles in the first region is lower than a content ratio of second inorganic insulating particles in the second regions.

First claim

1 . A wiring board, comprising:
a first resin layer; an inorganic insulating layer disposed on the first resin layer; a second resin layer disposed on the inorganic insulating layer; and a conductive layer disposed on the second resin layer, the inorganic insulating layer containing
a plurality of first inorganic insulating particles partly connected to each other and having a particle diameter of not less than 3 nm and not more than 15 nm;
a plurality of second inorganic insulating particles existing with the first inorganic insulating particles in between and having a particle diameter of not less than 35 nm and not more than 110 nm; and
a resin portion disposed in a gap between the plurality of first inorganic insulating particles, and
the inorganic insulating layer having a first region located in a vicinity of the second resin layer and a second region located on a side opposite to a second resin layer side of the first region, and a content ratio of the second inorganic insulating particles in the first region being lower than a content ratio of the second inorganic insulating particles in the second region.

2 . The wiring board according to claim 1 ,
wherein the second resin layer is lower in Young's modulus than the first resin layer.

3 . The wiring board according to claim 1 ,
wherein the first region contains, of the first inorganic insulating particles and the second inorganic insulating particles, only the first inorganic insulating particles.

4 . The wiring board according to claim 1 ,
wherein the resin portion has a first resin portion disposed in the first region, and the first resin portion is formed of a same resin as a second resin forming the second resin layer.

5 . The wiring board according to claim 1 ,
wherein the resin portion has a second resin portion disposed in the second region, and the second resin portion is formed of a same resin as a first resin forming the first resin layer.

6 . The wiring board according to claim 1 ,
wherein the first resin layer contains a first resin and a plurality of first filler particles dispersed in the first resin, the second resin layer contains a second resin and a plurality of second filler particles dispersed in the second resin, and a content ratio of the second filler particles in the second resin layer is lower than a content ratio of the first filler particles in the first resin layer.

7 . The wiring board according to claim 1 ,
wherein a thickness of the first region is smaller than a thickness of the second region.

8 . A mounting structure, comprising:
the wiring board according to claim 1 ; and an electronic component mounted on the wiring board and electrically connected to the conductive layer.

9 . A laminated sheet, comprising:
a support sheet; an uncured resin layer disposed on the support sheet; and an inorganic resin layer disposed on the uncured resin layer, the inorganic insulating layer containing
a plurality of first inorganic insulating particles partly connected to each other and having a particle diameter of not less than 3 nm and not more than 15 nm; and
a plurality of second inorganic insulating particles existing with the first inorganic insulating particles in between and having a particle diameter of not less than 35 nm and not more than 110 nm,
the inorganic insulating layer having a first region located in a vicinity of the uncured resin layer and a second region located on a side opposite to a uncured resin layer side of the first region, and a content ratio of the second inorganic insulating particles in the first region being lower than a content ratio of the second inorganic insulating particles in the second region.

10 . The laminated sheet according to claim 9 ,
wherein in a gap between the first inorganic insulating particles in the first region, a same resin as a resin forming the uncured resin layer is disposed.

Assignees

• Kyocera Corp

Inventors

• Hayashi Katsura

Classifications

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title

• H05K2201/0326

  Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO] · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title

• H05K2201/0266

  Size distribution · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title