Curved capacitive touch panel and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016239121-A1
Application number	US-201415022267-A
Country	US
Kind code	A1
Filing date	Sep 16, 2014
Priority date	Sep 27, 2013
Publication date	Aug 18, 2016
Grant date	—

Abstract

Provided is a curved capacitive touch panel including a curved capacitive touch panel substrate including: a transparent panel substrate; a decorative print layer disposed on a peripheral section of a rear surface of the transparent panel substrate; a step prevention layer flatly covering across a rear surface of the decorative print layer and inward of the decorative print layer on the rear surface of the transparent panel substrate; a sensor section including a transparent electrode layer that is disposed on a rear surface of the step prevention layer; and a transparent protective film covering the entire surface of the sensor section with the exception of a thermal compression bonding region substrate. The touch panel also includes an external connection substrate bonded by thermal compression to the thermal compression bonding region.

First claim

1 . A curved capacitive touch panel comprising
a curved capacitive touch panel substrate that is formed by thermally molding, into a three-dimensional shape, a capacitive touch panel substrate having a heat resistance temperature that is higher than a temperature of thermal molding and including: a transparent panel substrate including a transparent resin base material; a decorative print layer disposed on a peripheral section of a rear surface of the transparent panel substrate; a step prevention layer made from a transparent resin material and flatly covering across a rear surface of the decorative print layer and inward of the decorative print layer on the rear surface of the transparent panel substrate on which the decorative print layer is disposed; a sensor section including a transparent electrode layer that is disposed on a rear surface of the step prevention layer; and a transparent protective film covering the entirety of a rear surface of the sensor section with the exception of a thermal compression bonding region for an external connection substrate, and the external connection substrate that is bonded by thermal compression to the thermal compression bonding region of the sensor section.

2 . The curved capacitive touch panel of claim 1 , wherein
the transparent panel substrate is made from one or more transparent resin base materials from among acrylic resins, polycarbonate resins, cyclo-olefin polymer resins, and polyethylene terephthalate resins having a heat resistance temperature that is higher than the temperature of thermal molding of the curved capacitive touch panel substrate.

3 . The curved capacitive touch panel of claim 2 , wherein
the transparent panel substrate includes the transparent resin base material and a transparent resin layer disposed on one surface of the transparent resin base material and made from a different material to the transparent resin base material.

4 . A method of manufacturing a curved capacitive touch panel, comprising
a substrate preparation step of preparing a capacitive touch panel substrate having a heat resistance temperature that is higher than a temperature of thermal molding and including: a transparent panel substrate including a transparent resin base material; a decorative print layer disposed on a peripheral section of a rear surface of the transparent panel substrate; a step prevention layer made from a transparent resin material and flatly covering across a rear surface of the decorative print layer and inward of the decorative print layer on the rear surface of the transparent panel substrate on which the decorative print layer is disposed; a sensor section including a transparent electrode layer that is disposed on a rear surface of the step prevention layer; and a transparent protective film covering the entirety of a rear surface of the sensor section with the exception of a thermal compression bonding region for an external connection substrate, a thermal molding step of preparing a curved capacitive touch panel substrate by thermally molding, into a three-dimensional shape, the capacitive touch panel substrate prepared in the substrate preparation step, and a thermal compression bonding step of bonding the external connection substrate, by thermal compression, to the thermal compression bonding region of the sensor section of the curved capacitive touch panel substrate prepared in the thermal molding step.

Assignees

• Dexerials Corp

Inventors

• Murakami Yukio
• Imamura Yoshiaki
• Odagiri Hirokazu

Classifications

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F3/0416

  Control or interface arrangements specially adapted for digitisers · CPC title

• G06F3/044 Primary

  by capacitive means · CPC title

• G06F3/0443 Primary

  using a single layer of sensing electrodes · CPC title