Heat Dissipation in Hermetically-Sealed Packaged Devices

Patent metadata

Field	Value
Publication number	US-2016229618-A1
Application number	US-201514617078-A
Country	US
Kind code	A1
Filing date	Feb 9, 2015
Priority date	Feb 9, 2015
Publication date	Aug 11, 2016
Grant date	—

Abstract

A hermetically sealed package effectively dissipates heat generated inside the package. The hermetically sealed package includes a hermetically sealed enclosure formed from a base portion and a lid. Within the enclosure two or more heat generating elements, such as integrated circuit chips, are supported by the base portion and rise to different heights from the base portion. At least one resilient heat exchange component, such as a leaf spring, extends from the lid of the hermetically sealed enclosure to the different heights. The heat exchange component is configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.

First claim

1 . An apparatus comprising:
a hermetically sealed enclosure comprising a base portion and a lid; a plurality of heat generating elements supported by the base portion, the plurality of heat generating elements rising to a plurality of different heights from the base portion; and at least one resilient heat exchange component that extends from the lid of the hermetically sealed enclosure to the plurality of different heights and configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.

2 . The apparatus of claim 1 , further comprising a heat sink coupled to the lid opposite the heat exchange component.

3 . The apparatus of claim 2 , wherein the lid is formed of thermally insulating material, and further comprising thermally conductive vias between the resilient heat exchange component and the heat sink.

4 . The apparatus of claim 1 , further comprising a thermoelectric cooler between the lid and the heat exchange component.

5 . The apparatus of claim 4 , wherein the lid of the enclosure is electrically insulating, and wherein the thermoelectric cooler is electrically powered through conductive vias in the lid of the enclosure.

6 . The apparatus of claim 1 , further comprising a plurality of thermoelectric coolers between the heat exchange component and the plurality of heat generating elements.

7 . The apparatus of claim 6 , wherein the lid is formed of electrically insulating material, and wherein the plurality of thermoelectric coolers are electrically powered through conductive vias in the lid of the enclosure.

8 . The apparatus of claim 1 , wherein the at least one heat exchange component comprises one or more leaf springs, one or more beds of springs, or a combination of one or more leaf springs and one or more beds of springs.

9 . The apparatus of claim 1 , wherein the heat generating elements comprise electronic devices or photonic devices.

10 . The apparatus of claim 9 , wherein the heat generating elements include electrical connections coupled to the base portion of the enclosure.

11 .- 16 . (canceled)

17 . An apparatus comprising:
a hermetically sealed enclosure comprising a base portion and a lid; and at least one resilient heat exchange component that extends from the lid of the hermetically sealed enclosure to a plurality of different heights from the base portion of the enclosure at a plurality of different locations within the enclosure and configured to conduct heat from inside the enclosure through the lid of the enclosure to outside the enclosure.

18 . The apparatus of claim 17 , further comprising a heat sink coupled outside the enclosure to the lid opposite the heat exchange component.

19 . The apparatus of claim 18 , wherein the lid is formed of thermally insulating material, and further comprising thermally conductive vias between the resilient heat exchange component and the heat sink to transfer heat from inside the enclosure to outside the enclosure.

20 . The apparatus of claim 17 , wherein the at least one heat exchange component comprises one or more leaf springs, one or more beds of springs, or a combination of one or more leaf springs and one or more beds of springs.

21 . The apparatus of claim 17 , further comprising a thermoelectric cooler between the lid and the heat exchange component.

22 . The apparatus of claim 21 , wherein the lid of the enclosure is electrically insulating, and wherein the thermoelectric cooler is electrically powered through conductive vias in the lid of the enclosure.

23 . The apparatus of claim 17 , further comprising a plurality of thermoelectric coolers between the heat exchange component and a plurality of heat generating elements inside the enclosure.

24 . The apparatus of claim 23 , wherein the lid is formed of electrically insulating material, and wherein the plurality of thermoelectric coolers are electrically powered through conductive vias in the lid of the enclosure.

25 . The apparatus of claim 23 , wherein the heat generating elements comprise electronic devices or photonic devices.

26 . The apparatus of claim 25 , wherein the heat generating elements include electrical connections coupled to the base portion of the enclosure.

Assignees

• Cisco Tech Inc

Inventors

• Savic Jovica
• Ahmad Mudasir
• Brenner Thomas

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• B65B61/20

  for adding cards, coupons or other inserts to package contents (adding unpacking elements B65B61/18) · CPC title

• B65D43/02

  Removable lids or covers (with means for piercing, cutting, or tearing a frangible inner closure B65D51/22) · CPC title

• B65D81/18 Primary

  providing specific environment for contents, e.g. temperature above or below ambient (with thermal insulation B65D81/38) · CPC title