Copper alloy

Patent metadata

Field	Value
Publication number	US-2016201164-A1
Application number	US-201415024500-A
Country	US
Kind code	A1
Filing date	Sep 26, 2014
Priority date	Sep 26, 2013
Publication date	Jul 14, 2016
Grant date	—

Abstract

A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12≦f1=[Zn]+5×[Sn]−2×[Ni]≦30, 10≦[Zn]−0.3×[Sn]−2×[Ni]≦28, 10≦f3={f1×(32−f1)×[Ni]} 1/2 ≦33, 1.2≦0.7×[Ni]+[Sn]≦4, and 1.4≦[Ni]/[Sn]≦90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an α phase is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% in an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7.

First claim

1 . A copper alloy comprising:
17 mass % to 34 mass % of Zn; 0.02 mass % to 2.0 mass % of Sn; 1.5 mass % to 5 mass % of Ni; and a balance consisting of Cu and unavoidable impurities, wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
12≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,

10≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and

10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦33,

the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
1.2≦0.7×[Ni]+[Sn]≦4, and

1.4≦[Ni]/[Sn]≦90,

conductivity is 13% IACS or more and 25% IACS or less, and in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% of an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix.

2 . A copper alloy comprising:
18 mass % to 33 mass % of Zn; 0.2 mass % to 1.5 mass % of Sn; 1.5 mass % to 4 mass % of Ni; and a balance consisting of Cu and unavoidable impurities, wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
15≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,

12≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and

10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦30,

the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
1.4≦0.7×[Ni]+[Sn]≦3.6, and

1.6≦[Ni]/[Sn]≦12,

conductivity is 14% IACS or more and 25% IACS or less, and a metallographic structure is composed of an α single phase.

3 . A copper alloy comprising:
17 mass % to 34 mass % of Zn; 0.02 mass % to 2.0 mass % of Sn; 1.5 mass % to 5 mass % of Ni; at least one or more selected from 0.003 mass % to 0.09 mass % of P, 0.005 mass % to 0.5 mass % of Al, 0.01 mass % to 0.09 mass % of Sb, 0.01 mass % to 0.09 mass % of As, and 0.0005 mass % to 0.03 mass % of Pb; and a balance consisting of Cu and unavoidable impurities, wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
12≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,

10≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and

10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦33,

the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
1.2≦0.7×[Ni]+[Sn]≦4, and

1.4≦[Ni]/[Sn]≦90,

conductivity is 13% IACS or more and 25% IACS or less, and in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% of an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix.

4 . A copper alloy comprising:
18 mass % to 33 mass % of Zn; 0.2 mass % to 1.5 mass % of Sn; 1.5 mass % to 4 mass % of Ni; 0.003 mass % to 0.08 mass % of P; and a balance consisting of Cu and unavoidable impurities, wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
15≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,

12≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and

10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦30,

the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
1.4≦0.7×[Ni]+[Sn]≦3.6, and

1.6≦[Ni]/[Sn]≦12,

the Ni content [Ni] (mass %) and the P content [P] (mass %) satisfy a relationship of
25≦[Ni]/[P]≦750,

conductivity is 14% IACS or more and 25% IACS or less, and a metallographic structure is composed of an α single phase.

5 . A copper alloy comprising:
17 mass % to 34 mass % of Zn; 0.02 mass % to 2.0 mass % of Sn; 1.5 mass % to 5 mass % of Ni; 0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth metal elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and a balance consisting of Cu and unavoidable impurities, wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
12≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,

10≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and

10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦33,

the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
1.2≦0.7×[Ni]+[Sn]≦4, and

1.4≦[Ni]/[Sn]≦90,

conductivity is 13% IACS or more and 25% IACS or less, and in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% of an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix.

6 . A copper alloy comprising:
17 mass % to 34 mass % of Zn; 0.02 mass % to 2.0 mass % of Sn; 1.5 mass % to 5 mass % of Ni; at least one or more selected from 0.003 mass % to 0.09 mass % of P, 0.005 mass % to 0.5 mass % of Al, 0.01 mass % to 0.09 mass % of Sb, 0.01 mass % to 0.09 mass % of As, and 0.0005 mass % to 0.03 mass % of Pb; 0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth metal elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and a balance consisting of Cu and unavoidable impurities, wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
12≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,

10≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and

10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦33,

the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
1.2≦0.7×[Ni]+[Sn]≦4, and

1.4≦[Ni]/[Sn]≦90,

conductivity is 13% IACS or more and 25% IACS or less, and in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% of an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix.

7 . A copper alloy comprising:
18 mass % to 33 mass % of Zn; 0.2 mass % to 1.5 mass % of Sn; 1.5 mass % to 4 mass % of Ni; 0.003 mass % to 0.08 mass % of P; 0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and a balance consisting of Cu and unavoidable impurities, wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
15≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,

12≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and

10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦30,

the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
1.4≦0.7×[Ni]+[Sn]≦3.6, and

1.6≦[Ni]/[Sn]≦12,

the Ni content [Ni] (mass %) and the P content [P] (mass %) satisfy a relationship of
25≦[Ni]/[P]≦750,

conductivity is 14% IACS or more and 25% IACS or less, and a metallographic structure is composed of an α single phase.

8 . The copper alloy according to claim 1 ,
wherein the copper alloy is applicable to med

Assignees

• Mitsubishi Shindo Kk

Inventors

• Oishi Keiichiro
• Nakasato Yosuke
• Hata Katsuhiko
• Tanaka Shinji

Classifications

• C22C9/04 Primary

  with zinc as the next major constituent · CPC title

• C21D8/02

  during manufacturing of plates or strips (C21D8/12 takes precedence) · CPC title

• B22D21/005

  with high melting point, e.g. Be 1280 degrees C, Ti 1725 degrees C · CPC title

• C21D8/0226

  Hot rolling · CPC title

• C21D8/0273

  Final recrystallisation annealing · CPC title