Data Encoding in Solid-State Storage Devices
US-2015380087-A1 · Dec 31, 2015 · US
US2016240249A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016240249-A1 |
| Application number | US-201615040921-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 10, 2016 |
| Priority date | Jun 24, 2011 |
| Publication date | Aug 18, 2016 |
| Grant date | — |
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A resistance memory includes a resistance memory cell having a resistance memory element and a two-terminal access device in series. The two-terminal access device affects the current-voltage characteristic of the resistance memory cell. The resistance memory additionally includes a circuit to apply across the resistance memory cell a set pulse having a set polarity to set the resistance memory cell to a low-resistance state that is retained after application of the set pulse, a reset pulse having a reset polarity, opposite to the set polarity, to reset the resistance memory cell to a high-resistance state that is retained after application of the reset pulse, and a read pulse of the reset polarity and smaller in magnitude than the reset pulse to determine the resistance state of the resistance memory cell without changing the resistance state of the resistance memory cell.
Opening claim text (preview).
1 . (canceled) 2 . A resistance memory, comprising: a resistance memory cell including a resistance memory element formed of a resistive material, and an access device coupled in series with the resistance memory element; a circuit to apply a set pulse to the resistance memory cell, the set pulse having a set polarity to set the resistance memory cell to a low-resistance state, the circuit to apply a reset pulse having a reset polarity that is opposite the set polarity to reset the resistance memory cell to a high-resistance state, the circuit to apply a read pulse of the reset polarity to carry out a read operation; and wherein the resistance material exhibits the same material phase whether in the high-resistance state or the low-resistance state. 3 . The resistance memory of claim 2 , wherein the resistance material comprises a solid electrolyte. 4 . The resistance memory of claim 3 , wherein the solid electrolyte includes an electrolyte layer comprising GeS or GeSe. 5 . The resistance memory of claim 2 , realized as a conductive bridge random access memory (CBRAM). 6 . The resistance memory of claim 2 , wherein the resistance memory cell exhibits an asymmetric current-voltage (IV) characteristic. 7 . The resistance memory of claim 2 , wherein a magnitude of the reset pulse is larger than a magnitude of the set pulse. 8 . The resistance memory of claim 2 , wherein the access device comprises a tunnel diode. 9 . A resistance memory cell, comprising: a resistance memory element formed of a resistive material; an access device coupled in series with the resistance memory element; wherein: application of a set pulse having a set polarity to the resistance memory cell sets the resistance memory cell to a low-resistance state that is retained after application of the set pulse, and application of a reset pulse having a reset polarity to the resistance memory cell resets the resistance memory cell to a high-resistance state that is retained after application of the reset pulse, the set polarity being opposite to the reset polarity; application of a read pulse of the reset polarity determines the resistance state of the resistance memory cell; and wherein the resistance material exhibits the same material phase whether in the high-resistance state or the low-resistance state. 10 . The resistance memory cell of claim 9 , wherein the resistance material comprises a solid electrolyte. 11 . The resistance memory cell of claim 10 , wherein the solid electrolyte includes an electrolyte layer comprising GeS or GeSe. 12 . The resistance memory cell of claim 9 , realized as a conductive bridge random access memory (CBRAM). 13 . The resistance memory cell of claim 9 , wherein the resistance memory cell exhibits an asymmetric current-voltage (IV) characteristic. 14 . The resistance memory cell of claim 9 , wherein a magnitude of the reset pulse is larger than a magnitude of the set pulse. 15 . The resistance memory cell of claim 9 , wherein the access device comprises a tunnel diode. 16 . A method for reading a resistance memory cell, the method comprising: providing a resistance memory cell comprising an access device and a resistance memory element formed of a resistive material coupled in series, the resistance memory cell switchable from a high-resistance state to a low-resistance state by application of a set pulse having a set polarity, and switchable from the low-resistance state to the high-resistance state by application of a reset pulse having a reset polarity, the set polarity being opposite the reset polarity, the access device enabling bi-directional flow of current through the resistance memory cell in response to application of a voltage greater than a threshold voltage; applying to the resistance memory cell a read pulse of the reset polarity to read the resistance state of the resistance memory cell, wherein the read pulse is of a voltage that produces across the access device a voltage sufficient to reduce the dynamic resistance of the two-terminal access device to less than the resistance of the resistance memory element in the high-resistance state; and wherein the application of the set and reset pulses is carried out such that the resistance material exhibits the same material phase whether in the high-resistance state or the low-resistance state. 17 . The method of claim 16 , wherein the applying the read pulse of the reset polarity produces a read current having a larger read current ratio between the low-resistance state and the high-resistance state than applying a read pulse having the set polarity. 18 . The method of claim 16 , wherein the read pulse of the reset polarity is smaller in magnitude than the reset pulse. 19 . The method of claim 16 , wherein the read pulse of the reset polarity is of a voltage within a range of voltages that provide a read current ratio greater than 100 between the low-resistance state and the high-resistance state of the resistance memory cell. 20 . The method of claim 16 , wherein the resistance memory cell exhibits an asymmetric current-voltage (IV) characteristic. 21 . The method of claim 16 , wherein the switchability of the resistance memory cell from a high-resistance state to a low-resistance state is based on an electrolytic process.
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