On-chip terahertz thin-film devices
US-2024429627-A1 · Dec 26, 2024 · US
US2016233571A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016233571-A1 |
| Application number | US-201514963162-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 8, 2015 |
| Priority date | Dec 8, 2014 |
| Publication date | Aug 11, 2016 |
| Grant date | — |
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A circuit board assembly for an electronic device, comprising: a main circuit board provided with a ground plane and at least one electronic component for performing one or more functions of the electronic device; a wireless module board spaced apart from and over the main circuit board, the wireless module board being provided with a feed line and at least one wireless module for performing wireless operations; and an antenna element for wireless communication, the antenna element comprising a resonating element, a first connection element connected to the feed line of the wireless module board and a second connection element connected to the main circuit board.
Opening claim text (preview).
1 . A circuit board assembly for an electronic device, comprising: a main circuit board provided with a ground plane and at least one electronic component for performing one or more functions of the electronic device; a wireless module board spaced apart from and over the main circuit board, the wireless module board being provided with a feed line and at least one wireless module for performing wireless operations; and an antenna element for wireless communication, the antenna element comprising a resonating element arranged over and spaced apart from the main board and extending alongside and external to at least part of an edge of the wireless module board, a first connection element connected to the feed line of the wireless module board and a second connection element connected to the main circuit board. 2 . A circuit board assembly according to claim 1 , wherein the second connection element is connected to the ground plane of the main circuit board. 3 . A circuit board assembly according to claim 1 , wherein the antenna element comprises an Inverted F type antenna. 4 . A circuit board assembly according to claim 1 , wherein the input impedance of the antenna is matched by adjustment of the width of parts composing the antenna element. 5 . A circuit board assembly according to claim 1 , wherein the first connection element is disposed perpendicularly to the second connection element, the first connection element and the second connection element being disposed perpendicularly to the resonating element of the antenna. 6 . A circuit board assembly according to claim 5 wherein the first connection element extends from a side of the resonating element towards the wireless module board and the second connection element extends from the resonating element towards the main board. 7 . A circuit board assembly according to claim 1 , wherein the resonating element comprises a first part and a second part extending perpendicularly to the first part, the first and second part being arranged to border a corner of the wireless module board. 8 . A circuit board assembly according to claim 1 , wherein a ground clearance area is provided on the main board in registration with the resonating element. 9 . A circuit board assembly according to claim 1 , wherein the resonating element of the antenna is formed in an L shape, comprising a first part extending along a side of the wireless module board and a second part arranged to extend away from the main circuit board. 10 . A circuit board assembly according to claim 1 , wherein the second connection element is connected to the main board via a grounding connection of the wireless module board 11 . A circuit assembly according to claim 10 wherein the second connection element extends from the resonant element to the wireless module board and is arranged parallel to the first connection element. 12 . A circuit board assembly according to claim 1 comprising a plurality of antenna elements. 13 . A circuit board assembly according to claim 12 further comprising at least one coupling element for interconnecting two antenna elements. 14 . A circuit board assembly according to claim 12 wherein a first antenna element of the plurality of antenna elements comprises a first part extending along a first side of the wireless module board and a second part extending perpendicularly to the first part, along a second adjacent side of the wireless module board and the second antenna element of the plurality of antenna elements comprises a first part extending along the first side of the wireless module board 15 . A wireless electronic device comprising a circuit board assembly in accordance with claim 1 .
Earthing means; Earth screens; Counterpoises · CPC title
with a shorting wall or a shorting pin at one end of the element (H01Q9/0414 takes precedence) · CPC title
mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title
formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} · CPC title
Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K1/0251 takes precedence) · CPC title
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