Pressure structure and pressure unit
US-2016286687-A1 · Sep 29, 2016 · US
US2016233597A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016233597-A1 |
| Application number | US-201615017567-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 5, 2016 |
| Priority date | Feb 6, 2015 |
| Publication date | Aug 11, 2016 |
| Grant date | — |
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An electrical device may include a housing, a printed circuit board arranged in the housing, an electrical component arranged in electrical contact with the printed circuit board, and a clamp. The clamp may be configured to bias the electrical component against a cooling structure disposed in the housing and hold the printed circuit board in the housing relative to the housing. The clamp may include a clamp snap-in structure forming at least part of a snap-in connection with the housing.
Opening claim text (preview).
1 . An electrical device, comprising: a housing, a printed circuit board arranged in the housing, an electrical component arranged in electrical contact with the printed circuit board, and a clamp configured to bias the electrical component against a cooling structure disposed in the housing and hold the printed circuit board in the housing relative to the housing, wherein the clamp includes a clamp snap-in structure forming at least part of a snap-in connection with the housing. 2 . The device according to claim 1 , wherein the clamp rests against the printed circuit board exclusively on one side of the printed circuit board. 3 . The device according to claim 1 , wherein the clamp is connected to at least one of the printed circuit board and the housing without fasteners. 4 . The device according to claim 1 , wherein the clamp further includes a clamp engagement structure arranged away from the clamp snap-in structure and forming an engagement with the housing. 5 . The device according to claim 1 , wherein the clamp surrounds at least one of the printed circuit board and the electrical component in a radiation-isolating manner. 6 . The device according to claim 1 , wherein: the clamp has a first clamp section which biases the electrical component against the cooling structure, the clamp has a second clamp section which extends inclined with respect to the first clamp section, and the first clamp section includes a clamp engagement structure forming an engagement with the housing and the second clamp section includes the clamp snap-in structure. 7 . The device according to claim 6 , wherein at least one of the clamp engagement structure projects from the first clamp section and the clamp snap-in structure projects from the second clamp section. 8 . The device according to claim 6 , wherein the second clamp section mounts the printed circuit board in the housing relative to the housing. 9 . The device according to claim 1 , wherein the housing includes a ridge on a side facing towards the printed circuit board, and wherein the printed circuit board rests on the ridge. 10 . The device according to claim 9 , wherein the clamp has a locating element associated with the ridge, and wherein the locating element projects towards the printed circuit board from the clamp and pushes the printed circuit board against the ridge. 11 . The device according to claim 1 , wherein the clamp further includes at least one holding structure facing towards the printed circuit board arranged to hold the printed circuit board on the clamp. 12 . The device according to claim 1 , wherein the clamp is at least one of formed from one piece and composed of a single material. 13 . The device according to claim 1 , wherein the cooling structure on an outer side that faces away from the electrical component is exposed at least partially to a surrounding environment. 14 . The device according to claim 1 , further comprising a cover closing the housing. 15 . The device according to claim 2 , wherein the clamp is composed of a radiation-isolating material and surrounds at least the printed circuit board. 16 . The device according to claim 3 , wherein the clamp is contoured to include the clamp snap-in structure at one free end and further includes a clamp engagement structure at another free end, wherein the clamp engagement structure forms an engagement with the housing. 17 . The device according to claim 16 , wherein: the clamp has a first clamp section biasing the electrical component against the cooling structure; the clamp has a second clamp section extending inclined to the first clamp section; and the first clamp section includes the clamp engagement structure and the second clamp section includes the clamp snap-in structure. 18 . The device according to claim 17 , wherein the second clamp section mounts the printed circuit board in the housing relative to the housing. 19 . The device according to claim 6 , wherein the first clamp section further includes at least one holding structure facing towards the printed circuit board arranged to mount the printed circuit board on the clamp. 20 . An electrical device, comprising: a housing; a printed circuit board arranged in the housing; an electrical component arranged in the housing and in electrical contact with the printed circuit board; a cooling structure arranged in the housing; a clamp arranged in the housing, wherein the clamp has a first clamp section biasing the electrical component against the cooling structure and a second clamp section extending transversely to the first clamp section configured to mount the printed circuit board in the housing relative to the housing; and wherein the second clamp section includes a clamp snap-in structure defining a snap-in connection with the housing and the first clamp section includes a clamp engagement structure forming an engagement with the housing.
Pressing means used to urge contact, e.g. springs · CPC title
Additional means for holding or locking coupling parts together, after engagement, {e.g. separate keylock, retainer strap} · CPC title
using a leaf spring to bias the conductor toward the busbar · CPC title
not integral with the coupling device · CPC title
co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit (H01R12/72 takes precedence) · CPC title
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