Cured ring seal
US-2024390668-A1 · Nov 28, 2024 · US
US2016199638A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016199638-A1 |
| Application number | US-201314911702-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 27, 2013 |
| Priority date | Aug 27, 2013 |
| Publication date | Jul 14, 2016 |
| Grant date | — |
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Official abstract text for this publication.
In one example, an implantable lead includes a substrate and an electrically conductive material disposed on the substrate to form a flexible circuit. The flexible circuit includes a proximal end adapted to electrically connect to an implantable processor, a distal portion adapted to stimulate a cochlear nerve, and a lead body extending from the proximal end to the distal portion, the lead body having a longitudinal axis and comprising a plurality of electrical traces adapted to carry electrical signals from the proximal end to the distal portion. A flag extension is formed in the substrate and extends laterally outward from the lead body longitudinal axis. A method for forming a cochlear lead with a flag extension is also provided.
Opening claim text (preview).
What is claimed is: 1 . An implantable lead comprising: a substrate; and an electrically conductive material disposed on the substrate to form a flexible circuit, the flexible circuit comprising: a proximal end adapted to electrically connect to an implantable processor; a distal portion adapted to stimulate a cochlear nerve; a lead body extending from the proximal end to the distal portion, the lead body having a longitudinal axis and comprising a plurality of electrical traces adapted to carry electrical signals from the proximal end to the distal portion; and a flag extension formed in the substrate and extending laterally outward from the lead body longitudinal axis. 2 . The lead of claim 1 , further comprising flexible encapsulant encapsulating at least a portion of the flexible circuit. 3 . The lead of claim 2 , wherein the flag extension is not encapsulated by the flexible encapsulant. 4 . The lead of claim 2 , wherein the flag extension is encapsulated by the flexible encapsulant. 5 . The lead of claim 1 , wherein the flag extension comprises a through hole for receiving a suture. 6 . The lead of claim 1 , wherein the substrate comprises a thermoplastic. 7 . The lead of claim 6 , wherein the flag extension is thermoformed into a predetermined geometry. 8 . The lead of claim 6 , wherein the substrate further comprises a flexible non-thermoformable material bonded to the thermoplastic. 9 . The lead of claim 1 , wherein the flag extension is adapted to be fixed to tissues proximal to the lead body. 10 . The lead of claim 1 , wherein the flag extension comprises a depth marker adapted to show a target insertion depth of the implantable lead into biological tissue. 11 . The lead of claim 10 , wherein the flag extension comprises a radiopaque material. 12 . The lead of claim 10 , wherein the depth marker is thermoformed to lie flat against tissue at a surgical opening in the cochlea when the electrode array is inserted at the target insertion depth. 13 . A method comprising: forming a flexible circuit by: forming a conductive pattern on a flexible substrate; and cutting the flexible substrate to form a flag extension; and encapsulating the flexible circuit in a flexible body to form an electrode array and a lead body wherein the flag extension extends laterally outward from the lead body. 14 . The method of claim 13 , wherein the flag extension is adapted to be secured to biological tissue. 15 . The method of claim 13 , wherein the flag extension is configured as an insertion depth marker. 16 . The method of claim 13 , wherein the flag is configured to be used as an insertion depth marker and to be secured to biological tissue. 17 . The method of claim 13 , further comprising thermoforming the flexible circuit prior to encapsulating the flexible circuit in the flexible body. 18 . The method of claim 17 , wherein thermoforming the flexible circuit comprises passing a first alignment feature through an aperture in a first flag extension to secure the flexible circuit during thermoforming. 19 . The method of claim 18 , further comprising passing a second alignment feature through an aperture in a second flag extension during thermoforming and then cutting off the second flag extension from the flexible circuit prior to encapsulating the flexible circuit. 20 . An implantable lead comprising: a flexible circuit having a distal end and a longitudinal axis, the flexible circuit comprising: a substrate; and an electrically conductive material disposed on a portion of the substrate forming: an electrode array on the distal end, the electrode array comprising a plurality of electrodes adapted to stimulate a cochlear nerve; and a lead body electrically coupled to the electrode array and extending proximally therefrom; wherein the substrate has at least one flag formed therein, proximal of the electrode array, extending outwardly from the longitudinal axis, and adapted to be affixed to tissue.
Cochlear electrodes · CPC title
Control systems · CPC title
of the outer, middle or inner ear · CPC title
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