Anti-Slip Substrates

Patent metadata

Field	Value
Publication number	US-2016227656-A1
Application number	US-201315021457-A
Country	US
Kind code	A1
Filing date	Oct 30, 2013
Priority date	Oct 31, 2013
Publication date	Aug 4, 2016
Grant date	—

Abstract

A method is provided for modifying a layer of a plastics material containing conductive fibers. The method includes electrophoretically depositing a bead of a polymer material at locations of a surface of the layer where the conductive fibers are exposed.

First claim

1 . A method of modifying a layer of a plastics material containing conductive fibers, the method comprising electrophoretically depositing a bead of a polymer material at locations of a surface of the layer where the conductive fibers are exposed.

2 . The method of claim 1 which includes forming the plastics material as a shell of a housing for a device.

3 . A method of manufacturing a shell of a housing for a device, the method comprising:
providing a shell of a plastics material containing conductive fibers which are exposed at spaced apart locations of a surface of the shell; and electrophoretically depositing beads of polymer material on the surface of the shell at the locations of the surface of the shell.

4 . The method of claim 3 which includes passivating the surface of the carbon fiber reinforced plastics material before the electrophoretic deposition is performed.

5 . The method of claim 3 which includes applying an insulating film to the surface of the shell in a pattern to form a mask before the electrophoretic deposition.

6 . The method of claim 5 which includes applying the insulating film by at least one of screen printing and ink-jet printing.

7 . The method of claim 3 which includes working the surface of the shell at the locations to expose the conductive fibers before performing the electrophoretic deposition.

8 . A housing for a device, the housing comprising:
a fiber reinforced plastics shell including conductive fibers, the shell defining a surface and the conductive fibers being exposed at spaced apart locations of the surface of the shell; and a slip resistant finish applied to the surface of the shell, the slip resistant finish comprising electrophoretically deposited polymer material arranged at the locations of the shell.

9 . The housing of claim 8 in which the slip resistant finish comprises discrete beads of the polymer material, the beads being deposited at each of at least some of the locations of the shell.

10 . The housing of claim 8 in which the electrophoretically deposited polymer material comprises at least one of epoxy and polyacrylate polymers.

11 . The housing of claim 8 in which the plastics material is at least one of a thermoplastic and a thermosetting material.

12 . The housing of claim 8 in which the conductive fibers comprise carbon fibers.

13 . The housing of claim 8 in which the conductive fibers are arranged in a weave and the locations of the surface of the shell where the fibers are exposed are regions where threads of the weave cross.

14 . The housing of claim 8 in which the conductive fibers are uni-directionally arranged in the shell.

Assignees

• Hewlett Packard Development Co Lp

Inventors

• Kang Yu-Chuan (Tony)
• Wu Kuan-Ting

Classifications

• H05K5/0243 Primary

  for decorative purposes · CPC title

• A45C11/003

  for storing portable computing devices, e.g. laptops, tablets or calculators · CPC title

• A45C11/002

  for storing portable handheld communication devices, e.g. pagers or smart phones · CPC title

• C25D13/20

  Pretreatment · CPC title

• A45F5/00

  Holders or carriers for hand articles; Holders or carriers for use while travelling or camping · CPC title