Thermal interface material and method of making and using the same

Patent metadata

Field	Value
Publication number	US-2016237332-A1
Application number	US-201615140173-A
Country	US
Kind code	A1
Filing date	Apr 27, 2016
Priority date	Mar 2, 2009
Publication date	Aug 18, 2016
Grant date	—

Abstract

A thermal interface material comprises a polymeric elastomer material, a thermally conductive filler, and a coupling agent, along with other optional components. In one exemplary heat transfer material, a coupling agent having the formula:

where Y is either a cyclic structure or Y is represented by Formula II:

where:
a=1 or 2 b=2 or 3 R 1 contains at least one of a neoalkoxy group, an ether group, or a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl group R′ 2 and R″ 2 are independently selected from Hydrogen, a neoalkoxy group, an ether group, and a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl group X=Group four transition metal; and where a=1, R 3 contains at least one of a neoalkoxy group, an ether group, or a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl group; or where a=2, the two R 3 groups independently contain at least one of a neoalkoxy group, an ether group, or a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl groups or the two R 3 groups together form an alkyldiolato group and, if Y is a cyclic structure, X is a member of the cyclic structure and the cyclic structure also contains a pyrophosphate group such as Formula II shown above.

First claim

1 . A heat transfer material comprising:
a polymeric elastomer material selected from a silicone-containing rubber and a hydrocarbon rubber; a wax; a thermally conductive filler; and a coupling agent represented by formula I:

wherein Y is a cyclic structure or Y is represented by Formula II:

wherein:
a=1 or 2;
b=2 or 3;
R 1 contains at least one of a neoalkoxy group, an ether group, and a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl group;
R′ 2 and R″ 2 are independently selected from Hydrogen, a neoalkoxy group, an ether group, and a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl group
X=Group four transition metal; and
wherein when a=1, R 3 contains at least one of a neoalkoxy group, an ether group, or a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl group;
wherein when a=2, the two R 3 groups independently contain at least one of a neoalkoxy group, an ether group, or a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl groups or the two R 3 groups together form an alkyldiolato group and,

when Y is a cyclic structure, X is a member of the cyclic structure and the cyclic structure also contains a pyrophosphate group.

2 . The material of claim 1 , wherein the coupling agent is represented by Formula III:

wherein:
c=1 or 2
d=2 or 3
R 4 contains at least one of a neoalkoxy group, an ether group, or a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl group
R 5 contains at least one of a neoalkoxy group, an ether group, or a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl group
X=Group four transition metal; and
where c=1, R 6 contains at least one of a neoalkoxy group, an ether group, or a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl group; or
where c=2, the two R 6 groups independently contain at least one of a neoalkoxy group, an ether group, or a C2-C30 straight or branched alkyl, alkenyl, alkynyl, aralkyl, aryl, or alkaryl groups or the two R 6 groups together form an alkyldiolato group.

3 . The material of claim 1 , wherein the polymeric elastomer material comprises hydrogenated polybutadiene.

4 . The material of claim 1 , wherein the thermally conductive filler comprises particles of a metal selected from the group consisting of: silver, aluminum, copper and alloys thereof.

5 . The material of claim 1 , wherein X is titanium or zirconium.

6 . The material of claim 1 , wherein the coupling agent is titanium IV 2,2 (bis 2-propenolatomethyl)butanolato, tris(dioctyl) pyrophosphato-O.

7 . The material of claim 1 , wherein the coupling agent is zirconium IV 2,2 (bis 2-propenolatomethyl)butanolato, tris(diisooctyl) pyrophosphato-O.

8 . The material of claim 1 , wherein the coupling agent is titanium IV 2-propanolato, tris(dioctyl)-pyrophosphato-O) adduct with 1 mole of diisooctyl phosphite.

9 . The material of claim 1 , wherein the coupling agent is titanium IV bis(dioctyl)pyrophosphato-O,oxoethylenediolato, (Adduct), bis(dioctyl) (hydrogen)phosphite-O.

10 . The material of claim 1 , wherein the coupling agent is titanium IV bis(dioctyl)pyrophosphato-O, ethylenediolato (adduct), bis(dioctyl)hydrogen phosphite.

11 . The material of claim 1 , wherein the coupling agent is zirconium IV 2,2-bis (2-propenolatomethyl) butanolato, cyclo di[2,2-(bis 2-propenolatomethyl) butanolato], pyrophosphato-O,O.

12 - 17 . (canceled)

18 . An assembly comprising a semiconductor die, a heat sink disposed adjacent the semiconductor die and a thermooxidatively stable thermal interface material disposed between the semiconductor die and the heat sink, the thermal interface material comprising the heat transfer material of claim 1 .

19 - 20 . (canceled)

21 . The assembly of claim 18 , further comprising a heat spreader disposed adjacent the semiconductor die with the heat sink being disposed adjacent the heat spreader, wherein the thermal interface material is disposed between and contacting both the heat spreader and the semiconductor die.

22 . The assembly of claim 18 , further comprising a heat spreader disposed adjacent the semiconductor die with the heat sink being disposed adjacent the heat spreader, wherein the thermal interface material is disposed between and contacting both the heat spreader and the heat sink.

23 . (canceled)

24 . An electronic device comprising an assembly, the assembly having a semiconductor die, a heat sink disposed adjacent the semiconductor die and a thermooxidatively stable thermal interface material disposed between the semiconductor die and the heat sink, the thermal interface material comprising the heat transfer material of claim 1 .

25 . The material of claim 1 , wherein the polymeric elastomer material comprises a hydrocarbon rubber selected from the group consisting of: a saturated rubber compound, an unsaturated rubber compound, and blends thereof.

26 . The material of claim 25 , wherein the polymeric elastomer material comprises a rubber selected from the group consisting of: an ethylene-propylene rubber, a polyethylene/butylene, a polyethylene-butylene-styrene, a polyethylene-propylene-styrene, a hydrogenated polyalkyldiene mono-ol, a hydrogenated polyalkyldiene diol, a hydrogenated polyisoprene, polyolefin elastomer, and blends thereof.

27 . The material of claim 26 , wherein the polymeric elastomer material comprises a hydrogenated polyalkyldiene mono-ol or hydrogenated polyalkyldiene diol selected from the group consisting of: a hydrogenated polybutadiene mono-ol, a hydrogenated polypropadiene mono-ol, a hydrogenated polypentadiene mono-ol, a hydrogenated polybutadiene diol, a hydrogenated polypropadiene diol, and a hydrogenated polypentadiene diol.

28 . The material of claim 25 , wherein the polymeric elastomer material comprises an unsaturated rubber selected from the group consisting of: polybutadiene, polyisoprene, polystyrene-butadiene, and blends thereof.

29 . The material of claim 1 , wherein the polymeric elastomer material comprises a silicone-containing rubber selected from the group consisting of a silicone rubber, a siloxane rubber, and a siloxane copolymer.

Assignees

• Honeywell Int Inc

Inventors

• Merrill Natalie A
• Delano Andrew D
• Steele David E

Classifications

• H10W40/251

  Organics · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H01L23/373

  Electricity · mapped topic

• H01L23/367

  Electricity · mapped topic