Gas Enclosure Systems and Methods Utilizing Multi-Zone Circulation and Filtration

Patent metadata

Field	Value
Publication number	US-2016236494-A1
Application number	US-201615046381-A
Country	US
Kind code	A1
Filing date	Feb 17, 2016
Priority date	Jul 18, 2014
Publication date	Aug 18, 2016
Grant date	—

Abstract

The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices. Accordingly, various embodiments of a gas circulation and filtration system as disclosed herein can effectively remove both airborne particulate matter, as well as particulate matter generated proximal to a substrate during a printing process. As such, various embodiments of a gas circulation and filtration system in conjunction with various embodiments of a gas purification system of the present teachings can provide for a controlled manufacturing environment resulting in a high-yield of OLED various devices.

First claim

What is claimed is:

1 . (canceled)

2 . A method for printing comprising:
housing a printing system in a gas enclosure defining an interior, wherein the gas enclosure is configured to provide a controlled processing environment for an enclosed printing system; circulating gas in a tunnel circulation and filtration zone, wherein a tunnel circulation and filtration system is configured to provide circulation and filtration of gas in a tunnel enclosure section of the gas enclosure; circulating gas in a bridge circulation and filtration zone, wherein a bridge circulation and filtration system is configured to provide circulation and filtration in a printing system bridge enclosure section of the gas enclosure; positioning a substrate proximal to a printhead assembly, wherein a motion system of the printing system is configured to provide relative motion between the substrate and the printhead assembly; and depositing an ink in a desired location on the substrate.

3 . The method of claim 2 , wherein the tunnel circulation and filtration system provides circulation and filtration of gas across the direction of substrate travel.

4 . The method of claim 2 , wherein the gas circulated in the bridge circulation and filtration system provides circulation and filtration of gas away from the substrate positioned proximal to the printhead assembly.

5 . The method of claim 2 , wherein the deposition of an ink forms a patterned layer.

6 . The method of claim 5 , wherein the patterned layer is an organic encapsulation layer.

7 . The method of claim 5 , wherein the patterned layer is at least one of an OLED stack layer.

8 . The method of claim 2 , wherein the controlled processing environment is a controlled gas environment.

9 . The method of claim 8 , wherein the controlled gas environment is maintained below specified limits of reactive gaseous species.

10 . The method of claim 9 , wherein the reactive gaseous species are water vapor, ozone, and oxygen that are maintained below 100 parts-per-million for each species.

11 . The method of claim 8 , wherein the controlled gas environment is maintained at or near atmospheric pressure.

12 . The method of claim 8 , wherein the controlled gas environment is a non-reactive gas environment.

13 . The method of claim 12 , wherein the non-reactive gas environment is maintained using nitrogen.

14 . The method of claim 2 , wherein the controlled processing environment is maintained below specified limits of particulate contamination level.

15 . The method of claim 14 , wherein the specified limit of particulate contamination level comprises an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 2 μm in size.

16 . The method of claim 2 , wherein a thermal regulation system is configured to provide a thermally controlled process environment.

17 . The method of claim 2 , wherein the printing system is configured to perform a printing procedure on a substrate having a size of about generation 3.5 to about generation 10 .

Assignees

• Kateeva Inc

Inventors

• Mauck Justin
• Ko Alexander Sou-Kang
• Vronsky Eliyahu
• Iyengar Prahallad
• Pun Digby

Classifications

• B41J2/01

  Ink jet · CPC title

• B41J29/377

  Cooling or ventilating arrangements · CPC title

• B01D46/0039

  with flow guiding by feed or discharge devices · CPC title

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• B41J29/06 Primary

  Special supports, platforms or trolleys for supporting machines on tables · CPC title