Camera module and electronic apparatus

Patent metadata

Field	Value
Publication number	US-2016198070-A1
Application number	US-201615068779-A
Country	US
Kind code	A1
Filing date	Mar 14, 2016
Priority date	Sep 17, 2013
Publication date	Jul 7, 2016
Grant date	—

Abstract

A camera module includes a lens and an image sensor that converts an image formed by the lens into an electrical signal. The camera module is disposed such that the lens is exposed from an opening in a metal housing. A feeding coil to which a feeding circuit is directly or indirectly connected, is disposed, for example, in a space between the image sensor and the lens in a direction of an optical axis of the lens. The feeding coil is coupled to the metal housing by a magnetic field, so that the metal housing defines and functions as a radiating element for communication.

First claim

What is claimed is:

1 . A camera module comprising:
a lens; and an image sensor that converts an image formed by the lens into an electrical signal; wherein the camera module is disposed such that the lens is exposed from an opening in a conductive housing of an electronic apparatus; the camera module includes a feeding coil to which a feeding circuit is directly or indirectly connected; the camera module further includes a lens holder that holds the lens; wherein the feeding coil is wound around the lens holder about an optical axis of the lens.

2 . The camera module according to claim 1 , wherein the feeding coil is disposed in a space between the image sensor and the lens in a direction of the optical axis of the lens.

3 . The camera module according to claim 1 , further comprising a substrate, and a magnetic sheet provided between the substrate and the feeding coil.

4 . The camera module according to claim 1 , further comprising a substrate provided with the feeding coil wound about the optical axis of the lens.

5 . The camera module according to claim 1 , further comprising a substrate, wherein the feeding coil is a chip component including a conductive winding pattern, and is disposed on the substrate.

6 . A camera module comprising:
a lens; and an image sensor that converts an image formed by the lens into an electrical signal; wherein the camera module is disposed such that the lens is exposed from an opening in a conductive housing of an electronic apparatus; the camera module includes a feeding coil to which a feeding circuit is directly or indirectly connected; the camera module further includes a cable including a plurality of signal lines, the cable being connected at a first end thereof to a circuit on a side of the image sensor and connected at a second end thereof to a circuit on a side of the electronic apparatus, the second end being opposite the first end; the feeding coil is connected to at least one of the plurality of signal lines of the cable.

7 . The camera module according to claim 6 , wherein the feeding coil is disposed in a space between the image sensor and the lens in a direction of an optical axis of the lens.

8 . The camera module according to claim 6 , further comprising a substrate provided with the feeding coil wound about an optical axis of the lens.

9 . The camera module according to claim 6 , further comprising a substrate, wherein the feeding coil is a chip component including a conductive winding pattern, and is provided with the substrate.

10 . An electronic apparatus comprising:
a conductive housing including an opening; and a camera module including a lens and an image sensor that converts an image formed by the lens into an electrical signal; wherein the camera module is disposed such that the lens is exposed from the opening; the camera module includes a feeding coil to which a feeding circuit is directly or indirectly connected; electromagnetic field coupling between the housing and the feeding coil causes the housing to define and function as a radiating element for wireless communication; the camera module further includes a lens holder that holds the lens; and the feeding coil is wound around the lens holder about an optical axis of the lens, and the feeding coil is disposed in a region extending from an inside to an outside of the housing.

11 . The electronic apparatus according to claim 10 , wherein the feeding coil is disposed in a space between the image sensor and the lens in a direction of the optical axis of the lens.

12 . The electronic apparatus according to claim 10 , further comprising a substrate, and a magnetic sheet provided between the substrate and the feeding coil.

13 . The electronic apparatus according to claim 10 , further comprising a substrate provided with the feeding coil wound about the optical axis of the lens.

14 . The electronic apparatus according to claim 10 , further comprising a substrate, wherein the feeding coil is a chip component including a conductive winding pattern, and is disposed on the substrate.

15 . An electronic apparatus comprising:
a conductive housing including an opening; and a camera module including a lens and an image sensor that converts an image formed by the lens into an electrical signal; wherein the camera module is disposed such that the lens is exposed from the opening; the camera module includes a feeding coil to which a feeding circuit is directly or indirectly connected; and electromagnetic field coupling between the housing and the feeding coil causes the housing to define and function as a radiating element for wireless communication; the electronic apparatus further includes a coupling coil coupled to the feeding coil by a magnetic field; the feeding coil is indirectly connected to the feeding circuit by the coupling coil.

16 . The electronic apparatus according to claim 15 , wherein the feeding coil is disposed in a space between the image sensor and the lens in a direction of an optical axis of the lens.

17 . The electronic apparatus according to claim 15 , further comprising a substrate provided with the feeding coil wound about an optical axis of the lens.

18 . The electronic apparatus according to claim 15 , further comprising a substrate, wherein the feeding coil is a chip component including a conductive winding pattern, and is provided with the substrate.

Assignees

• Murata Manufacturing Co

Inventors

• Nakano Shinichi
• Ishino Satoshi

Classifications

• H01F38/14 Primary

  Inductive couplings {(for wireless supply or distribution of electric power using inductive coupling H02J50/10)} · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/51 Primary

  Housings · CPC title

• H01F27/2804

  Printed windings · CPC title