Surface treated pavement and methods for treating pavement surfaces to improve chip retention

US2016201271A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016201271-A1
Application numberUS-201614987989-A
CountryUS
Kind codeA1
Filing dateJan 5, 2016
Priority dateJan 8, 2015
Publication dateJul 14, 2016
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Surface treated pavement and methods for treating pavement surfaces are provided herein. A method is also provided for treating pavement to improve chip retention. The method includes contacting a surface of the pavement with a bitumen emulsion containing an adhesion modifier to form a layer of bitumen emulsion. Aggregate is applied on the layer of bitumen emulsion. The adhesion modifier includes at least one polymer having a carboxylic acid and/or anhydride functional group, such as oxidized high density polyethylene.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for treating pavement to improve chip retention, wherein the method comprises: contacting a surface of the pavement with a bitumen emulsion comprising an adhesion modifier to form a layer of bitumen emulsion, wherein the adhesion modifier comprises at least one polymer having a functional group, wherein the functional group is selected from the group consisting of carboxylic acid, anhydride or mixtures thereof and applying aggregate on the layer of bitumen emulsion. 2 . The method of claim 1 , wherein the polymer having a functional group is present in an amount in a range of from about 0.5% to about 1.5% by weight of total bitumen. 3 . The method of claim 1 , wherein the polymer having a functional group is selected from the group consisting of oxidized low density polyethylene, oxidized linear low density polyethylene, oxidized medium density polyethylene, oxidized high density polyethylene, maleic anhydride modified polypropylene, maleic anhydride modified polyethylene , ethylene acrylic acid, ethylene methacrylic acid, and mixtures thereof. 4 . The method of claim 3 , wherein the polymer having a functional group is present in an amount of about 0.75% by weight of total bitumen. 5 . The method of claim 1 , wherein the adhesion modifier further comprises a styrene-alkadiene copolymer. 6 . The method of claim 5 , wherein the styrene-alkadiene copolymer is styrene-butadiene-styrene copolymer. 7 . The method of claim 1 , wherein the styrene-alkadiene copolymer is present in an amount in a range of from about 0.5% to about 4% by weight of total bitumen. 8 . The method of claim 1 , wherein chip loss at 35° C. and about 240 minute cure is less than about 5% as measured by ASTM D7000. 9 . The method of claim 8 , wherein the chip loss at 35° C. and about 240 minute cure is less than about 4% as measured by ASTM D7000. 10 . A chip seal method for treating pavement to improve chip retention, wherein the method comprises: contacting the pavement with a bitumen emulsion to form a layer of bitumen emulsion and applying aggregate to the layer of bitumen emulsion, wherein the bitumen emulsion is prepared by combining an adhesion modifier and molten bitumen to form adhesion modified bitumen and emulsifying the adhesion modified bitumen, and wherein the adhesion modifier comprises at least one polymer having a functional group, wherein the functional group is selected from the group consisting of carboxylic acid, anhydride, and/or mixtures thereof. 11 . The method of claim 10 , wherein the polymer having a functional group is present in an amount in a range of from about 0.5% to about 1.5% by weight of total bitumen. 12 . The method of claim 10 , wherein the at least one polymer having a functional group is oxidized high density polyethylene in an amount of about 0.75% by weight of total bitumen. 13 . The method of claim 10 , wherein the modifier further comprises a styrene-alkadiene copolymer. 14 . The method of claim 13 , wherein the styrene-alkadiene copolymer is styrene-butadiene-styrene copolymer. 15 . The method of claim 13 , wherein the styrene-alkadiene copolymer is in an amount in a range of from about 0.5% to about 4% by weight of total bitumen. 16 . The method of claim 9 , wherein chip loss at 35° C. and about 240 minute cure is less than about 5% as measured by ASTM D7000. 17 . The method of claim 16 , wherein the chip loss 35° C. and about 240 minute cure is less than about 4% as measured by ASTM D7000. 18 . A surface treated pavement comprising aggregate bonded to an emulsion residue comprising oxidized high density polyethylene. 19 . The surface treated pavement of claim 18 , wherein the emulsion residue further comprises styrene-butadiene-styrene copolymer. 20 . The surface treated pavement of claim 18 , wherein chip loss at 35° C. and about 240 minute cure is less than about 5% as measured by ASTM D7000.

Assignees

Inventors

Classifications

  • E01C7/358Primary

    with a combination of two or more binders according to groups E01C7/351 - E01C7/356 · CPC title

  • for applying or spreading liquid materials, e.g. bitumen slurries ({E01C19/1054, E01C19/21, } E01C19/45, {E01C19/4813, E01C21/00, } E01C23/02, E01C23/03, {E01C23/065, E01C23/096, E01C23/0973, E01C23/0993} , E01C23/16 take precedence; {spreading-out or smoothing-down means as parts of spraying apparatus E01C19/178}) · CPC title

  • Devices or arrangements for working the finished surface (working freshly laid paving E01C19/42 - E01C19/44, E01C23/02; mining picks E21C35/18); Devices for repairing {or reconditioning} the surface of damaged paving; {Recycling in place or on the road} · CPC title

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What does patent US2016201271A1 cover?
Surface treated pavement and methods for treating pavement surfaces are provided herein. A method is also provided for treating pavement to improve chip retention. The method includes contacting a surface of the pavement with a bitumen emulsion containing an adhesion modifier to form a layer of bitumen emulsion. Aggregate is applied on the layer of bitumen emulsion. The adhesion modifier includ…
Who is the assignee on this patent?
Honeywell Int Inc
What technology area does this patent fall under?
Primary CPC classification E01C7/358. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Thu Jul 14 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).