Water-cooling heat dissipation device and water block thereof

Patent metadata

Field	Value
Publication number	US-2016227672-A1
Application number	US-201514645509-A
Country	US
Kind code	A1
Filing date	Mar 12, 2015
Priority date	Jan 29, 2015
Publication date	Aug 4, 2016
Grant date	—

Abstract

A water-cooling heat dissipation device includes a vapor chamber, a heat conduction cylinder, and a cover. A first chamber is formed in the vapor chamber. The heat conduction cylinder extends from a surface of the vapor chamber. A second chamber communicating with the first chamber is formed in the heat conduction cylinder. A working fluid flows in the first chamber and the second chamber. The cover covers the vapor chamber; the heat conduction cylinder is disposed in the cover. By means of the working fluid flowing in the first chamber and the second chamber which communicate with each other, heat can be delivered rapidly from the vapor chamber to the heat conduction cylinder.

First claim

What is claimed is:

1 . A water block ( 10 ), comprising:
a vapor chamber ( 100 ), wherein a first chamber ( 101 ) is formed in the vapor chamber ( 100 ); a heat conduction cylinder ( 200 ) extending from a surface of the vapor chamber ( 100 ), wherein a second chamber ( 201 ) is formed in the heat conduction cylinder ( 200 ), wherein the second chamber ( 201 ) communicates with the first chamber ( 101 ), wherein a working fluid ( 20 ) flows in the first chamber ( 101 ) and the second chamber ( 201 ); and a cover ( 300 ) covering the vapor chamber ( 100 ), wherein the heat conduction cylinder ( 200 ) is disposed in the cover ( 300 ).

2 . The water block ( 10 ) according to claim 1 , wherein a plurality of fins ( 220 ) are disposed on the heat conduction cylinder ( 200 ).

3 . The water block ( 10 ) according to claim 2 , wherein the heat conduction cylinder ( 200 ) connects the fins ( 220 ) in series.

4 . The water block ( 10 ) according to claim 2 , wherein the fins ( 220 ) are individually formed on the heat conduction cylinder ( 200 ) and extend from a side surface of the heat conduction cylinder ( 200 ).

5 . The water block ( 10 ) according to claim 1 , wherein the heat conduction cylinder ( 200 ) is plural in number, wherein the heat conduction cylinders ( 200 ) are disposed on the same surface of the vapor chamber ( 100 ).

6 . The water block ( 10 ) according to claim 5 , wherein the heat conduction cylinders ( 200 ) are parallel and spaced to one another.

7 . The water block ( 10 ) according to claim 1 , wherein each of an inner wall of the first chamber ( 101 ) and an inner wall of the second chamber ( 201 ) is provided with a wick structure ( 110 / 210 ).

8 . A water-cooling heat dissipation device, comprising:
a vapor chamber ( 100 ), wherein a first chamber ( 101 ) is formed in the vapor chamber ( 100 ); a heat conduction cylinder ( 200 ) extending from a surface of the vapor chamber ( 100 ), wherein a second chamber ( 201 ) is formed in the heat conduction cylinder ( 200 ), wherein the second chamber ( 201 ) communicates with the first chamber ( 101 ), wherein a working fluid ( 20 ) flows in the first chamber ( 101 ) and the second chamber ( 201 ); a cover ( 300 ) covering the vapor chamber ( 100 ), wherein the heat conduction cylinder ( 200 ) is disposed in the cover ( 300 ); and a pump ( 500 ) connected to the cover ( 300 ).

9 . The water-cooling heat dissipation device according to claim 8 , wherein a plurality of fins ( 220 ) are disposed on the heat conduction cylinder ( 200 ).

10 . The water-cooling heat dissipation device according to claim 9 , wherein the heat conduction cylinder ( 200 ) connects the fins ( 220 ) in series.

11 . The water-cooling heat dissipation device according to claim 9 , wherein the fins ( 220 ) are individually formed on the heat conduction cylinder ( 200 ) and extend from a side surface of the heat conduction cylinder ( 200 ).

12 . The water-cooling heat dissipation device according to claim 8 , wherein the heat conduction cylinder ( 200 ) is plural in number, wherein the heat conduction cylinders ( 200 ) are disposed on the same surface of the vapor chamber ( 100 ).

13 . The water-cooling heat dissipation device according to claim 12 , wherein the heat conduction cylinders ( 200 ) are parallel and spaced to one another.

14 . The water-cooling heat dissipation device according to claim 8 , wherein each of an inner wall of the first chamber ( 101 ) and an inner wall of the second chamber ( 201 ) is provided with a wick structure ( 110 / 210 ).

15 . The water-cooling heat dissipation device according to claim 8 , further comprising a circulation pipe ( 400 ), wherein two ends of the circulation pipe ( 400 ) are connected to the cover ( 300 ), wherein the pump ( 500 ) communicates with and is connected to the circulation pipe ( 400 ) in series.

16 . The water-cooling heat dissipation device according to claim 15 , further comprising a water tank ( 600 ) communicating with and connected to the circulation pipe ( 400 ) in series.

17 . The water-cooling heat dissipation device according to claim 15 , further comprising a radiator ( 700 ) communicating with and connected to the circulation pipe ( 400 ) in series.

18 . The water-cooling heat dissipation device according to claim 8 , wherein the pump ( 500 ) is attached on the cover ( 300 ).

Assignees

• Cooler Master Co Ltd

Inventors

• Lin Jen-Cheng

Classifications

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title