Method and apparatus for in-mold laminate antennas

Patent metadata

Field	Value
Publication number	US-2016218417-A1
Application number	US-201615092886-A
Country	US
Kind code	A1
Filing date	Apr 7, 2016
Priority date	Nov 26, 2010
Publication date	Jul 28, 2016
Grant date	—

Abstract

Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.

First claim

What is claimed is:

1 . A mobile device housing comprising:
a first layer having a first surface; a second layer having a second surface, the second surface opposite to said first surface, the second layer comprising an inject molded layer; at least one antenna element, at least a portion of the antenna element is in an internal area between the first and second surfaces; and at least one conductive connector having a first end connected to the portion of the antenna element within the internal area, and a second end exposed via the second surface to convey signals between the antenna element and a circuit of the mobile device.

2 . The mobile device housing of claim 1 , wherein the second layer comprises a molded plastic layer.

3 . The mobile device housing of claim 1 , wherein the first layer comprises a non-conductive layer.

4 . The mobile device housing of claim 1 , wherein an entirety of the antenna element is within the internal area between the first and second surfaces.

5 . The mobile device housing of claim 1 comprising a plurality of conductive connectors, each of the conductive connectors having one end connected to the at least portion of the antenna element and another exposed end.

6 . The mobile device housing of claim 1 , wherein an outer surface of the housing comprises said first surface.

7 . The mobile device housing of claim 1 , wherein the at least one antenna element comprises a plurality of antenna elements.

8 . A mobile device comprising:
at least one circuit to process wireless communication signals; and a housing comprising a first layer having a first surface, a second layer having a second surface, the second surface opposite to said first surface, the second layer comprising an inject molded layer, at least one antenna element, at least a portion of the antenna element is in an internal area between the first and second surfaces, and at least one conductive connector, the conductive connector having a first end connected to the portion of the antenna element within the internal area, and a second end exposed to the second surface to convey said wireless communication signals between the circuit and the antenna element.

9 . The mobile device of claim 8 , wherein the second layer comprises a molded plastic layer.

10 . The mobile device of claim 8 , wherein the first layer comprises a non-conductive layer.

11 . The mobile device of claim 8 , wherein an entirety of the antenna element is within the internal area between the first and second surfaces.

12 . The mobile device of claim 8 , wherein the housing comprises a plurality of conductive connectors, each of the conductive connectors having one end connected to the portion of the antenna element and another exposed end.

13 . The mobile device of claim 8 , wherein an outer surface of the housing comprises said first surface.

14 . The mobile device of claim 8 , wherein the at least one antenna element comprises a plurality of antenna elements.

Assignees

• Intel Corp

Inventors

• Konanur Anand
• Karacaoglu Ulun
• Yang Songnan
• Mceuen Shawn

Classifications

• H01Q1/2266

  disposed inside the computer · CPC title

• H01Q21/28

  Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} · CPC title

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H01Q1/40

  Radiating elements coated with or embedded in protective material · CPC title