Microfluidic delivery member with filter and method of forming same

Patent metadata

Field	Value
Publication number	US-2016236471-A1
Application number	US-201615138997-A
Country	US
Kind code	A1
Filing date	Apr 26, 2016
Priority date	Jun 20, 2014
Publication date	Aug 18, 2016
Grant date	—

Abstract

Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

First claim

1 . A method comprising:
securing a plurality of filters to a first surface of a printed circuit board strip, the plurality of filters covering a plurality of through holes, respectively, in the printed circuit board; and securing a plurality of semiconductor dice to a second, opposite surface of the printed circuit board strip, the plurality of semiconductor dice covering the plurality of through holes, respectively, the plurality of semiconductor dice including an inlet path in fluid communication with the plurality of through holes, respectively, and having nozzles for expelling a fluid.

2 . The method of claim 1 , further comprising forming the plurality of through holes in the printed circuit board strip prior to securing the plurality of filters to the first surface of the printed circuit board strip.

3 . The method of claim 1 , wherein securing the plurality of filters comprises:
attaching the filters to the first surface of a printed circuit board strip using adhesive material; and exposing the adhesive material to heat or ultraviolet radiation to set the adhesive material.

4 . The method of claim 1 , further comprising forming a plurality of liners on sidewalls delimiting the through holes, respectively, in the printed circuit board.

5 . The method of claim 4 , wherein the plurality of liners are made from a metal material.

6 . The method of claim 1 , further comprising placing mechanical spacers between the filters and the first surface of the printed circuit board strip.

7 . The method of claim 6 , wherein placing the mechanical spacers comprises forming a solder mask layer on the printed circuit board strip, the solder mask layer including a raised portion around each through hole for forming the mechanical spacers.

8 . The method of claim 1 , further comprising separating the printed circuit board strip into a plurality of microfluidic delivery members.

9 . The method of claim 1 , wherein securing the plurality of semiconductor dice to the second, opposite surface of the printed circuit board strip includes using a screen printing technique to dispense the adhesive material on the second, opposite surface of the printed circuit board strip and placing the semiconductor dice in contact with the adhesive material.

10 . A method comprising:
coupling a filter to a first surface of a printed circuit board so that the filter is located over a through hole in the printed circuit board; and coupling a semiconductor die to the filter, the semiconductor die including an inlet path, wherein upon coupling the filter to the first surface of the printed circuit board and coupling the semiconductor die to the filter, the inlet path of the semiconductor die is located over the through hole in the printed circuit board.

11 . The method of claim 10 , wherein the step of coupling the semiconductor die to the filter occurs before the step of coupling the filter to the first surface of the printed circuit board.

12 . The method of claim 10 , wherein coupling the filter comprises using adhesive material to couple the filter to the first surface of the printed circuit board.

13 . The method of claim 12 , wherein coupling the filter to the first surface of the printed circuit board comprises applying adhesive to at least one of the filter and the first surface of the printed circuit board and placing the filter in contact with the first surface of the printed circuit board.

14 . The method of claim 12 , wherein the adhesive material also functions as a first mechanical spacer that places the filter a distance from the first surface of the printed circuit board.

15 . The method of claim 10 , further comprising providing a liner on sidewalls delimiting the through hole of the printed circuit board.

16 . The method of claim 15 , wherein providing the liner comprises depositing a metal material on the sidewalls delimiting the through hole.

17 . The method of claim 15 , wherein providing the liner comprises forming a liner from a molding material and securing the liner to the sidewalls delimiting the through hole.

18 . A microfluidic delivery member comprising:
a printed circuit board having first and second surfaces, the printed circuit board including a through hole that extends from the first surface to the second surface; a liner in the through hole; and a semiconductor die having first and second surfaces and an inlet path, the semiconductor die secured to the first surface of the printed circuit board with the inlet path in fluidic communication with the through hole of the printed circuit board, the second surface of the die including a plurality of nozzles that are in fluid communication with the inlet path, the plurality of nozzles being configured to expel a fluid received through the through hole of the printed circuit board.

19 . The microfluidic delivery member of claim 18 , wherein the liner is a polymer material or a metal material that covers sidewalls of the printed circuit board formed by the through hole.

20 . The microfluidic delivery member of claim 18 , further comprising a filter between the semiconductor die and the first surface of the printed circuit board, wherein the filter secures the semiconductor die to the first surface of the printed circuit board.

21 . The microfluidic delivery member of claim 18 , further comprising a filter, wherein the liner secures the filter to the second surface of the printed circuit board and covers the through hole.

22 . The microfluidic delivery member of claim 18 , wherein the liner has a first portion that extends onto the first surface of the printed circuit board and second portion that extends onto the second surface of the printed circuit board.

Assignees

• St Microelectronics Inc
• St Microelectronics Srl
• St Microelectronics Asia Pacific Pte Ltd

Inventors

• Dodd Simon
• Scheffelin Joe
• Gruenbacher Dana
• Brioschi Roberto
• Neo Teck Khim
• Hunt Dave
• Sherman Faiz

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title