Microminiature chainmail interface between skin and a transcutaneous prosthetic device and a method of manufacture

US2016199201A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016199201-A1
Application numberUS-201614996040-A
CountryUS
Kind codeA1
Filing dateJan 14, 2016
Priority dateJan 14, 2015
Publication dateJul 14, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The disclosure describes a direct skeletal attachment (DSA) device including a micro-miniature chainmail skin-to-DSA interface. The interface comprises various porous architectures for skin ingrowth and integration as barriers against pathogens. Failure of skin-to-DSA interfaces can occur due to mismatches in mechanical compliance between pliable skin and more rigid DSA interfaces. To address this problem, in embodiments disclosed herein is an interface having a gradient in mechanical compliance or link mobility, ranging from fully flexible, to less compliant, to rigid where it attaches to the main DSA body.

First claim

Opening claim text (preview).

What is claimed is: 1 . A direct skeletal attachment device comprising: an intramedullary stem adapted to be inserted into a cavity of a bone; a post adapted to interface with a prosthesis; an interface positioned between the post and stem, wherein the interface extends radially from a first end proximate the post and stem to a second end; wherein the interface is rigid at the first end. 2 . The direct skeletal attachment of claim 1 , wherein the interface comprises: a series of interconnected links, wherein the interconnected links form a chainmail scaffolding. 3 . The direct skeletal attachment of claim 2 , wherein an inner diameter of each link of the series of interconnected links increases from the first end to the second end. 4 . The direct skeletal attachment of claim 2 , wherein a thickness of each link of the series of interconnected links decreases from the first end to the second end. 5 . The direct skeletal attachment of claim 2 , wherein the chainmail scaffolding has a porosity gradient. 6 . The direct skeletal attachment of claim 1 , wherein the chainmail is fully dense near the stem and the post. 7 . The direct skeletal attachment of claim 5 , a plurality of pores remain above a minimum pore diameter within the porosity gradient. 8 . The direct skeletal attachment of claim 1 , wherein the interface tapers from mechanically compliant at the second end to rigid at the first end. 9 . The direct skeletal attachment of claim 2 , wherein the links are mobile at the second end and are immobile at the second end. 10 . A method of manufacturing a micro-miniature chainmail based on a model, the method comprising: building a first row of links using an additive manufacturing process; building a second row of links on the first row links using the additive manufacturing process, wherein the first row of links and the second row of links are rigidly attached; building subsequent rows of links using the additive manufacturing process, wherein each subsequent row is rigidly attached to a previously constructed row of links, wherein the first row of links, the second row of links, and the subsequent row of links are based on the model; etching the links to remove the rigid attachment between adjacent links. 11 . The method of claim 10 , wherein the additive manufacturing process is direct metal laser sintering. 12 . The method of claim 10 , wherein dimensions of the chainmail in the model are larger than desired dimensions. 13 . The method of claim 12 , wherein etching the links comprises: submerging the links in an etchant; and removing the links when the links reach the desired dimensions. 14 . The method of claim 12 , wherein etching the links comprises: submerging only a portion of the links in an etchant to create a gradient in dimensions of the links. 15 . The method of claim 10 , wherein the first row of links and the second row of links are rigidly attached by a support structure. 16 . A chainmail created by the method of claim 10 . 17 . A chainmail created by the method of claim 15 .

Assignees

Inventors

Classifications

  • Structures for supporting workpieces or articles during manufacture and removed afterwards · CPC title

  • by chemical means · CPC title

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

  • for connecting limb exoprostheses to the stump bone · CPC title

  • for designing or making customized prostheses, e.g. using templates, finite-element analysis or CAD-CAM techniques · CPC title

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What does patent US2016199201A1 cover?
The disclosure describes a direct skeletal attachment (DSA) device including a micro-miniature chainmail skin-to-DSA interface. The interface comprises various porous architectures for skin ingrowth and integration as barriers against pathogens. Failure of skin-to-DSA interfaces can occur due to mismatches in mechanical compliance between pliable skin and more rigid DSA interfaces. To address t…
Who is the assignee on this patent?
Univ Carnegie Mellon
What technology area does this patent fall under?
Primary CPC classification A61F2/60. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Thu Jul 14 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).