Systems and methods for loading of a component

Patent metadata

Field	Value
Publication number	US-2016205784-A1
Application number	US-201514595987-A
Country	US
Kind code	A1
Filing date	Jan 13, 2015
Priority date	Jan 13, 2015
Publication date	Jul 14, 2016
Grant date	—

Abstract

In a component loading system, a circuit board may include a socket, a first plurality of holes, and a second plurality of holes. A frame may include two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate, a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls, and a third plurality of holes. A backing plate may include a plurality of heat dissipater mounting posts and a fourth plurality of holes. A plurality of second fasteners may each be mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.

First claim

What is claimed is:

1 . A component loading system, comprising:
a circuit board comprising:
a socket;
a first plurality of holes; and
a second plurality of holes;
a frame comprising:
two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate;
a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls; and
a third plurality of holes;
a backing plate comprising:
a plurality of heat dissipater mounting posts; and
a fourth plurality of holes;
a plurality of first fasteners each mechanically engaged to a respective heat dissipater mounting post passing through a respective one of the third plurality of holes and a respective one of the first plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board; and a plurality of second fasteners each mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.

2 . The component loading system of claim 1 , the sidewalls arranged in relation to each other and the socket in order to mechanically guide a package comprising a processor into the component loading system.

3 . The component loading system of claim 2 , wherein the package comprises a processor/heat dissipater module comprising a processor mechanically coupled to a heat dissipater.

4 . The component loading system of claim 1 , wherein each of the plurality of heat dissipater mounting posts are configured to engage with a respective fastener of a heat dissipater.

5 . The component loading system of claim 1 , further comprising a heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for thermally coupling the heat dissipater to a processor electrically coupled to the socket.

6 . The component loading system of claim 5 , the heat dissipater integral to a processor/heat dissipater module further comprising a processor mechanically coupled to the heat dissipater, and the spring-loaded fasteners each having a spring force providing mechanical loading for electrically mating the processor to the socket.

7 . The component loading system of claim 5 , wherein the processor is mechanically secured to the socket by a wire bale retention mechanism.

8 . A method comprising:
providing a circuit board comprising:
a socket;
a first plurality of holes; and
a second plurality of holes;
providing a frame comprising:
two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate;
a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls; and
a third plurality of holes;
providing a backing plate comprising:
a plurality of heat dissipater mounting posts; and
a fourth plurality of holes; and
mechanically securing the frame and the backplate on opposite sides of the circuit board via:
a plurality of first fasteners each mechanically engaged to a respective heat dissipater mounting post passing through a respective one of the third plurality of holes and a respective one of the first plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board; and
a plurality of second fasteners each mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.

9 . The method of claim 8 , further comprising guiding a package comprising a processor into the component loading system.

10 . The component loading system of claim 9 , wherein the package comprises a processor/heat dissipater module comprising a processor mechanically coupled to a heat dissipater.

11 . The method of claim 8 , further comprising mechanically coupling a heat dissipater to the plurality of heat dissipater mounting posts, each heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for thermally coupling the heat dissipater to a processor electrically coupled to the socket.

12 . The method of claim 11 , further comprising mechanically securing the processor to the socket by a wire bale retention mechanism.

13 . The method of claim 8 , further comprising mechanically coupling a processor/heat dissipater module to the plurality of heat dissipater mounting posts, each heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for electrically mating a processor to the socket.

14 . An information handling system comprising:
a circuit board comprising:
a socket;
a first plurality of holes; and
a second plurality of holes;
a memory communicatively coupled to the socket; a frame comprising:
two opposing sidewalls each substantially perpendicular to a surface of the circuit board coupled to one another via a plate;
a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls; and
a third plurality of holes;
a backing plate comprising:
a plurality of heat dissipater mounting posts; and
a fourth plurality of holes;
a plurality of first fasteners each mechanically engaged to a respective heat dissipater mounting post passing through a respective one of the third plurality of holes and a respective one of the first plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board; and a plurality of second fasteners each mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.

15 . The information handling system of claim 14 , the sidewalls arranged in relation to each other and the socket in order to mechanically guide a package comprising a processor into the component loading system.

16 . The information handling system of claim 15 , wherein the package comprises a processor/heat dissipater module comprising a processor mechanically coupled to a heat dissipater.

17 . The information handling system of claim 14 , wherein each of the plurality of heat dissipater mounting posts are configured to engage with a respective fastener of a heat dissipater.

18 . The information handling system of claim 14 , further comprising a heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for thermally coupling the heat dissipater to a processor electrically coupled to the socket.

Assignees

• Dell Products Lp

Inventors

• Kyle Lawrence A
• Johnson Robert

Classifications

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• H10W40/242

  comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title

• H10W40/235

  attached to package parts · CPC title

• H10W40/231

  characterised by their places of attachment or cooling paths · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title