Light emitting device package

Patent metadata

Field	Value
Publication number	US-2016211429-A1
Application number	US-201615082091-A
Country	US
Kind code	A1
Filing date	Mar 28, 2016
Priority date	Sep 25, 2012
Publication date	Jul 21, 2016
Grant date	—

Abstract

A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.

First claim

1 . A light emitting device package comprising:
a package body; a pad disposed at the package; a light emitting device electrically connected to the pad; a metal layer inserted into the package body and including a body, an upper surface and a lower surface; and an electrode disposed at the package body; wherein a portion of the package body is disposed between the light emitting device and the metal layer, and wherein at least one width of the upper surface and the lower surface of the metal layer is wider than a width of the body of the metal layer, and the width of the upper surface of the metal layer is different from the width of the lower surface of the metal layer.

2 . The light emitting device package according to claim 1 , wherein the light emitting device package includes a cavity.

3 . The light emitting device package according to claim 2 , wherein the cavity has a first side surface and a second side surface.

4 . The light emitting device package according to claim 3 , wherein a width between the first side surface and the second side surface of the cavity is narrower than a maximum width of the metal layer.

5 . The light emitting device package according to claim 2 , wherein the cavity includes a first cavity and a second cavity.

6 . The light emitting device package according to claim 5 , wherein the pad is disposed on a bottom surface of the first cavity.

7 . The light emitting device package according to claim 5 , wherein the light emitting device is disposed on the second cavity.

8 . The light emitting device package according to claim 5 , wherein the first cavity has a step portion.

9 . The light emitting device package according to claim 5 , wherein the second cavity is provided at the bottom surface of the first cavity.

10 . The light emitting device package according to claim 1 , wherein the width of the upper surface of the metal layer is narrower than the width of the lower surface of the metal layer.

11 . The light emitting device package according to claim 1 , wherein the width of the upper surface of the metal layer is wider than the width of the lower surface of the metal layer.

12 . The light emitting device package according to claim 1 , wherein the upper surface of the metal layer has a first part and the first part is provided outwardly from a side surface of the body of the metal layer.

13 . The light emitting device packaged according to claim 9 , wherein the lower surface of the metal layer has a second part and the second part is provided outwardly from the side surface of the body of the metal layer.

14 . The light emitting device packaged according to claim 11 , wherein a width of the first part and a width of the second part are different.

15 . The light emitting device packaged according to claim 1 , wherein a width of a top open region of the cavity is wider than a width of a bottom surface of the cavity.

16 . The light emitting device package according to claim 1 , wherein the electrode has a first portion and a second portion, and the first portion is disposed in the package body and the second portion is disposed under a bottom surface of the package body.

17 . The light emitting device package according to claim 1 , further comprising an adhesive layer disposed between the light emitting device and the package body.

18 . The light emitting device package according to claim 16 , wherein the first portion of the electrode vertically overlaps with the second portion of the electrode.

19 . The light emitting device package according to claim 1 , wherein the pad vertically overlaps with the metal layer.

20 . The light emitting device package according to claim 5 , wherein a height of a top surface of the light emitting device is higher than a height of a top surface of the second cavity.

21 . The light emitting device package according to claim 17 , wherein a height of the bottom surface of the electrode is lower than a height of the bottom surface of the package body.

22 . The light emitting device package according to claim 5 , wherein the pad is spaced apart from an edge of the second cavity.

23 . The light emitting device, package according to claim 1 , wherein the package body includes ceramic material.

24 . A light emitting device package comprising:
a package body including a cavity; a pad disposed at the cavity; a light emitting device disposed on the cavity and electrically connected to the pad; an adhesive layer disposed between the light emitting device and a bottom surface of the cavity; a metal layer inserted into the package body and including a center portion, a first expanded portion and a second expanded portion; and an electrode disposed at the package body, wherein the first expanded portion is disposed at an upper edge of the center portion, wherein the second expanded portion disposed at a lower edge of the center portion, wherein the first expanded portion and the second expanded portion are provided at a same side surface from the center portion, wherein a width of the first expanded portion and a width of the second expanded portion are different, wherein the cavity has a first side surface and a second side surface, and wherein a width between the first side surface and the second side surface of the cavity is narrower than a width of the metal layer.

25 . The light emitting device package according to claim 24 , wherein a portion of the package body is disposed between the adhesive layer and the metal layer.

26 . The light emitting device package according to claim 24 , wherein the center portion of the metal layer has a side surface.

27 . The light emitting device package according to claim 25 , wherein the cavity has a step portion.

28 . The light emitting device package according to claim 25 , wherein the electrode has a first portion and a second portion, and the first portion is disposed in the package body and the second portion disposed under a bottom surface of the package body.

29 . The light emitting device package according to claim 25 , wherein the first portion of electrode vertically overlaps with the second portion of the electrode.

30 . The light emitting device package according to claim 25 , wherein the pad vertically overlaps with the metal layer.

31 . The light emitting device package according to claim 25 , wherein a height of a top surface of the light emitting device is higher than a height of a top surface of the second cavity.

32 . The light emitting device package according to claim 25 , wherein a height of the bottom surface of the electrode is lower than a height of the bottom surface of the package body.

33 . The light emitting device package according to claim 25 , wherein the pad is spaced apart from an edge of the second cavity.

34 . The light emitting device package according to claim 25 , wherein a height of a top surface of the pad is higher than a height of a top surface of the adhesive layer.

35 . The light emitting device package according to claim 25 , wherein the package body includes ceramic material.

36 . The light emitting device package according to claim 25 , wherein the metal layer is disposed under the cavity.

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Byung Mok
• Kang Bo Hee
• Kim Ha Na
• Kodaira Hiroshi
• Tanda Yuichiro
• Ozeki Satoshi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/655

  Fan-out layouts · CPC title

• A61L2/08

  Radiation · CPC title

• A61L2/10

  Ultraviolet [UV] radiation · CPC title

• H10H20/8582

  characterised by their shape · CPC title