Deposition apparatus and deposition method using the same

Patent metadata

Field	Value
Publication number	US-2016207066-A1
Application number	US-201514967053-A
Country	US
Kind code	A1
Filing date	Dec 11, 2015
Priority date	Jan 21, 2015
Publication date	Jul 21, 2016
Grant date	—

Abstract

A deposition apparatus for manufacturing a display device is disclosed. In one aspect, the apparatus includes a substrate fixing portion configured to fix a deposition substrate to a lower portion thereof and a first mask transfer portion placed on one side of the substrate fixing portion and configured to move the deposition mask upwardly such that the deposition mask is formed spaced apart from the deposition substrate by a predetermined distance. The apparatus also includes a substrate transfer portion configured to move the deposition substrate such that the deposition substrate passes over the deposition mask. The apparatus further includes a mask spacing portion positioned on the substrate fixing portion and configured to maintain a substantially uniform distance between the deposition substrate and the deposition mask when the deposition substrate is moved and a deposition source configured to deposit a deposition material on the deposition substrate through the deposition mask.

First claim

What is claimed is:

1 . A deposition apparatus for manufacturing a display device, comprising:
a substrate fixing portion configured to fix a deposition substrate, on which a deposition material is deposited, to a lower portion thereof; a first mask transfer portion placed on one side of the substrate fixing portion and configured to move a deposition mask upwardly such that the deposition mask is formed spaced apart from the deposition substrate by a predetermined distance; a substrate transfer portion configured to move the deposition substrate in a substantially horizontal direction such that the deposition substrate passes over the deposition mask; a mask spacing portion positioned on the substrate fixing portion and configured to maintain a substantially uniform distance between the deposition substrate and the deposition mask when the deposition substrate is moved; and a deposition source configured to deposit a deposition material on the deposition substrate through the deposition mask.

2 . The deposition apparatus of claim 1 , further comprising a first auxiliary substrate formed under the first mask transfer portion and arranged side by side with the deposition substrate.

3 . The deposition apparatus of claim 2 , wherein the first auxiliary substrate is formed of the same material as the deposition substrate.

4 . The deposition apparatus of claim 2 , wherein the first auxiliary substrate is formed between the first mask transfer portion and the deposition mask.

5 . The deposition apparatus of claim 1 , wherein the substrate fixing portion comprises a bipolar electrostatic chuck or a mono-polar electrostatic chuck.

6 . The deposition apparatus of claim 1 , further comprising a second mask transfer portion formed on another side of the substrate fixing portion and configured to move the deposition mask downwardly from the deposition substrate.

7 . The deposition apparatus of claim 6 , wherein the first and second mask transfer portions are respectively located on front and rear sides of the deposition substrate in a movement direction of the deposition substrate.

8 . The deposition apparatus of claim 6 , further comprising a second auxiliary substrate formed under the second mask transfer portion and arranged side by side with the deposition substrate.

9 . The deposition apparatus of claim 8 , wherein the second auxiliary substrate is formed of the same material as the deposition substrate.

10 . The deposition apparatus of claim 6 , wherein the second mask transfer portion comprises a mono-polar electrostatic chuck.

11 . The deposition apparatus of claim 1 , wherein the mask spacing portion is configured to maintain the distance based on magnetic force.

12 . The deposition apparatus of claim 1 , wherein the substrate fixing portion has a larger area than the deposition substrate.

13 . The deposition apparatus of claim 1 , further comprising first and second auxiliary substrates formed on opposing sides of the deposition substrate.

14 . The deposition apparatus of claim 13 , wherein the thicknesses of the first and second auxiliary substrates are substantially the same as that of the deposition substrate.

15 . A deposition method, comprising:
fixing a deposition substrate, on which a deposition material is deposited, to a lower part of a substrate fixing portion; moving a deposition mask, via a first mask transfer portion formed on one side of the substrate fixing portion, to a position under the first mask transfer portion such that the deposition mask is formed spaced apart from the deposition substrate by a predetermined distance; moving the deposition substrate, via the substrate fixing portion, in a substantially horizontal direction such that the deposition substrate passes over the deposition mask; and depositing a deposition material from a deposition source to the deposition substrate through the deposition mask when the deposition mask is moved.

16 . The deposition method of claim 15 , further comprising maintaining, via a mask spacing portion arranged on the substrate fixing portion, a substantially uniform distance between the deposition substrate and the deposition mask when the deposition substrate is moved.

17 . The deposition method of claim 16 , further comprising arranging a first auxiliary substrate side by side with the deposition substrate under the first mask transfer portion.

18 . The deposition method of claim 16 , wherein the substrate fixing portion comprises a bipolar electrostatic chuck or a mono-polar electrostatic chuck.

19 . The deposition method of claim 16 , further comprising moving the deposition mask, via a second mask transfer portion formed on another side of the substrate fixing portion, downwardly from the deposition substrate after the deposition material is deposited to the deposition substrate.

20 . The deposition method of claim 16 , further comprising maintaining, via the mask spacing portion, the distance based on magnetic force.

Assignees

• Samsung Display Co Ltd

Inventors

• Han Jeong Won

Classifications

• H10P50/71

  using masks for conductive or resistive materials · CPC title

• B05D1/32 Primary

  using means for protecting parts of a surface not to be coated, e.g. using stencils, resists · CPC title

• B05C21/005 Primary

  Masking devices (stencils B05C17/06; masking devices for which the means for applying liquids or other fluent material is spraying or is not important B05B12/20) · CPC title

• H10K71/00 Primary

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• C23C14/24

  Vacuum evaporation · CPC title