Sensor package

Patent metadata

Field	Value
Publication number	US-2016200564-A1
Application number	US-201614993738-A
Country	US
Kind code	A1
Filing date	Jan 12, 2016
Priority date	Jan 14, 2015
Publication date	Jul 14, 2016
Grant date	—

Abstract

A sensor package comprises a carrier comprising a through hole, and a sensor chip with a front side and a back side and a recess in the back side. The sensor chip is attached to the carrier with its back side facing the carrier by means of an attachment layer thereby defining a first area of the carrier the sensor chip rests on and a second area of the carrier facing the recess. The through hole is arranged in the first area of the carrier.

First claim

1 . A sensor package, comprising
a carrier comprising a through hole, a sensor chip with a front side and a back side and a recess in the back side,
wherein, by means of an attachment layer, the sensor chip is attached to the carrier with its back side facing the carrier thereby defining a first area of the carrier the sensor chip rests on and a second area of the carrier facing the recess,
wherein the through hole is arranged in the first area of the carrier.

2 . The sensor package of claim 1 ,
wherein the through hole is covered by the attachment layer.

3 . The sensor package of claim 1 ,
comprising cut-outs in the attachment layer for the second area and for the through hole.

4 . The sensor package of claim 1 ,
wherein the through hole is a venting hole for venting a cavity via the attachment layer, which cavity is formed between the sensor chip and the carrier by means of the recess.

5 . The sensor package of claim 4 ,
wherein a distance between the through hole and the cavity is less than 250 μm.

6 . The sensor package of claim 4 ,
comprising a groove in a front side of the carrier which front side faces the back side of the sensor chip, wherein the groove extends from the cavity in direction to the through hole and terminates prior to reaching the through hole.

7 . The sensor package of claim 6 ,
wherein a distance between the through hole and the termination of the groove is less than 250 μm.

8 . The sensor package of claim 1 ,
wherein the attachment layer is a die attach film.

9 . The sensor package of claim 1 ,
wherein the attachment layer is a film coated to the back side of the sensor chip.

10 . The sensor package of claim 1 , comprising
a layer sensitive to an environmental variable, which layer is arranged on or in a portion of the sensor chip above the recess, and a heater for heating the sensitive layer.

11 . The sensor package of claim 1 , comprising
a molding compound at least partially enclosing the sensor chip, an opening in the molding compound providing access to the sensitive layer, a lead frame structure including the carrier and contact pads for electrically contacting the sensor package from the outside, and electrical connections between the sensor chip and the contact pads.

12 . The sensor package of claim 1 ,
wherein a cavity is formed between the sensor chip and the carrier by means of the recess, and wherein the only way to get from the cavity to the through hole is through the attachment layer between the recess and the through hole.

13 . A sensor package, comprising
a carrier comprising a through hole, a sensor chip with a front side and a back side and a recess in the back side,
wherein, by means of an attachment layer, the sensor chip is attached to the carrier with its back side facing the carrier thereby defining a first area of the carrier the sensor chip rests on and a second area of the carrier facing the recess,
wherein the through hole is arranged in the first area of the carrier, and
wherein the through hole is covered by the attachment layer.

14 . A sensor package, comprising
a carrier comprising a through hole, a sensor chip with a front side and a back side and a recess in the back side,
wherein, by means of an attachment layer, the sensor chip is attached to the carrier with its back side facing the carrier thereby defining a first area of the carrier the sensor chip rests on and a second area of the carrier facing the recess,
wherein the through hole is arranged in the first area of the carrier,
wherein a cavity is formed between the sensor chip and the carrier by means of the recess, and
wherein the only way to get from the cavity to the through hole is through the attachment layer between the recess and the through hole.

15 . Method for manufacturing a sensor package, comprising
manufacturing a sensor chip with a front side, a back side and a recess in the back side, manufacturing a through hole in a carrier, attaching the sensor chip with its back side to the carrier by means of an attachment layer such that the through hole is located in a first area of the carrier the sensor chip rests on.

16 . Method according to claim 15 , comprising
manufacturing the sensor chip including the recess in a wafer together with multiple other sensor chips, providing a dicing tape with a die attach film arranged thereon, placing the wafer with its back side onto the die attach film, dicing the wafer including the die attach film into individual sensor chips, picking the sensor chip including the die attach film from the dicing tape and attaching the sensor chip with the die attach film onto the carrier.

17 . Method according to claim 15 ,
manufacturing the sensor chip including the recess in a wafer together with multiple other sensor chips, attaching a coating to a back side of the wafer, placing the wafer with the back side coating onto a dicing tape, dicing the wafer including the back side coating into individual sensor chips, picking the sensor chip including the back side coating from the dicing tape and attaching the sensor chip with the back side coating onto the carrier.

18 . Method according to claim 16 ,
wherein the carrier is integrated in a lead frame providing carriers for multiple sensor chips which carriers are interconnected with each other, wherein multiple sensor chips are attached to assigned carriers of the lead frame by means of the die attach film or the back side coating respectively, wherein a molding compound is applied to the lead frame thereby at least partially enclosing each sensor chip and providing an opening in the molding compound of each sensor chip for granting access to the subject sensitive layer, and dicing the molded lead frame into individual sensor packages.

Assignees

• Sensirion Ag

Inventors

• Pustan David
• Hunziker Werner

Classifications

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W74/10 Primary

  characterised by their shape or disposition · CPC title

• B81B2207/098

  Arrangements not provided for in groups B81B2207/092 - B81B2207/097 · CPC title

• B81B2201/0292

  Sensors not provided for in B81B2201/0207 - B81B2201/0285 · CPC title