Cylindrical package

Patent metadata

Field	Value
Publication number	US-2016223393-A1
Application number	US-201514794882-A
Country	US
Kind code	A1
Filing date	Jul 9, 2015
Priority date	Jan 29, 2015
Publication date	Aug 4, 2016
Grant date	—

Abstract

A cylindrical package includes a cylindrical housing; a pedestal at a bottom of a cylindrical space surrounded by the cylindrical housing; an optical splitter in the cylindrical space and over the pedestal; a first photodetector in the cylindrical space and over the pedestal, wherein the first photodetector is configured to be optically coupled to the optical splitter; and a second photodetector in the cylindrical space and over the pedestal, wherein the second photodetector is configured to be optically coupled to the optical splitter.

First claim

What is claimed is:

1 . A cylindrical package comprising:
a cylindrical housing; a pedestal at a bottom of a cylindrical space surrounded by said cylindrical housing; an optical splitter in said cylindrical space; a first photodetector in said cylindrical space, wherein said first photodetector is configured to be optically coupled to said optical splitter; and a second photodetector in said cylindrical space, wherein said second photodetector is configured to be optically coupled to said optical splitter.

2 . The cylindrical package of claim 1 further comprising multiple pins passing through said pedestal and protruding from a top surface of said pedestal and a bottom surface of said pedestal.

3 . The cylindrical package of claim 1 , wherein said optical splitter has an incident surface configured to receive a main optical beam at an angle of incidence between 30 and 60 degrees.

4 . The cylindrical package of claim 1 further comprising a circuit board in said cylindrical space, wherein said circuit board has a working surface substantially parallel to a central axis of said cylindrical housing, wherein said optical splitter and first and second photodetectors are mounted onto said working surface.

5 . The cylindrical package of claim 4 , wherein said circuit board comprises a ceramic substrate.

6 . The cylindrical package of claim 1 further comprising an optical interferometer in said cylindrical space, wherein said optical interferometer is on an optical path between said optical splitter and said second photodetector.

7 . The cylindrical package of claim 6 , wherein said optical interferometer comprises an Etalon filter.

8 . The cylindrical package of claim 1 further comprising a thermal-electric cooler in said cylindrical space and on said pedestal, wherein said second photodetector is attached onto said thermal-electric cooler.

9 . The cylindrical package of claim 8 further comprising a first circuit board in said cylindrical space, wherein said first circuit board has a working surface substantially parallel to a central axis of said cylindrical housing, wherein said optical splitter and first and second photodetectors are mounted onto said working surface, wherein said optical splitter has an incident surface configured to receive a main optical beam coaxial with said central axis and split said main optical beam into a first split optical beam optically coupled to said first photodetector and a second split optical beam optically coupled to said second photodetector, wherein said first and second split optical beams are substantially parallel to said working surface, wherein said second photodetector comprises a second circuit board with a bottom surface attached onto said thermal-electric cooler and a photosensitive chip on a top surface of said second circuit board.

10 . The cylindrical package of claim 9 , wherein said first circuit board has a sidewall attached onto said thermal-electric cooler.

11 . The cylindrical package of claim 1 further comprising an optical lens optically coupled to said optical splitter.

12 . The cylindrical package of claim 9 further comprising an optical interferometer in said cylindrical space, wherein said optical interferometer is on an optical path between said optical splitter and said second photodetector, wherein said optical interferometer is configured to receive said second split optical beam to be reflected alternately between two reflective layers of said optical interferometer multiple times so as to generate interfered optical beams of said second split optical beam, wherein said second photodetector is configured to detect an optical intensity of said interfered optical beams of said second split optical beam and said first photodetector is configured to detect an optical intensity of said first split optical beam.

13 . The cylindrical package of claim 1 is configured for a wavelength locker.

14 . A cylindrical package comprising:
a cylindrical housing; a pedestal at a bottom of a cylindrical space surrounded by the cylindrical housing; an optical interferometer in the cylindrical space; and an photodetector in the cylindrical space, wherein the photodetector is configured to be optically coupled to the optical interferometer.

15 . The cylindrical package of claim 14 further comprising a circuit board in said cylindrical space, wherein said circuit board has a working surface substantially parallel to a central axis of said cylindrical housing, wherein said optical interferometer and photodetector are mounted onto said working surface.

16 . The cylindrical package of claim 15 , wherein said circuit board comprises a ceramic substrate.

17 . The cylindrical package of claim 14 , wherein said optical interferometer comprises an Etalon filter.

18 . The cylindrical package of claim 14 further comprising a thermal-electric cooler in said cylindrical space and on said pedestal, wherein said photodetector is attached onto said thermal-electric cooler.

19 . The cylindrical package of claim 18 further comprising a first circuit board in said cylindrical space, wherein said first circuit board has a working surface substantially parallel to a central axis of said cylindrical housing, wherein said optical interferometer and photodetector are mounted onto said working surface, wherein said photodetector comprises a second circuit board with a bottom surface attached onto said thermal-electric cooler and a photosensitive chip on a top surface of said second circuit board, wherein said optical interferometer is optically coupled to said photosensitive chip.

20 . The cylindrical package of claim 19 , wherein said first circuit board has a sidewall attached onto said thermal-electric cooler.

Assignees

• Ezconn Corp

Inventors

• Hsu Mao-Chieh
• Hsu Shih-Lung
• Yu Jia-Cong
• Lan Chin-Yin

Classifications

• G01J1/0407

  Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings · CPC title

• G01J1/0271 Primary

  Housings; Attachments or accessories for photometers · CPC title

• G01J2009/0257

  multiple, e.g. Fabry Perot interferometer · CPC title

• G01J9/0246

  Measuring optical wavelength · CPC title

• G01J1/0403

  Mechanical elements; Supports for optical elements; Scanning arrangements · CPC title