Solder material and electronic component

Patent metadata

Field	Value
Publication number	US-2016226466-A1
Application number	US-201615015104-A
Country	US
Kind code	A1
Filing date	Feb 3, 2016
Priority date	Feb 4, 2015
Publication date	Aug 4, 2016
Grant date	—

Abstract

A solder material includes an alloy of at least five elements including Sn, Cu, Sb, and In, and 20 mass % or less of Ag. The solidus temperature of the solder material is higher than 290° C., the liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and the temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less.

First claim

What is claimed is:

1 . A solder material, comprising:
an alloy of at least five elements including Sn, Cu, Sb, In, and 20 mass % or less of Ag, wherein a solidus temperature of the solder material is higher than 290° C., a liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and a temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less.

2 . The solder material according to claim 1 , wherein
the solder material includes 25 to 45 mass % of Sn, 30 to 40 mass % of Sb, 3 to 8 mass % of Cu, 3 to 9 mass % of In, a remaining portion of Ag, and inevitable impurities.

3 . The solder material according to claim 1 , wherein
the solder material includes Si and Ti, and respective contents of Si and Ti are 0.1 mass % or less.

4 . The solder material according to claim 1 , wherein the solder material includes at least one of Zn or Pd, and respective contents of Zn and Pd are 0.1 mass % or less.

5 . The solder material according to claim 1 , wherein
the solder material includes 36 to 40 mass % of Sn, 34 to 38 mass % of Sb, 4 to 6 mass % of Cu, 4 to 6 mass % of In, a remaining portion of Ag, and inevitable impurities.

6 . The solder material according to claim 1 , wherein
the solder material includes a paste mixed with a flux.

7 . The solder material according to claim 1 , wherein
the solder material is in a form of a preform that is punched out after the solder material is processed into a metal foil.

8 . An electronic component for mounting on a circuit board, comprising
a container that houses an electronic element; and the solder material according to claim 1 used for the container.

9 . The electronic component according to claim 8 , wherein
the solder material is used as a sealing material to airtightly seal the container.

10 . The electronic component according to claim 9 , wherein
the container is constituted of a base portion and a lid portion sealed with the solder material, and an atmosphere inside the container is at least one of a depressurized atmosphere and an inert gas atmosphere.

11 . The electronic component according to claim 1 , wherein
the container is mounted on a wiring board, and the container is sealed with a resin material over the whole container from a surface of the wiring board, and the solder material is used to electrically connect an electrode of the container to the wiring board.

Assignees

• Nihon Dempa Kogyo Co

Inventors

• Tsuda Toshimasa
• Kikuchi Kenichi
• Kuroda Tomotaka
• Nishiyama Daisuke
• Sasaki Hiroyuki
• Hatano Makoto
• Ishikawa Hiroya

Classifications

• H03H9/1021

  the BAW device being of the cantilever type · CPC title

• B23K35/262 Primary

  Sn as the principal constituent · CPC title

• B23K2101/36

  Electric or electronic devices · CPC title

• C22C30/04

  containing tin or lead · CPC title

• C22C30/02

  containing copper · CPC title