Polyamide resin composition and molded product

Patent metadata

Field	Value
Publication number	US-2016222196-A1
Application number	US-201415021979-A
Country	US
Kind code	A1
Filing date	Sep 24, 2014
Priority date	Sep 27, 2013
Publication date	Aug 4, 2016
Grant date	—

Abstract

A polyamide resin composition includes:
(A) a polyamide resin; (B) an aluminic acid metal salt; and (C) at least one or more compounds selected from the group consisting of the following (C1) to (C3):
(C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of the periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and wherein the content of the component (B) is 0.03 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3).

First claim

1 . A polyamide resin composition comprising:
(A) a polyamide resin; (B) an aluminic acid metal salt; and (C) at least one or more compounds selected from the group consisting of the following (C1) to (C3): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of a periodic table; (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound; and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and wherein a content of the component (B) is 0.03 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3), and the components (C1) to (C3) have the following respective contents when selected as a component contained therein: component (C1): 0.001 to 0.05 parts by mass in terms of an amount of the metal element; component (C2): 0.8 to 20 parts by mass; and component (C3): 1 to 50 parts by mass.

2 . The polyamide resin composition according to claim 1 , wherein the compound (C) is a combination of at least two or more selected from the group consisting of the components (C1) to (C3).

3 . The polyamide resin composition according to claim 1 , wherein the polyamide resin (A) is a polyamide resin having a melting point of 240° C. or higher.

4 . The polyamide resin composition according to claim 1 , wherein the polyamide resin (A) is polyamide 66.

5 . The polyamide resin composition according to claim 1 , wherein the aluminic acid metal salt (B) is sodium aluminate.

6 . (canceled)

7 . The polyamide resin composition according to claim 1 , wherein
the content of the component (B) is 0.5 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3).

8 . The polyamide resin composition according to claim 1 , further comprising (D) an inorganic filler other than the aluminic acid metal salt.

9 . The polyamide resin composition according to claim 8 , wherein a content of the component (D) is 10 to 250 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3).

10 . The polyamide resin composition according to claim 1 , wherein the component (C) comprises at least the component (C1).

11 . The polyamide resin composition according to claim 1 , wherein the component (C1) is a copper salt.

12 . The polyamide resin composition according to claim 1 , wherein the component (C1) is a copper halide and/or copper acetate.

13 . (canceled)

14 . The polyamide resin composition according to claim 1 , wherein a mass ratio (B)/(C1) of the component (B) to the component (C1) is 1 or more.

15 . The polyamide resin composition according to claim 10 , further comprising (C1-2) a halide of an alkali metal and/or a halide of an alkaline earth metal.

16 . The polyamide resin composition according to claim 15 , wherein a molar ratio of a halogen element of the component (C1-2) to the metal element of the component (C1) (halogen element/metal element) is 2 to 50.

17 . The polyamide resin composition according to claim 1 , wherein the component (C) comprises at least the component (C2).

18 . The polyamide resin composition according to claim 1 , wherein the component (C2) is a hindered phenol compound.

19 . (canceled)

20 . The polyamide resin composition according to claim 1 , wherein the component (C) comprises at least the component (C3).

21 . (canceled)

22 . The polyamide resin composition according to claim 1 , wherein the component (C3) is a polyamide resin having a melting point of lower than 240° C.

23 . The polyamide resin composition according to claim 1 , wherein the component (C3) is polyamide 6.

24 . The polyamide resin composition according to claim 1 , wherein the component (C3) is a polyamide resin in which a ratio of number of carbon atoms to number of nitrogen atoms (C/N) contained in the component (C3) is 7 or more and 20 or less.

25 . A molded product comprising a polyamide resin composition according to claim 1 .

26 . (canceled)

27 . Use of sodium aluminate for producing a molded polyamide product having heat aging resistance.

Assignees

• Asahi Kasei Chemicals Corp

Inventors

• Kawamura Tomoyo
• Okamoto Masashi
• Shikano Yasukazu
• Watanabe Katsushi

Classifications

• C08K3/22 Primary

  of metals · CPC title

• C08K5/526

  with hydroxyaryl compounds · CPC title

• C08L2205/06

  having improved processability or containing aids for moulding methods · CPC title

• C08K7/14

  Glass · CPC title

• C08L2205/025

  containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title