Electronic devices with multi-layer heat reduction components

Patent metadata

Field	Value
Publication number	US-2016239056-A1
Application number	US-201514622433-A
Country	US
Kind code	A1
Filing date	Feb 13, 2015
Priority date	Feb 13, 2015
Publication date	Aug 18, 2016
Grant date	—

Abstract

In one example in accordance with the present disclosure an electronic device with a multi-layer heat reduction component is described. The device includes a number of integrated circuits and a first layer in contact with at least one of the number of integrated circuits to remove heat from at least one integrated circuit. The device also includes a second layer separated from the first layer by an air gap to reduce heat transfer between the first layer and the second layer. The second layer is retractable to expose the first layer when docked to a station. The electronic device operates in a first mode when docked to a station and a second mode when not docked to the station.

First claim

What is claimed is:

1 . An electronic device with a multi-layer heat reduction component, the device comprising:
a number of integrated circuits; a first layer in contact with at least one of the number of integrated circuits to remove heat from at least one integrated circuit; and a second layer separated from the first layer by an air gap to reduce heat transfer between the first layer and the second layer, in which:
the second layer is retractable to expose the first layer when docked to a station:
the electronic device to operate in a first mode when docked to a station and to operate in a second mode when not docked to the station.

2 . The electronic device of claim 1 , in which the second layer forms at least part of an outer cover of the electronic device.

3 . The electronic device of claim 1 , in which the air gap is at least 2 millimeters (mm) thick.

4 . The electronic device of claim 1 , in which the electronic device has a 35 watt (W) thermal design power (TDP) processor to provide power to a separate electronic device.

5 . The electronic device of claim 1 , in which the electronic device is sized to be portable.

6 . The electronic device of claim 1 , in which:
when docked, the electronic device operates with a thermal design power of at least 35 watts; and when not docked, the electronic device operates with a thermal design power of less than 5 watts.

7 . A system for powering an electronic device with a multi-layer heat reduction component, the system comprising:
an electronic device comprising:
a number of integrated circuits;
a multi-layer heat reduction component comprising a retractable outer layer to, when docked, expose an inner layer to a cooling system of a docking station;
in which the retractable outer layer is separated from the inner layer by an air gap; and
a docking station to, when selectively coupled to the electronic device:
allow the electronic device to operate in a high power mode; and
cool the electronic device via a cooling system of the docking station;
in which the electronic device operates in a low power mode when not docked.

8 . The system of claim 7 , in which the cooling system comprises liquid cooling coils to remove heat from the electronic device when the retractable outer layer is retracted.

9 . The system of claim 8 , in which the liquid cooling coils are adjacent to the inner layer when the retractable outer layer is retracted.

10 . The system of claim 7 , in which the cooling system comprises a fan to remove heat from the docking station.

11 . The system of claim 7 , in which the electronic device comprises a retraction feature that upon activation retracts the retractable outer layer of the multi-layer heat reduction component to expose the inner layer.

12 . The system of claim 11 , in which the retraction feature is activated by a corresponding trigger on the docking station.

13 . An electronic device with a multi-layer heat reduction component, the electronic device comprising:
a number of integrated circuits; a multi-layer heat reduction component comprising:
a first layer coupled to at least one of the number of integrated circuits to remove heat from the at least one integrated circuit; and
a second layer separated from the first layer by an air gap to reduce a thermal output of the electronic device, the electronic device to operate in at least a higher power docked mode and lower power mobile mode; and
a sensor system to:
indicate when the electronic device is in an enclosed environment; and
place an electronic device in an enclosed environment n a standby mode until an output of the sensor system is de-asserted.

14 . The electronic device of claim 13 , further comprising, a retraction feature to retract the second layer upon activation, in which the retraction feature is activated by an electronic signal from a separate electronic device to which the electronic device supplies processing power.

15 . The electronic device of claim 13 , in which the sensor is a light sensor that detects ambient light.

Assignees

• Hewlett Packard Development Co Lp

Inventors

• Saroor Shaheen
• Brooks Robert C
• Biggs Kent E
• Castell Robin T

Classifications

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/1632

  External expansion units, e.g. docking stations · CPC title