Abrasive grindstone

US2016236325A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016236325-A1
Application numberUS-201615042556-A
CountryUS
Kind codeA1
Filing dateFeb 12, 2016
Priority dateFeb 13, 2015
Publication dateAug 18, 2016
Grant date

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An abrasive grindstone for grinding a workpiece is disclosed. The abrasive grindstone includes diamond abrasive grains and a boron compound. The diamond abrasive grains and the boron compound are compounded at a predetermined volume ratio. The average grain size Y of the diamond abrasive grains is set to 0 μm<Y≦50 μm. The average grain size ratio Z of the boron compound to the diamond abrasive grains is set to 0.8≦Z≦3.0. Preferably, the workpiece is a silicon wafer, and the average grain size ratio Z is set to 0.8≦Z≦2.0.

First claim

Opening claim text (preview).

What is claimed is: 1 . An abrasive grindstone for grinding a workpiece, comprising diamond abrasive grains and a boron compound; said diamond abrasive grains and said boron compound being compounded at a predetermined volume ratio; an average grain size Y of said diamond abrasive grains being set to 0 μm<Y≦50 μm; an average grain size ratio Z of said boron compound to said diamond abrasive grains being set to 0.8≦Z≦3.0. 2 . The abrasive grindstone according to claim 1 , wherein said workpiece is a silicon wafer, and said average grain size ratio Z is set to 0.8≦Z≦2.0. 3 . The abrasive grindstone according to claim 1 , wherein said predetermined volume ratio between said diamond abrasive grains and said boron compound is set to 1:1 to 1:3. 4 . The abrasive grindstone according to claim 1 , wherein said boron compound is selected from the group consisting of boron carbide, cubic boron nitride (CBN), and hexagonal boron nitride (HBN).

Assignees

Inventors

Classifications

  • metallic {or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements} · CPC title

  • Resins {or natural or synthetic macromolecular compounds (B24D3/22 takes precedence)} · CPC title

  • Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents · CPC title

  • B24D3/34Primary

    characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties · CPC title

  • ceramic, i.e. vitrified bondings · CPC title

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Frequently asked questions

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What does patent US2016236325A1 cover?
An abrasive grindstone for grinding a workpiece is disclosed. The abrasive grindstone includes diamond abrasive grains and a boron compound. The diamond abrasive grains and the boron compound are compounded at a predetermined volume ratio. The average grain size Y of the diamond abrasive grains is set to 0 μm<Y≦50 μm. The average grain size ratio Z of the boron compound to the diamond abrasive …
Who is the assignee on this patent?
Disco Corp
What technology area does this patent fall under?
Primary CPC classification B24D3/34. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Aug 18 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).