Self-removal anti-stiction coating for bonding process

Patent metadata

Field	Value
Publication number	US-2016229693-A1
Application number	US-201414564346-A
Country	US
Kind code	A1
Filing date	Dec 9, 2014
Priority date	Dec 9, 2010
Publication date	Aug 11, 2016
Grant date	—

Abstract

A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer.

First claim

What is claimed is:

1 . A device comprising:
a first substrate having a first bonding portion and a device coated with an anti-stiction layer, the first bonding portion including a first bonding layer and an eutectic alloy layer disposed over the first bonding layer, wherein the eutectic alloy layer includes a portion free of the anti-stiction layer and a portion having the anti-stiction layer disposed thereover; and a second substrate having a second bonding portion that includes a second bonding layer, the second substrate being bonded to the first substrate by a bond that includes the second bonding layer, the eutectic alloy layer, and the first bonding layer, wherein the second bonding layer is coupled with the portion of the eutectic alloy layer free of the anti-stiction layer.

2 . The device of claim 1 wherein the first bonding layer includes aluminum.

3 . The device of claim 1 wherein the eutectic alloy layer includes one of germanium, indium, aluminum, gold, tin, and combinations thereof.

4 . The device of claim 1 wherein the device coated with the anti-stiction layer is a MEMS device.

5 . The device of claim 1 wherein the second bonding layer includes silicon.

6 . The device of claim 1 wherein the anti-stiction coating is a self assembled monolayers (SAMS) layer.

7 . A device comprising:
a first substrate having a first bonding layer and a eutectic alloy layer disposed thereover, wherein the eutectic alloy is formed by heating a portion of the first bonding layer; and an anti-stiction layer disposed over the eutectic alloy layer of the first substrate, wherein the anti-stiction layer is an organic-based material; and a second substrate having a second bonding layer positioned over the eutectic alloy layer and bonded to the first bonding layer such that a bond between the first and second bonding layers is free of the anti-stiction layer, wherein the second bonding layer is not positioned over the first bonding layer prior to heating the portion of the first bonding layer.

8 . The device of claim 7 , wherein the first substrate further includes an interlayer disposed over the first bonding layer, and
wherein the eutectic alloy is further formed by heating a portion the interlayer.

9 . The device of claim 7 , wherein the eutectic alloy is further formed by heating an interlayer with the portion of the first bonding layer such that the interlayer is completely consumed during the heating.

10 . The device of claim 7 , wherein the first bonding layer is formed of a first material and the second bonding layer is formed of a second material that is different from the first material.

11 . The device of claim 7 , wherein the second bonding layer physically contacts the eutectic alloy layer.

12 . The device of claim 11 , wherein second bonding layer includes opposing sidewall surfaces and bottommost surface extending between the opposing sidewall surfaces, and
wherein the anti-stiction layer physically contacts the opposing sidewall surfaces without physically contacting the bottommost surface.

13 . The device of claim 7 , wherein the eutectic alloy includes Al, Ge, Au, and Sn.

14 . The device of claim 7 , wherein the first bonding layer is coupled to an interconnect structure of the first substrate.

15 . A device comprising:
a first substrate having a first bonding layer and a eutectic alloy layer formed thereover; an anti-stiction layer disposed over the eutectic alloy layer of the first substrate, wherein the anti-stiction layer is an organic-based material; and a second substrate having a second bonding layer positioned over the eutectic alloy layer and bonded to the first bonding layer such that a bond between the first and second bonding layers is free of the anti-stiction layer, wherein the second bonding layer is not positioned over the first bonding layer prior to forming the eutectic alloy over the first substrate.

16 . The device of claim 15 , wherein the eutectic alloy includes Al, Ge, Au, and Sn,
wherein the first bonding layer includes Cu and Si, and wherein the second bonding layer includes TiSi.

17 . The device of claim 15 , wherein the second bonding layer physically contacts the eutectic alloy layer.

18 . The device of claim 15 , wherein second bonding layer includes a first sidewall surface and an opposing second sidewall surface, wherein a bottommost surface of the second bonding layer extends from the first sidewall surface to the second sidewall surface, and
wherein the anti-stiction layer physically contacts the first and second sidewall surfaces without physically contacting the bottommost surface.

19 . The device of claim 15 , wherein the eutectic alloy includes In.

20 . The device of claim 15 , further comprising a third substrate disposed between the first and second substrates, wherein the third substrate is bonded to the first substrate, and wherein the anti-stiction layer is disposed over a top surface of the third substrate facing away from the first substrate.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Liu Ping-Yin
• Chu Li-Cheng
• Lin Hung-Hua
• Tsai Shang-Ying
• Hsieh Yuan-Chih
• Peng Jung-Huei
• Chao Lan-Lin
• Tsai Chia-Shiung
• Cheng Chun-Wen

Classifications

• Y10T428/12674

  Ge- or Si-base component · CPC title

• Y10T428/12708

  Sn-base component · CPC title

• Y10T428/12986

  Adjacent functionally defined components · CPC title

• Y10T428/12736

  Al-base component · CPC title

• B81B3/0005

  Anti-stiction coatings · CPC title