Multilayer ceramic component and board having the same

Patent metadata

Field	Value
Publication number	US-2016217928-A1
Application number	US-201514940946-A
Country	US
Kind code	A1
Filing date	Nov 13, 2015
Priority date	Jan 26, 2015
Publication date	Jul 28, 2016
Grant date	—

Abstract

A multilayer ceramic component includes a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes having respective dielectric layers interposed therebetween, and first and second external electrodes respectively including first and second connection portions, and first and second band portions extended from the first and second connection portions, and first and second metal frames respectively including first and second upper horizontal portions, first and second lower horizontal portions, and first and second inclined support portions diagonally connecting the first and second upper horizontal portions and the first and second lower horizontal portions, respectively.

First claim

What is claimed is:

1 . A multilayer ceramic component comprising:
a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes having respective dielectric layers interposed between the plurality of first and second internal electrodes, to be alternately exposed to opposite surfaces of the ceramic body in a length direction, and first and second external electrodes respectively including first and second connection portions formed on the opposite surfaces of the ceramic body in the length direction, and connected to the first and second internal electrodes, respectively, and first and second band portions extended from the first and second connection portions, respectively, to cover portions of surfaces of the ceramic body in a width direction and a thickness direction; and first and second metal frames respectively including first and second upper horizontal portions disposed on one surfaces of the first and second band portions in the thickness direction, respectively, first and second lower horizontal portions disposed to be spaced apart from the first and second upper horizontal portions, respectively, in a direction away from the first and second band portions, and first and second inclined support portions diagonally connecting the first and second upper horizontal portions and the first and second lower horizontal portions to each other, respectively.

2 . The multilayer ceramic component of claim 1 , further comprising first and second conductive adhesive layers disposed between the one surfaces of the first and second band portions in the thickness direction and the first and second upper horizontal portions, respectively.

3 . The multilayer ceramic component of claim 2 , wherein the first and second conductive adhesive layers are formed of a solder or a conductive paste.

4 . The multilayer ceramic component of claim 1 , wherein in the first and second metal frames, the first and second inclined support portions connect inner ends of the first and second upper horizontal portions in the length direction and outer ends of the first and second lower horizontal portions in the length direction to each other, respectively.

5 . The multilayer ceramic component of claim 1 , wherein in the first and second metal frames, the first and second inclined support portions connect outer ends of the first and second upper horizontal portions in the length direction and inner ends of the first and second lower horizontal portions in the length direction to each other, respectively.

6 . The multilayer ceramic component of claim 1 , wherein in the first and second metal frames, the first and second inclined support portions are inclined in the width direction of the ceramic body.

7 . The multilayer ceramic component of claim 6 , wherein the first and second inclined support portions are formed in directions opposing each other.

8 . The multilayer ceramic component of claim 1 , wherein the ceramic body includes a plurality of the dielectric layers stacked in parallel with a direction in which the first and second metal frames are disposed.

9 . The multilayer ceramic component of claim 8 , wherein the ceramic body further includes cover layers disposed on a first or second internal electrode positioned at an uppermost side of the ceramic body and beneath a first or second internal electrode positioned at a lowermost side of the ceramic body, respectively.

10 . The multilayer ceramic component of claim 1 , wherein the ceramic body includes a plurality of the dielectric layers stacked perpendicularly to a direction in which the first and second metal frames are disposed.

11 . The multilayer ceramic component of claim 10 , wherein the ceramic body further includes cover layers disposed on outer surfaces of outermost first or second internal electrodes of the ceramic body, respectively.

12 . A board having a multilayer ceramic component, comprising:
a circuit board on which first and second electrode pads are disposed; and the multilayer ceramic component of claim 1 mounted on the circuit board by bonding the first and second lower horizontal portions of the first and second metal frames and the first and second electrode pads to each other, respectively.

13 . A multilayer ceramic component comprising:
a multilayer ceramic capacitor including a plurality of first and second internal electrodes having respective dielectric layers interposed between the plurality of first and second internal electrodes, to be alternately exposed to opposite surfaces of the ceramic body in a length direction, and first and second external electrodes respectively including first and second connection portions formed on the opposite surfaces of the ceramic body in the length direction, and connected to the first and second internal electrodes, respectively, and first and second extended portions extended from the first and second connection portions, respectively, to cover portions of a third surface of the ceramic body which is parallel to the length direction; and first and second metal frames each having a Z-shape disposed on the first and second extended portions of the first and second external electrodes, respectively.

Assignees

• Samsung Electro Mech

Inventors

• Park Heung Kil
• Ahn Young Ghyu
• Park Sang Soo
• Lee Soon Ju
• Jun Kyoung Jin
• Song So Yeon

Classifications

• H01G2/06 Primary

  specially adapted for mounting on a printed-circuit support · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/005

  Electrodes · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/111 Primary

  Pads for surface mounting, e.g. lay-out · CPC title