Textured film on substrate

Patent metadata

Field	Value
Publication number	US-2016229092-A1
Application number	US-201315021487-A
Country	US
Kind code	A1
Filing date	Oct 31, 2013
Priority date	Oct 31, 2013
Publication date	Aug 11, 2016
Grant date	—

Abstract

A method of molding is described in which a film and a substrate are positioned between first and second mold parts. The first mold part is compressed against the film and the second mold part is compressed against the substrate to form the film and substrate into a molded product. The compressing forms a texture in a surface of the film.

First claim

1 . A method of molding comprising:
positioning a film and a substrate between first and second mold parts; compressing the first mold part against the film and the second mold part against the substrate to form the film and substrate into a molded product, wherein the compressing forms a texture in a surface of the film.

2 . The method of claim 1 , wherein the compressing changes the shape of the substrate.

3 . The method of claim 1 , wherein prior to the compressing, the film is connected to the substrate 30 form a preform.

4 . The method of claim 3 , comprising heating the film prior to connecting the film to the substrate.

5 . The method of claim 1 , comprising heating the film and/or substrate during the compressing.

6 . The method of claim 1 , wherein the texture is a textured pattern.

7 . The method of claim 1 , wherein the texture provides an anti-fingerprint, antibacterial, anti-scratch, metal-like, matt, visual and/or tactual effect to the surface.

8 . The method of claim 1 , comprising positioning a bonding layer between the film and substrate prior to the compressing.

9 . The method of claim 2 , wherein a bonding layer is connected between the film and the substrate to form the preform.

10 . The method of claim 1 , wherein the substrate comprises a texture molded in a surface thereof.

11 . The method of claim 1 , wherein the molded product provides a casing or part of a casing for an electrical device.

12 . A method of molding comprising:
compressing a substrate having a film connected to the substrate, wherein the compressing shapes the substrate and forms a texture in a surface of the film substantially at the same time.

13 . A molded product formed by the method of claim 1 .

14 . Molding apparatus comprising:
a first mold part; and a second mold part; wherein the first and second mold parts are adapted to receive a film and a substrate therebetween and compress the film and the substrate to form a molded product, and wherein the first mold part comprises a mixture mold form such that, when the first and second mold parts compress the film and the substrate, a texture is formed in a surface of the film by the texture mold form.

15 . The apparatus of claim 14 , wherein the second mold part comprises a shape mold form such that, when the first and second mold parts compress the film and the substrate, a shape is formed in the substrate.

Assignees

• Hewlett Packard Development Co Lp

Inventors

• Huang Chung-Hung
• Wu Kuan-Ting

Classifications

• B29C43/183

  the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould · CPC title

• B29K2995/0074

  patterned, grained · CPC title

• B29C43/021 Primary

  characterised by the shape of the surface · CPC title

• B29C43/36

  Moulds for making articles of definite length, i.e. discrete articles · CPC title

• B29C33/424

  Moulding surfaces provided with means for marking or patterning (for injection moulding B29C45/372) · CPC title