Led module with high index lens

Patent metadata

Field	Value
Publication number	US-2016240754-A1
Application number	US-201615077255-A
Country	US
Kind code	A1
Filing date	Mar 22, 2016
Priority date	Sep 17, 2009
Publication date	Aug 18, 2016
Grant date	—

Abstract

An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.

First claim

What is claimed is:

1 . A method for manufacturing light-emitting diode (LED) modules in parallel, comprising:
molding a lens array of lenses; molding a housing array of housing bodies; bonding the lens array and the housing array to form a combined array; attaching LEDs to the housings in the combined array; and singulating the combined array to form individual LED modules.

2 . The method of claim 1 , further comprising:
bonding a metal pad array to the housing array or insert molding the metal pad array with the housing array to form metal pads on the back of the housings.

3 . The method of claim 2 , further comprising forming the metal grid with tabs for positioning the LED dies.

4 . The method of claim 1 , wherein the LEDs each comprises a submount and one or more LED dies on the submount, and the lenses each has a bottom surface larger than a top surface of each LED.

5 . The method of claim 1 , further comprising:
fixing wavelength converting elements to bottom of the lenses in the lens array, wherein:
each housing body comprises a top opening and a bottom opening coupled to the top opening, the top and the bottom openings comprise reflective or scattering sidewalls;
bonding the lens array and the housing array comprises locates the wavelength converting elements in the top opening of the housings; and
attaching the LED to the housings in the combined array comprises locating the LED in the bottom openings of the housing bodies.

6 . The method of claim 1 , further comprising:
separating one or more the lens array of lenses and the housing array into smaller arrays for processing.

7 . A method for manufacturing light-emitting diode (LED) modules in parallel, comprising:
molding a housing array of housings with housing bodies and lenses; attaching LEDs to the housings; and singulating the housing array to form individual LED modules.

8 . The method of claim 7 , further comprising:
bonding a metal pad array to the housing array or insert molding the metal pad array with the housing array to form metal pads on the back of the housings.

9 . The method of claim 8 , further comprising forming the metal grid with tabs for positioning the LEDs.

10 . The method of claim 7 , wherein attaching the LEDs to the housings comprises bonding each LED to corners stops of a bottom opening in, the corner stops providing an air gap between an emitting surface of the LED and the bottom surface of a lens.

11 . The method of claim 7 , wherein the LEDs each comprises a submount and one or more LED dies on the submount, and the lenses each has a bottom surface larger than a top surface of each LED.

12 . The method of claim 7 , further comprising separating the housing array into smaller arrays for processing.

Assignees

• Koninklijke Philips Nv
• Lumileds Llc

Inventors

• Bierhuizen Serge J
• Wang Nanze Patrick
• Eng Gregory W
• Sun Decai
• Wei Yajun

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/855 Primary

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/851

  Wavelength conversion means · CPC title

• H10H20/8506 Primary

  Containers · CPC title

• H10H20/882

  Scattering means (H10H20/82 takes precedence) · CPC title