Method of manufacturing a light emitting diode lighting assembly

US2016223148A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016223148-A1
Application numberUS-201615017838-A
CountryUS
Kind codeA1
Filing dateFeb 8, 2016
Priority dateOct 4, 2012
Publication dateAug 4, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a light emitting diode lighting assembly that includes producing a heat sink and securing a platform assembly having a plurality of light emitting diode dies on a single plane. A bulb is formed by securing a first lens section made of a first material to a second lens section made of a second material such that only the bulb determines the lamp type of the light emitting diode lighting assembly.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method of manufacturing a light emitting diode lighting assembly steps comprising: producing a heat sink connected to a light emitting diode light source; selecting a first lens section having a first diffusion rate and first reflection coefficient; selecting a second lens section having a second diffusion rate and second reflection coefficient; securing the first and second lens section together to form a bulb; securing the first lens section to the heat sink; and wherein only the selection of the first lens section and second lens section determines the lamp type of the light emitting diode lighting assembly.

Assignees

Inventors

Classifications

  • the planes containing the fins or blades having the direction of the light emitting axis · CPC title

  • Mechanical Engineering · mapped topic

  • characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

  • Mechanical Engineering · mapped topic

  • F21K9/90Primary

    Methods of manufacture · CPC title

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Frequently asked questions

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What does patent US2016223148A1 cover?
A method of manufacturing a light emitting diode lighting assembly that includes producing a heat sink and securing a platform assembly having a plurality of light emitting diode dies on a single plane. A bulb is formed by securing a first lens section made of a first material to a second lens section made of a second material such that only the bulb determines the lamp type of the light emitti…
Who is the assignee on this patent?
Once Innovations Inc
What technology area does this patent fall under?
Primary CPC classification F21K9/90. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Thu Aug 04 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).